公开(公告)号：DE2555257A1

公开(公告)日：1976-07-08

申请号：DE2555257

申请日：1975-12-09

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  SHEAR STEPHEN ANTHONY

IPC: H05K3/18 ,  C03C17/10 ,  C04B41/88 ,  C23C18/18 ,  C23C18/28 ,  C23C18/30 ,  C23C3/02

Abstract: A catalyst solution for making surfaces receptive to the deposition of adherent electroless metal layers includes a complex of a precious metal salt with dimethyl sulfoxide such as, for example, Pd Cl2 . 2(CH3)2 SO together with a group IV metal salt such as, for example, stannous chloride. A process for rendering surfaces, such as glass, receptive to adherent electroless metal layers using the catalyst solution is also provided.

公开(公告)号：AU5866596A

公开(公告)日：1997-12-09

申请号：AU5866596

申请日：1996-05-21

Applicant: IBM ,  SATHE SANJEEV ,  SAMMAKIA BAHGAT ,  ANSCHEL MORRIS

Inventor： SATHE SANJEEV ,  SAMMAKIA BAHGAT ,  ANSCHEL MORRIS

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/433

公开(公告)号：DE68923740T2

公开(公告)日：1996-04-18

申请号：DE68923740

申请日：1989-05-13

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/42

Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

公开(公告)号：AT126396T

公开(公告)日：1995-08-15

申请号：AT89108688

申请日：1989-05-13

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H01L23/42

Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

公开(公告)号：CA1330020C

公开(公告)日：1994-06-07

申请号：CA607389

申请日：1989-08-02

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  PAWLOWSKI WALTER P

IPC: C08J7/12 ,  C08J7/14 ,  C08L79/08 ,  C23C14/02 ,  C23C14/20 ,  H05K3/38 ,  B05D3/06 ,  B05D3/10

Abstract: A process is provided for improving the surface properties of polyimide articles which contain significant amounts of transimide. The surface of the polyimide containing the transimide is first treated with a base to convert the surface layer of both the polyimides and the transimides to the polyamic salt. Thereafter the surface layer of the converted polyamic salt is treated with an acid to convert the layer to a polyamic acid. This is followed by a cure preferably in infrared radiation at a sufficiently rapid rate to prevent the formation of any significant amounts of transimide and provide only polyimide. Following this treatment metallization is applied to the improved surface layer.

公开(公告)号：DE68914033D1

公开(公告)日：1994-04-28

申请号：DE68914033

申请日：1989-05-13

Applicant: IBM

Inventor： ANSCHEL MORRIS

IPC: B32B15/088 ,  B32B15/08 ,  C23C14/02 ,  C23C14/06 ,  H01L21/312 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/38 ,  H01L23/48

Abstract: The article comprises a polyimide layer and a layer of a metal benzotriazole above said polyimide layer wherein said metal is selected from the group of copper, silver, and gold, and a layer of metal adjoining said metal benzotriazole layer. The method for forming such an article comprises the steps: providing a layer of a metal benzotriazole adjoining a polyamic acid layer that may be a layer of a polyimide substrate being converted to polyamic acid, wherein said metal is selected from the group of copper, silver and gold; providing a layer of metal adjoining said layer of metal benzotriazole and converting said polyamic acid to polyimide.

公开(公告)号：CA2045227A1

公开(公告)日：1992-03-10

申请号：CA2045227

申请日：1991-06-21

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  BARBOSA JOSE A ,  DIBBLE ERIC P ,  FUNARI JOSEPH ,  KRESGE JOHN S ,  LAMB CHARLES R ,  MURPHY RICHARD G ,  REYNOLDS SCOTT D ,  SAMMAKIA BAHGAT G ,  SHOLTES TAMAR A ,  STORR WAYNE R JR

IPC: H01L23/36 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/18

Abstract: HIGH MEMORY DENSITY PACKAGE Disclosed is a high density microelectronic circuit package. The circuit package includes a plurality of IC chips, as memory chips, on a circuitized flexible tape, which is, in turn, bonded to a printed circuit board. The circuitized flexible tape extends outwardly from the printed circuit board and has a plurality of IC chips mounted on I/O pads on the tape. The individual IC chips are in thermal contact with a heat sink means on the surfaces thereof opposite the circuitized flexible tape. The circuitized flexible tape and the heat sink are bonded to a printed circuit board.

公开(公告)号：BR8903415A

公开(公告)日：1990-02-13

申请号：BR8903415

申请日：1989-07-12

Applicant: IBM

Inventor： ANSCHEL MORRIS ,  SAMMAKIA BAHGAT GHALEB

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L23/433

Abstract: An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.