公开(公告)号：US20190270125A1

公开(公告)日：2019-09-05

申请号：US16419525

申请日：2019-05-22

Applicant: Ebara Corporation

Inventor： Fujihiko TOYOMASU ,  Junji KUNISAWA

IPC: B08B3/08 ,  G05D7/06 ,  H01L21/67 ,  B24B37/00 ,  F16K37/00 ,  G05D11/13

Abstract: The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

公开(公告)号：US20180281026A1

公开(公告)日：2018-10-04

申请号：US15942734

申请日：2018-04-02

Applicant: Ebara Corporation

Inventor： Fujihiko TOYOMASU ,  Junji KUNISAWA

IPC: B08B3/08 ,  H01L21/67 ,  G05D7/06

CPC classification number: B08B3/08 ,  B24B37/00 ,  F15B2211/50554 ,  F15B2211/57 ,  F16K37/0091 ,  G05D7/0635 ,  G05D11/132 ,  H01L21/67017 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/67253 ,  Y10T137/7759 ,  Y10T137/7761

Abstract: The present invention provides a liquid supplying device that can determine whether a CLC can be used appropriately. A liquid supplying device for supplying a liquid from a liquid source to a cleaning device is provided. The liquid supplying device includes a flow rate control device that measures a flow rate of a liquid from the liquid source and controls the flow rate based on the measured value, an IN-side pressure gauge provided between the liquid source and the flow rate control device and an OUT-side pressure gauge provided between the flow rate control device and the cleaning device.

公开(公告)号：US20140216505A1

公开(公告)日：2014-08-07

申请号：US14080685

申请日：2013-11-14

Applicant: EBARA CORPORATION

Inventor： Fujihiko TOYOMASU ,  Toru MARUYAMA ,  Mitsunori KOMATSU

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67051

Abstract: A substrate cleaning apparatus includes: a pure water supply line provided with a pure water flow regulator and a pure water supply valve; chemical supply lines each provided with a chemical flow regulator and a chemical supply valve; a merging line where pure water and a plurality of liquid chemicals meet to form a cleaning liquid; a cleaning liquid supply line configured to supply the cleaning liquid to a substrate; and a controller configured to control the pure water flow regulator, the pure water supply valve, the chemical flow regulators, and the chemical supply valves such that the pure water and the plurality of liquid chemicals are present at a predetermined ratio at a meeting point.

Abstract translation: 基板清洗装置包括：纯水供给管线，设有纯水流量调节器和纯净水供给阀; 化学品供应管路各设有化学流量调节器和化学品供应阀门; 合并线，其中纯水和多种液体化学品相遇以形成清洁液体; 清洗液供给管线，构成为将清洗液供给到基板; 以及控制器，其被配置为控制纯水流量调节器，纯净水供应阀，化学流量调节器和化学品供应阀，使得纯水和多个液体化学品在一个会合点处以预定比率存在。

公开(公告)号：US20230249145A1

公开(公告)日：2023-08-10

申请号：US18165407

申请日：2023-02-07

Applicant: EBARA CORPORATION

Inventor： Fujihiko TOYOMASU ,  Junji KUNISAWA ,  Kenichiro SAITO

IPC: B01F35/221 ,  B08B3/02

CPC classification number: B01F35/2211 ,  B08B3/02 ,  B01F2101/24

Abstract: The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles.
A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.

公开(公告)号：US20170117165A1

公开(公告)日：2017-04-27

申请号：US15128309

申请日：2015-03-17

Applicant: EBARA CORPORATION

Inventor： Junji KUNISAWA ,  Toru MARUYAMA ,  Masayoshi IMAI ,  Koji MAEDA ,  Mitsuru MIYAZAKI ,  Teruaki HOMBO ,  Fujihiko TOYOMASU

IPC: H01L21/67 ,  B08B9/027 ,  B08B3/08 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B9/027 ,  H01L21/02052 ,  H01L21/67046 ,  H01L21/68728

Abstract: The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.

公开(公告)号：US20150357208A1

公开(公告)日：2015-12-10

申请号：US14730584

申请日：2015-06-04

Applicant: EBARA CORPORATION

Inventor： Fujihiko TOYOMASU ,  Toru MARUYAMA ,  Junji KUNISAWA

IPC: H01L21/67 ,  B01F3/08 ,  B01F15/00

CPC classification number: H01L21/67051 ,  B01F3/088 ,  H01L21/67017

Abstract: A cleaning chemical supplying device, a cleaning chemical supplying method, and a cleaning unit capable of flexibly handling a change of a dilution ratio and suppression of an increase of a device size are provided.A cleaning chemical supplying device has a first in-line mixer 72 for supplying a first cleaning chemical to a cleaning device 200, a second in-line mixer 73 for supplying a second cleaning chemical to the substrate cleaning device 200, a first chemical CLC box 120 for controlling a flow rate of the first chemical supplied to the first in-line mixer 72, a second chemical CLC box 130 for controlling a flow rate of the second chemical supplied to the second in-line mixer 73, and a DIWCLC box 110 for controlling a flow rate of dilution water supplied to the first in-line mixer 72 or the second in-line mixer 73 and is configured such that a supply destination of the dilution water is switched from the first in-line mixer 72 to the second in-line mixer 73 or from the second in-line mixer 73 to the first in-line mixer 72.

Abstract translation: 提供一种清洁化学品供给装置，清洁化学品供应方法和能够灵活地处理稀释比的变化并抑制装置尺寸增加的清洁单元。 清洗化学品供给装置具有用于将第一清洁化学品供给到清洁装置200的第一在线混合器72，用于向基板清洗装置200供给第二清洗化学品的第二在线混合器73，第一化学CLC箱 120，用于控制供应到第一在线混合器72的第一化学品的流量;第二化学CLC箱130，用于控制供应到第二在线混合器73的第二化学品的流量;以及DIWCLC箱110 用于控制供应到第一在线混合器72或第二在线混合器73的稀释水的流量，并且构造成使得稀释水的供应目的地从第一在线混合器72切换到第二在线混合器72。 在线混频器73或从第二在线混频器73到第一在线混频器72。