-
公开(公告)号:GB2512009A
公开(公告)日:2014-09-17
申请号:GB201412533
申请日:2013-01-10
Applicant: IBM
Inventor: BAO JUNJING , BONILLA GRISELDA , CHANDA KAUSHIK , CHOI SAMUEL S , FILIPPI RONALD G , GRUNOW STEPHAN , LUSTIG NAFTALI E , MOY DAN , SIMON ANDREW H
IPC: H01L21/768 , H01L23/525
Abstract: A BEOL e-fuse is disclosed which reliably blows in the via and can be formed even in the tightest pitch BEOL layers. The BEOL e-fuse can be formed utilizing a line first dual damascene process to create a sub-lithographic via to be the programmable link of the e-fuse. The sub-lithographic via can be patterned using standard lithography and the cross section of the via can be tuned to match the target programming current.