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公开(公告)号：US10893630B2
公开(公告)日：2021-01-12
申请号：US15883230
申请日：2018-01-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Harvey Lunsman , Steven Dean , Michael Scott
Abstract: Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.
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公开(公告)号：US10813253B2
公开(公告)日：2020-10-20
申请号：US15834636
申请日：2017-12-07
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Harvey Lunsman , Steven Dean , Michael Scott
IPC: H05K7/20
Abstract: Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.
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公开(公告)号：US20190239387A1
公开(公告)日：2019-08-01
申请号：US15883230
申请日：2018-01-30
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Harvey Lunsman , Steven Dean , Michael Scott
CPC classification number: H05K7/20272 , F28F2250/08 , G06F1/206 , G06F2200/201 , H05K7/20281
Abstract: Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.
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公开(公告)号：US20250048595A1
公开(公告)日：2025-02-06
申请号：US18362358
申请日：2023-07-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Michael Scott , Steven Dean
IPC: H05K7/20
Abstract: Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.
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公开(公告)号：US20240040748A1
公开(公告)日：2024-02-01
申请号：US17815296
申请日：2022-07-27
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Steven Dean
CPC classification number: H05K7/2039 , H05K1/0203
Abstract: Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component. Each beam includes a first end portion, a second end portion, and a body portion extended between the first and second end portions. The first end portion of each of one or more beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of the removable circuit device.
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Patent Agency Ranking
公开(公告)号：US20220091642A1
公开(公告)日：2022-03-24
申请号：US17030677
申请日：2020-09-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey J. Lunsman , Steven Dean , John Franz , Brady Dulian
Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.
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公开(公告)号：US20210109574A1
公开(公告)日：2021-04-15
申请号：US16653335
申请日：2019-10-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John Franz , Robert Mascia , Harvey Lunsman , Steven Dean , Michael Scott
Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
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公开(公告)号：US20190182988A1
公开(公告)日：2019-06-13
申请号：US15834636
申请日：2017-12-07
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Harvey Lunsman , Steven Dean , Michael Scott
IPC: H05K7/20
CPC classification number: H05K7/20781 , H05K7/20254 , H05K7/20272 , H05K7/20281 , H05K7/20772 , H05K7/20836
Abstract: Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.
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公开(公告)号：US12038618B2
公开(公告)日：2024-07-16
申请号：US17867862
申请日：2022-07-19
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Harvey John Lunsman , Steven Dean
CPC classification number: G02B6/4269 , H05K7/20254 , H05K7/2049 , H05K7/20409
Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.
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公开(公告)号：US11740674B2
公开(公告)日：2023-08-29
申请号：US17656684
申请日：2022-03-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Torsten Wilde , Andy Warner , Steven Dean , Steven Martin , Pat Donlin
IPC: G06F1/32 , G06F1/3203 , G06F1/30 , H04L41/0833 , G06Q50/06 , G06F9/50 , G06F1/3287
CPC classification number: G06F1/3203 , G06F1/30 , G06F9/5094 , G06Q50/06 , H04L41/0833 , G06F1/3287
Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.
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