Nanowire field effect transistor device

    公开(公告)号:GB2510768A

    公开(公告)日:2014-08-13

    申请号:GB201409117

    申请日:2012-10-16

    Applicant: IBM

    Abstract: A method for forming a field effect transistor device includes forming a nanowire suspended above a substrate, forming a dummy gate stack on a portion of the substrate and around a portion of the nanowire, removing exposed portions of the nanowire, epitaxially growing nanowire extension portions from exposed portions of the nanowire, depositing a layer of semiconductor material over exposed portions of the substrate, the dummy gate stack and the nanowire extension portions, and removing portions of the semiconductor material to form sidewall contact regions arranged adjacent to the dummy gate stack and contacting the nanowire extension portions.

    Nanodraht-Floating-Gate-Transistor
    15.
    发明专利

    公开(公告)号:DE102012224274A1

    公开(公告)日:2013-07-11

    申请号:DE102012224274

    申请日:2012-12-21

    Applicant: IBM

    Abstract: Ein Floating-Gate-Transistor, eine Speicherzelle und ein Verfahren zum Fertigen einer Einheit. Der Floating-Gate-Transistor beinhaltet einen oder mehrere Gategesteuerte Drähte, die eine im Wesentlichen zylindrische Form aufweisen. Der Floating-Gate-Transistor beinhaltet eine erste Gate-Dielektrikumschicht, die die Gate-gesteuerten Drähte zumindest teilweise bedeckt. Der Floating-Gate-Transistor beinhaltet des Weiteren eine Vielzahl von Gate-Kristallen, die unzusammenhängend auf der ersten Gate-Dielektrikumschicht angeordnet sind. Der Floating-Gate-Transistor beinhaltet außerdem eine zweite Gate-Dielektrikumschicht, die die Vielzahl von Gate-Kristallen und die erste Gate-Dielektrikumschicht bedeckt.

    16.
    发明专利
    未知

    公开(公告)号:DE60331473D1

    公开(公告)日:2010-04-08

    申请号:DE60331473

    申请日:2003-12-02

    Applicant: IBM

    Abstract: A method for fabricating a strained Si layer on insulator, a structure of the strained Si layer on insulator, and electronic systems comprising such layers are disclosed. The method comprises the steps of forming epitaxially a relaxed SiGe layer on top of a Si layer on insulator; transforming the crystalline Si layer and the lower portion of the crystalline relaxed SiGe layer into an amorphous material state by ion implantation; and re-crystallizing the amorphous material from the crystalline top portion of the SiGe layer. The larger lattice constant of the SiGe seed layer forces a tensile strain in the Si layer.

    STRAINED SILICON-ON-INSULATOR (SSOI) AND METHOD TO FORM THE SAME

    公开(公告)号:AU2003297627A1

    公开(公告)日:2004-07-29

    申请号:AU2003297627

    申请日:2003-12-02

    Applicant: IBM

    Abstract: A method for fabricating a strained Si layer on insulator, a structure of the strained Si layer on insulator, and electronic systems comprising such layers are disclosed. The method comprises the steps of forming epitaxially a relaxed SiGe layer on top of a Si layer on insulator; transforming the crystalline Si layer and the lower portion of the crystalline relaxed SiGe layer into an amorphous material state by ion implantation; and re-crystallizing the amorphous material from the crystalline top portion of the SiGe layer. The larger lattice constant of the SiGe seed layer forces a tensile strain in the Si layer.

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