公开(公告)号：EP1565047A1

公开(公告)日：2005-08-17

申请号：EP05075212.0

申请日：2005-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Post, Scott E. ,  Cheok, Cheng Gek, c/o 700 Lorong 1-Toa Payoh ,  Stillabower, Morris D. ,  Nah, Chih Kai ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K3/34

CPC classification number: H05K1/112 ,  H05K3/3442 ,  H05K2201/09572 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic package (10) is provided having a surface mount electronic device (40) connected to a circuit board (12). The package (10) includes a circuit board (12) and a surface mount electronic device (40). A mounting pad (28) is formed on the circuit board (12). A plurality of vias (30) are formed each having an opening extending into the circuit board (12) and extending through the mounting pad (28). The package (10) further includes a solder joint (32) connecting a contact terminal (42) of the surface mount device (40) to the mounting pad (28) on the circuit board (12). The solder joint (32) extends at least partially into the openings in each of the plurality of vias (30) to support the arrangement of the surface mount device (40) on the circuit board (12).

Abstract translation: 提供具有连接到电路板（12）的表面安装电子装置（40）的电子封装（10）。 封装（10）包括电路板（12）和表面贴装电子器件（40）。 在电路板（12）上形成安装垫（28）。 形成多个通孔（30），每个通孔具有延伸到电路板（12）中并延伸穿过安装垫（28）的开口。 封装（10）还包括将表面安装器件（40）的接触端子（42）连接到电路板（12）上的安装焊盘（28）的焊接接头（32）。 焊接接头（32）至少部分地延伸到多个通孔（30）中的每一个中的开口中，以支撑表面安装器件（40）在电路板（12）上的布置。