MEMS HYBRID STRUCTURE HAVING FLIPPED SILICON WITH EXTERNAL STANDOFFS
    11.
    发明申请
    MEMS HYBRID STRUCTURE HAVING FLIPPED SILICON WITH EXTERNAL STANDOFFS 审中-公开
    具有外部标准的溜槽硅的MEMS混合结构

    公开(公告)号:WO2003032402A1

    公开(公告)日:2003-04-17

    申请号:PCT/US2002/032400

    申请日:2002-10-08

    CPC classification number: B81B3/0086

    Abstract: A structure of a hybrid MEMS structure is provided wherein a plate comprises a thin actuatable layer of conductive silicon, such as a MEMS actuatable element, and a thicker handle layer of conductive silicon to provide structural integrity which are separated by a thin oxide, together forming an SOI wafer. This plate is mounted to a substrate, typically ceramic, with the thin actuatable layer facing the substrate and separated by an air gap that is formed by creating, on the substrate, insulator standoffs which come in contact with the plate. A suitable dielectric material useful as a standoff on the substrate is a footrest that permits high aspect ratios.

    Abstract translation: 提供了混合MEMS结构的结构,其中板包括导电硅的薄可致动层,例如MEMS可致动元件,以及较厚的导电硅手柄层,以提供由薄氧化物隔开的结构完整性,一起形成 SOI晶片。 该板被安装到通常为陶瓷的基板上,薄的可致动层面向基板,并由通过在基板上产生与板接触的绝缘体间隙而形成的气隙分开。 用作衬底上的支座的合适的介电材料是允许高纵横比的搁脚板。

    CHARGING GUARD WITH PASCHEN STACKING
    14.
    发明公开
    CHARGING GUARD WITH PASCHEN STACKING 有权
    帕邢堆垛货物保护的

    公开(公告)号:EP2089753A2

    公开(公告)日:2009-08-19

    申请号:EP07864335.0

    申请日:2007-11-13

    CPC classification number: G02B26/0841

    Abstract: A MEMS-based mirror is provided with trenches between adjacent electrodes in order to be able to withstand relatively high applied voltages, and thus has a substantially reduced exposure to uncontrolled surface potentials. The MEMS-based mirror, thus avoids voltage drifts and has an improved mirror position stability. The trench dimensions are selected such that the voltage applied between each adjacent pair of electrodes stays within predefined limits. An insulating layer, such as silicon dioxide, electrically isolates each pair of adjacent electrodes. Each insulting layer extends partially above an associated trench and is characterized by the same height and width dimensions.

    METHOD AND APPARATUS FOR LOCALIZED BONDING
    15.
    发明公开
    METHOD AND APPARATUS FOR LOCALIZED BONDING 审中-公开
    方法和装置用于局部粘结

    公开(公告)号:EP2082418A2

    公开(公告)日:2009-07-29

    申请号:EP07864340.0

    申请日:2007-11-13

    Abstract: One or more cavities are formed in the bonding surfaces of one, all, or some of the elements to be bonded. These cavities serve as receptacles for the bonding material and are where the bonds are localized. The cavities are of sufficient size and shape so that their volume is greater than the volume of bonding material forming the bond. This ensures that when the elements are brought into contact with one another to mate, the bonding material, which can flow prior to solidifying into a bond, will flow into the cavities and will not impede the separation of the parts. This allows the parts to be mated with nominally zero separation. Once solidified, the bonding material forms a localized bond inside each cavity. Different cavity shapes, such as, rectangular, circular, or any other shape that can be injected or filled with adhesive material may be used.

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