Abstract:
An array apparatus has a micromachined SOI structure (22), such as a MEMS array, mounted directly on a class of substrate (24), such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes (26-29) disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes (26-29) are configured for substantial fanout and the electrodes (26-29) are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias (36-37) within a tolerance of position relative to electrodes (26-29) such that contact is not lost therebetween at the time of manufacturing.
Abstract:
In an array apparatus, each MEMS element, comprising an actuatable element and a supportive handle, is mounted over a plurality of electrodes (26, 27) wherein an air gap is controlled by the thickness of the electrodes and not primarily by the structure of the handle (20). The structure of electrostatic actuation electrodes in specific embodiments is disclosed. While the invention is primarily a technique for reducing the air gap (52) without unduly limiting the thickness of the handle, the invention may also be used to establish an air gap greater than the thickness of the handle.
Abstract:
A structure of a hybrid MEMS structure is provided wherein a plate comprises a thin actuatable layer of conductive silicon, such as a MEMS actuatable element, and a thicker handle layer of conductive silicon to provide structural integrity which are separated by a thin oxide, together forming an SOI wafer. This plate is mounted to a substrate, typically ceramic, with the thin actuatable layer facing the substrate and separated by an air gap that is formed by creating, on the substrate, insulator standoffs which come in contact with the plate. A suitable dielectric material useful as a standoff on the substrate is a footrest that permits high aspect ratios.