LIQUID SUPPLYING DEVICE AND LIQUID SUPPLYING METHOD

    公开(公告)号:US20190270125A1

    公开(公告)日:2019-09-05

    申请号:US16419525

    申请日:2019-05-22

    Abstract: The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

    SUBSTRATE CLEANING APPARATUS AND METHOD EXECUTED IN THE SAME
    14.
    发明申请
    SUBSTRATE CLEANING APPARATUS AND METHOD EXECUTED IN THE SAME 有权
    基板清洗装置和方法

    公开(公告)号:US20150338328A1

    公开(公告)日:2015-11-26

    申请号:US14717976

    申请日:2015-05-20

    Abstract: A substrate cleaning apparatus 1 includes a cleaning member 2 that abuts on a substrate W to scrub and clean the substrate W, a holding member 6 that holds the cleaning member 2, an air cylinder 8 that generates force to press the cleaning member 2 against the substrate W, a displacement sensor 9 that measures a position of the holding member 6, and a control device 11 that determines the replacement time of the cleaning member 2 based on the position of the holding member 6. The position of the holding member 6 includes a cleaning position and a non-cleaning position. The control device 11 determines the replacement time of the cleaning member 2 from change in the cleaning position while a plurality of substrates W are continuously scrubbed and cleaned.

    Abstract translation: 基板清洗装置1包括:与基板W抵接以清洁基板W的清洁部件2,保持清扫部件2的保持部件6;产生用于将清扫部件2按压的力的气缸8 基板W,测量保持构件6的位置的位移传感器9以及基于保持构件6的位置确定清洁构件2的更换时间的控制装置11.保持构件6的位置包括 清洁位置和非清洁位置。 控制装置11根据清洁位置的变化来确定清洁部件2的更换时间,同时多个基板W被连续地清洗和清洁。

    CHEMICAL SUPPLY APPARATUS, CLEANING SYSTEM, AND CHEMICAL SUPPLY METHOD

    公开(公告)号:US20230249145A1

    公开(公告)日:2023-08-10

    申请号:US18165407

    申请日:2023-02-07

    CPC classification number: B01F35/2211 B08B3/02 B01F2101/24

    Abstract: The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.
    A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.

    JIG AND INSTALLATION METHOD USING SAME JIG
    17.
    发明申请

    公开(公告)号:US20200009702A1

    公开(公告)日:2020-01-09

    申请号:US16454719

    申请日:2019-06-27

    Abstract: A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

    CLEANING SECTION TRANSFER ROBOT FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE TRANSFER METHOD

    公开(公告)号:US20190393071A1

    公开(公告)日:2019-12-26

    申请号:US16451442

    申请日:2019-06-25

    Inventor: Junji KUNISAWA

    Abstract: A cleaning section transfer robot includes a base, a rotary table, a first motor, a first substrate transfer mechanism including a second motor having a common rotation axis with the first motor, a first arm, a third motor, a second arm, a fourth motor, and a first hand, and a second substrate transfer mechanism including a fifth motor having a common rotation axis with the first motor, a third arm, a sixth motor, a fourth arm, a seventh motor, and a second hand. Each of the first arm, the second arm, the third arm, the fourth arm, the first hand, and the second hand extends in a direction perpendicular to the rotation axis of the first motor, and each of the third motor, the fourth motor, the sixth motor, and the seventh motor has a rotation axis parallel to the rotation axis of the first motor.

    CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20190157118A1

    公开(公告)日:2019-05-23

    申请号:US16321179

    申请日:2018-02-15

    Abstract: A cleaning apparatus includes a plurality of processing units including a cleaning unit which cleans a processing object, a transport chamber provided between the plurality of processing units, a transport robot provided inside the transport chamber so as to be movable vertically, an exhaust port portion which discharges gas compressed, when the transport robot descends, from a lower portion of the transport chamber, and a liquid remaining unit which causes liquid transported to the compressed gas to remain in the lower portion of the transport chamber.

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