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    1.
    发明专利
    未知

    公开(公告)号：DE2420589A1

    公开(公告)日：1974-11-21

    申请号：DE2420589

    申请日：1974-04-27

    Applicant: IBM

    Inventor： BENDZ DIANA JEAN ,  BENDZ GERALD ANDREI ,  WILDMAN ANNE MARIE

    IPC: H05K3/06 ,  B01D35/06 ,  G03F1/00 ,  G03F1/54 ,  G03F7/022 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  G03F7/02 ,  H01L7/64

    Abstract: 1457924 Photo-resist masks INTERNATIONAL BUSINESS MACHINES CORP 8 April 1974 [3 May 1973] 15432/74 Heading G2X A process using a photo-resist mask comprises (a) forming a photo-resist layer 57 on a substrate 51, 53, 55 (b) exposing parts of the photo-resist layer while varying the exposure energy across the parts to form at least two differently exposed regions 59, 63 having differing solubilities, Fig. 4B (c) developing the resist layer to remove those regions 59 having the highest solubility Fig. 4C (d) treating the exposed substrate e.g. by etching, Fig. 4d, the remaining resist protecting the covered areas (e) developing the resist layer to remove those regions 63 having the next highest solubility Fig. 4E and F treating the exposed substrate e.g. by plating, Fig. 4F the remaining resist protecting the covered areas. The resist can be either negative or positive working and after the final treatment step the remaining resist is stripped off. The varying exposure energy may be formed by exposing the resist through a mask having areas of differing optical density e.g. 0%, 50% and 100% transmission, or through coloured masks or by varying the intensity of a scanning electron beam. The first and second development steps may be carried out with dilute and undilute developer respectively. The resist used is an alkali-soluble positive working resist containing meta-cresol formaldehyde novolak resin (av. mol. wt. 1,000) and a sensitizer which is the 2-diazo-1-oxo-naphthalene-5-sulphonic acid ester of 2, 3, 4-trihydroxy-benzophenone. The process is used for making semi-conductor devices.

    FLUID TREATMENT APPARATUS
    5.
    发明专利
    FLUID TREATMENT APPARATUS 未知

    公开(公告)号：MY116476A

    公开(公告)日：2004-02-28

    申请号：MYPI9400747

    申请日：1994-03-28

    Applicant: IBM

    Inventor： BARD STEVEN LINDZ ,  MCCREARY JACK MARLYN ,  BENDZ GERALD ANDREI ,  CANESTARO MICHAEL JAMES ,  CHAPURA JOHN ROBERT ,  FRANKOSKI EDWARD JAY ,  HORAN MICHAEL SHAWN ,  JONES JEFFREY DONALD ,  KAMPERMAN JAMES STEVEN ,  KJELGAARD JOHN ROBERT JR

    IPC: B05C5/00 ,  B08B3/02 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

    Abstract: A FLUID TREATMENT APPARATUS AND METHOD FOR APPLYING FIRST AND SECOND FLUIDS (E.G., ETCHANT AND WATER) TO AN ARTICLE (E.G., CIRCUIT BOARD) PASSING THROUGH THE APPARATUS AT A PREDETERMINED RATE. THE FIRST FLUID IS IMPINGED ON A SURFACE OF THE ARTICLE AND THEREAFTER COLLECTED WITHIN THE APPARATUS' COMMON HOUSING. THE SECOND FLUID IS IMPINGED ONTO THE SURFACE OF THE ARTICLE AND COLLECTED WITHIN THE SAME HOUSING BUT AT A LOCATION SEPARATE FROM THE COLLECTED FIRST FLUID SO AS TO AT LEAST PARTIALLY PREVENT MIXING THEREOF. THE PREFERRED MEANS FOR EFFECTING FLUID IMPINGEMENT COMPRISES SEPARATE FLUID INJECTORS, EACH INCLUDING AT LEAST TWO ROWS OF FLUID JET INJECTORS THEREIN. THE COLLECTED FLUIDS ARE EACH RETURNED TO THE RESPECTIVE IMPINGEMENT MEANS. REPLENISHMENT OF THE SECOND FLUID IS ACCOMPLISHED USING A PUMP WHICH SUPPLIES THE SECOND FLUID, WHILE THE APPARATUS ALSO INCLUDES MEANS (E. G. , A DRAIN) TO EFFECTIVELY REMOVE THE SECOND FLUID AT A RATE SIMILAR TO THE SUPPLY RATE FOR THE SECOND FLUID. THE FIRST FLUID IS ALSO MAINTAINED AT AN ESTABLISHED LEVEL ABOVE THE ARTICLE'S SURFACE USING SUITABLE MEANS (E.G., DUAL ROLLERS) LOCATED RELATIVE (E.G., ON OPPOSITE SIDES OF) THE FIRST FLUID IMPINGEMENT MEANS. SIMILAR LEVEL RETENTION FOR THE SECOND FLUID IS ALSO POSSIBLE. CASCADING OF THE COLLECTED SECOND FLUID IS ALSO DEFINED, THIS OCCURING WITHIN THE SAME HOUSING CHAMBER WHICH SERVES TO COLLECT THE FIRST FLUID.( FIG 1 )

    6.
    发明专利
    未知

    公开(公告)号：DE69408490T2

    公开(公告)日：1998-09-24

    申请号：DE69408490

    申请日：1994-03-30

    Applicant: IBM

    Inventor： BARD STEVEN LINDZ ,  BENDZ GERALD ANDREI ,  CANESTARO MICHAEL JAMES ,  CHAPURA JOHN ROBERT ,  FRANKOSKI EDWARD JAY ,  HORAN MICHAEL SHAWN ,  JONES JEFFREY DONALD ,  KAMPERMAN JAMES STEVEN ,  KJELGAARD JOHN ROBERT ,  MCCREARY JACK MARLYN

    IPC: B05C5/00 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

    Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.

    7.
    发明专利
    未知

    公开(公告)号：DE69408490D1

    公开(公告)日：1998-03-19

    申请号：DE69408490

    申请日：1994-03-30

    Applicant: IBM

    Inventor： BARD STEVEN LINDZ ,  BENDZ GERALD ANDREI ,  CANESTARO MICHAEL JAMES ,  CHAPURA JOHN ROBERT ,  FRANKOSKI EDWARD JAY ,  HORAN MICHAEL SHAWN ,  JONES JEFFREY DONALD ,  KAMPERMAN JAMES STEVEN ,  KJELGAARD JOHN ROBERT ,  MCCREARY JACK MARLYN

    IPC: B05C5/00 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

    Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.

    8.
    发明专利
    未知

    公开(公告)号：DE2747284A1

    公开(公告)日：1978-05-03

    申请号：DE2747284

    申请日：1977-10-21

    Applicant: IBM

    Inventor： BENDZ DIANA JEAN ,  BENDZ GERALD ANDREI

    IPC: H01L21/30 ,  C09D9/00 ,  G03F7/00 ,  G03F7/42 ,  H01L21/027 ,  H05K3/22

    Abstract: Organic polymer resist layers are stripped from substrates by treating the layers with a mixture of an aldehyde or a ketone and an alcoholic solution of a compound selected from the group consisting of ammonium, alkali metal, and alkaline earth metal hydroxides and carbonates.

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