公开(公告)号：DE60117811T2

公开(公告)日：2006-08-31

申请号：DE60117811

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B3/00 ,  H01H1/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02

公开(公告)号：AT319652T

公开(公告)日：2006-03-15

申请号：AT01959574

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： NEWTON CHARLES ,  RUMPF RAYMOND ,  GAMLEN CAROL

IPC: B81B3/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02 ,  H01H1/00

公开(公告)号：AU2595202A

公开(公告)日：2002-07-01

申请号：AU2595202

申请日：2001-12-10

Applicant: HARRIS CORP

Inventor： PIKE RANDY T ,  NEWTON CHARLES M ,  GAMLEN CAROL ,  RUMPF RAYMOND C ,  O'DOWD BETTY

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/427 ,  H01L23/473 ,  H01L21/58

Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

公开(公告)号：CA2417352A1

公开(公告)日：2002-02-14

申请号：CA2417352

申请日：2001-08-04

Applicant: HARRIS CORP

Inventor： GAMLEN CAROL ,  RUMPF RAYMOND ,  NEWTON CHARLES

IPC: B81B3/00 ,  H01H59/00 ,  H01P1/12 ,  H05K1/09 ,  H05K3/02 ,  H01H1/00

Abstract: A microelectromechanical structure having a ceramic substrate formed from lo w temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.