公开(公告)号：EP2088841A2

公开(公告)日：2009-08-12

申请号：EP09151465.3

申请日：2009-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Fang, Ching Meng ,  Chow, Kin Yean ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K5/00 ,  H05K5/06

CPC classification number: H05K3/284 ,  H05K5/0034 ,  H05K5/064 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.

Abstract translation: 一种改进的包覆成型电子组件包括背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，其与电子部件一起限定电路装置，电连接器 ，电连接器的热塑性壁构件的外侧上的金属环和包覆成型体。 金属环围绕电连接器的外部连接器引脚，并且包覆模体与电连接器的背板和热塑性壁构件一起密封地包围电路基板和限定在基板上的电路装置，其中包覆模体具有周边边缘 与金属环粘合。 本发明避免了与不包含金属环的类似装置相关联的分层问题。

公开(公告)号：EP1926182A2

公开(公告)日：2008-05-28

申请号：EP07120979.5

申请日：2007-11-19

Applicant: Delphi Technologies, Inc.

Inventor： Chow, Kin Yean ,  Fang, Ching Meng ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H01R13/52

CPC classification number: H01R13/5202 ,  H01R13/6658 ,  H01R43/24 ,  H05K5/0034 ,  H05K5/065

Abstract: A partially overmolded component (38) having a precisely defined overmolding edge (48) includes a component (44) having a protruding elongate rib (52) and the overmolding having a terminal edge abutting the protruding elongate rib. The rib defines surfaces that provide a greater area of contact between the component and an overmolding tool (24) and a more tortuous flow path to bleed-through.

Abstract translation: 具有精确限定的包覆成型边缘（48）的部分包覆模制的部件（38）包括具有突出的细长肋（52）的部件（44），并且所述包覆成型具有邻接突出细长肋的末端边缘。 所述肋限定了在所述部件和包覆成型工具（24）之间提供更大的接触面积的表面和更弯曲的流动路径以渗透。

公开(公告)号：EP1926182A3

公开(公告)日：2011-05-18

申请号：EP07120979.5

申请日：2007-11-19

Applicant: Delphi Technologies, Inc.

Inventor： Chow, Kin Yean ,  Fang, Ching Meng ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H01R13/52 ,  H05K5/06 ,  H05K5/00

CPC classification number: H01R13/5202 ,  H01R13/6658 ,  H01R43/24 ,  H05K5/0034 ,  H05K5/065

Abstract: A partially overmolded component (38) having a precisely defined overmolding edge (48) includes a component (44) having a protruding elongate rib (52) and the overmolding having a terminal edge abutting the protruding elongate rib. The rib defines surfaces that provide a greater area of contact between the component and an overmolding tool (24) and a more tortuous flow path to bleed-through.

公开(公告)号：EP1523040A3

公开(公告)日：2007-04-18

申请号：EP04077702.1

申请日：2004-09-30

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W.

IPC: H01L25/065 ,  H01L23/367 ,  H01L23/427

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a first surface, solder bumps (14) on the first surface, and a second surface oppositely disposed from the first surface. The flip chip (12) is mounted to the substrate (16) such that the solder bumps (14) are registered with the conductors on the substrate (16). The package (10) further includes a stamped metal heat sink (30) in heat transfer relationship with the second surface of the flip chip (12). The heat sink (30) includes a cavity (32) formed adjacent to the flip chip (12) containing a thermally conductive material (34).

公开(公告)号：EP1686844A2

公开(公告)日：2006-08-02

申请号：EP06075075.9

申请日：2006-01-12

Applicant: Delphi Technologies, Inc.

Inventor： Mandel, Larry M. ,  Laudick, David A.

IPC: H05K7/20

CPC classification number: H05K5/065 ,  H05K3/284 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: An overmolded electronic assembly (100) includes a substrate (104), a plurality of surface mount technology (SMT) integrated circuit (IC) chips (106), a plurality of heat sinks (114), a backplate (102) and an overmold material (120). The substrate (104) includes a plurality of conductive traces formed on a first surface of the substrate (104). The IC chips (106) each include an active front side and a backside and the IC chips (106) are electrically coupled to one or more of the traces. The heat sinks (114) are each in thermal contact with the backside of a different one of the IC chips (106) and are independent of each other. The backplate (102) is attached to a second surface of the substrate (104), which is opposite the first surface of the substrate (104). The overmold material (120) covers the first surface of the substrate (104) and maintains the heat sinks (114) in thermal contact with an associated one of the IC chips (106).

Abstract translation: 包覆成型的电子组件（100）包括衬底（104），多个表面贴装技术（SMT）集成电路（IC）芯片（106），多个散热器（114），背板（102）和包覆模制 材料（120）。 衬底（104）包括形成在衬底（104）的第一表面上的多个导电迹线。 IC芯片（106）各自包括有源正面和背面，并且IC芯片（106）电耦合到一个或多个迹线。 散热器（114）各自与IC芯片（106）的不同的一个的背面热接触，并且彼此独立。 背板（102）附接到基板（104）的与基板（104）的第一表面相对的第二表面。 包覆成型材料（120）覆盖衬底（104）的第一表面并且保持散热器（114）与相关的一个IC芯片（106）热接触。

公开(公告)号：EP1566992A2

公开(公告)日：2005-08-24

申请号：EP05075327.6

申请日：2005-02-10

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Degenkolb, Thomas A. ,  Mandel, Larry M. ,  Parker, Richard D.

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K1/0271 ,  H05K2201/10189 ,  H05K2203/1316

Abstract: An electronic assembly (100) and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board (102) of the electronic assembly (100) when the electronic assembly (100) is overmolded.

Abstract translation: 具有相关联的连接器和/或模具（120/122）的电子组件（100）被构造成减少和/或在电子组件（100）相关联的印刷电路板（102）偏转和引发的损坏部件当 电子组件（100）被包覆模制。

公开(公告)号：EP1523040B1

公开(公告)日：2018-08-29

申请号：EP04077702.1

申请日：2004-09-30

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W.

IPC: H01L25/065 ,  H01L23/367 ,  H01L23/427 ,  H01L23/42 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a first surface, solder bumps (14) on the first surface, and a second surface oppositely disposed from the first surface. The flip chip (12) is mounted to the substrate (16) such that the solder bumps (14) are registered with the conductors on the substrate (16). The package (10) further includes a stamped metal heat sink (30) in heat transfer relationship with the second surface of the flip chip (12). The heat sink (30) includes a cavity (32) formed adjacent to the flip chip (12) containing a thermally conductive material (34).

公开(公告)号：EP2088841A3

公开(公告)日：2012-08-15

申请号：EP09151465.3

申请日：2009-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Fang, Ching Meng ,  Chow, Kin Yean ,  Mandel, Larry M. ,  Yong, Sim Ying

IPC: H05K5/00 ,  H05K5/06 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K5/0034 ,  H05K5/064 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.

公开(公告)号：EP1686844A3

公开(公告)日：2010-03-03

申请号：EP06075075.9

申请日：2006-01-12

Applicant: Delphi Technologies, Inc.

Inventor： Mandel, Larry M. ,  Laudick, David A.

IPC: H05K7/20 ,  H01L23/433 ,  H01L23/31

CPC classification number: H05K5/065 ,  H05K3/284 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: An overmolded electronic assembly (100) includes a substrate (104), a plurality of surface mount technology (SMT) integrated circuit (IC) chips (106), a plurality of heat sinks (114), a backplate (102) and an overmold material (120). The substrate (104) includes a plurality of conductive traces formed on a first surface of the substrate (104). The IC chips (106) each include an active front side and a backside and the IC chips (106) are electrically coupled to one or more of the traces. The heat sinks (114) are each in thermal contact with the backside of a different one of the IC chips (106) and are independent of each other. The backplate (102) is attached to a second surface of the substrate (104), which is opposite the first surface of the substrate (104). The overmold material (120) covers the first surface of the substrate (104) and maintains the heat sinks (114) in thermal contact with an associated one of the IC chips (106).

公开(公告)号：EP1705969A2

公开(公告)日：2006-09-27

申请号：EP06075073.4

申请日：2006-01-11

Applicant: Delphi Technologies, Inc.

Inventor： Mandel, Larry M. ,  Garner, Timothy D. ,  Baker, Andrew R.

IPC: H05K3/00

CPC classification number: B30B5/02 ,  B30B15/024 ,  B30B15/065 ,  H01L24/75 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/758 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/386 ,  H05K2203/0278 ,  H05K2203/068 ,  H01L2924/00

Abstract: An electronic assembly (100) includes a backplate (102), a substrate (106) and a pressure sensitive adhesive (PSA) (104). The backplate (102) includes a cavity (103) and the substrate (106) includes a plurality of interconnected electrical components (107). The substrate (106) is positioned within the cavity (103) and a wall height of the cavity (103) is greater than a combined thickness of the substrate (106) and the adhesive (104), which bonds the substrate (106) to the backplate (102).

Abstract translation: 电子组件（100）包括背板（102），基板（106）和压敏粘合剂（PSA）（104）。 背板（102）包括空腔（103），并且基板（106）包括多个互连的电气部件（107）。 衬底（106）被定位在空腔（103）内并且空腔（103）的壁高度大于衬底（106）和粘合剂（104）的组合厚度，其将衬底（106）接合到 背板（102）。