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公开(公告)号:DE3062187D1
公开(公告)日:1983-04-07
申请号:DE3062187
申请日:1980-06-03
Applicant: IBM
Inventor: BAKOS PETER , BENDZ GERALD ANDREI , DARROW RUSSELL ELWOOD , RIVENBURGH DENNIS LOUIS
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公开(公告)号:FR2325078A1
公开(公告)日:1977-04-15
申请号:FR7623636
申请日:1976-07-27
Applicant: IBM
Inventor: BAKOS PETER , RASILE JOHN
Abstract: A positive photoresist having increased sensitivity to light and formed by the addition of an acidic compound to a 1,2-quinone-diazide sulphonic acid ester sensitizer.
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公开(公告)号:DE1795207A1
公开(公告)日:1972-01-20
申请号:DE1795207
申请日:1968-08-23
Applicant: IBM
Inventor: BAKOS PETER , STEVEN KOZAK GARY
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公开(公告)号:IT1151031B
公开(公告)日:1986-12-17
申请号:IT2199480
申请日:1980-05-13
Applicant: IBM
Inventor: BAKOS PETER , BENDZ GERALD ANDREI , DARROW RUSSELL ELWOOD , RIVENBURGH DENNIS LOUIS
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公开(公告)号:DE2862413D1
公开(公告)日:1984-07-05
申请号:DE2862413
申请日:1978-12-13
Applicant: IBM
Inventor: BAKOS PETER , HAGGETT ROGER EUGENE , POLIAK RICHARD MARTIN
IPC: H05K3/34 , B23K35/36 , C09D5/20 , C09D171/02 , H01B3/42 , H01L23/29 , H01L23/488 , H05K3/28 , C09D3/49 , C08L71/02
Abstract: A film-forming composition comprising an organic flux base material; and a carboxylic acid anhydride and/or aldehyde; and a process for using are provided.
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公开(公告)号:CA1124610A
公开(公告)日:1982-06-01
申请号:CA349768
申请日:1980-04-14
Applicant: IBM
Inventor: BAKOS PETER , BENDZ GERALD A , DARROW RUSSELL E , RIVENBURGH DENNIS L
IPC: C09D9/00 , C11D7/00 , C11D7/22 , C11D7/24 , C11D7/32 , C11D7/50 , G03F7/42 , H01L21/306 , H05K3/26
Abstract: CLEANING COMPOSITION AND USE THEREOF A cleaning composition which includes N-methyl-2-pyrrolidone and an alkanolamine, and use thereof for cleaning substrates. EN9-79-003
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公开(公告)号:IT8021994D0
公开(公告)日:1980-05-13
申请号:IT2199480
申请日:1980-05-13
Applicant: IBM
Inventor: BAKOS PETER , BENDZ GERALD ANDREI , DARROW RUSSELL ELWOOD , RIVENBURGH DENNIS LOUIS
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公开(公告)号:DE2656139A1
公开(公告)日:1977-06-23
申请号:DE2656139
申请日:1976-12-10
Applicant: IBM
Inventor: BAKOS PETER , MEMIS IRVING , RASILE JOHN
Abstract: A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer.
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