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公开(公告)号:DE102004017411A1
公开(公告)日:2005-03-10
申请号:DE102004017411
申请日:2004-04-08
Applicant: INFINEON TECHNOLOGIES AG , IBM , UNITED MICROELECTRONICS CO
Inventor: COWLEY ANDY , FANG SUNFEI , WANG YUN-YU , CLEVENGER LARRY , SIMON ANDREW H , GRECO STEPHEN , CHANDA KAUSHIK , SPOONER TERRY , YANG CHIH-CHAO
IPC: H01L21/768 , H01L21/285
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公开(公告)号:GB2512009B
公开(公告)日:2015-02-25
申请号:GB201412533
申请日:2013-01-10
Applicant: IBM
Inventor: BAO JUNJING , BONILLA GRISELDA , CHANDA KAUSHIK , CHOI SAMUEL S , FILIPPI RONALD G , GRUNOW STEPHAN , LUSTIG NAFTALI E , MOY DAN , SIMON ANDREW H
IPC: H01L21/768 , H01L23/525
Abstract: A BEOL e-fuse is disclosed which reliably blows in the via and can be formed even in the tightest pitch BEOL layers. The BEOL e-fuse can be formed utilizing a line first dual damascene process to create a sub-lithographic via to be the programmable link of the e-fuse. The sub-lithographic via can be patterned using standard lithography and the cross section of the via can be tuned to match the target programming current.
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