12.
    发明专利
    未知

    公开(公告)号:DE69010655T2

    公开(公告)日:1995-01-12

    申请号:DE69010655

    申请日:1990-11-27

    Applicant: IBM

    Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.

    18.
    发明专利
    未知

    公开(公告)号:DE68924920D1

    公开(公告)日:1996-01-11

    申请号:DE68924920

    申请日:1989-01-31

    Applicant: IBM

    Abstract: A structure is shown having three stages for guiding a system component into an operatively mounted position within an enclosure while simultaneously making a blind attachment of the electrical connectors to complete the power and signal circuits between the component and system contained within the enclosure. A coarse positioning structure includes a guide rail means for directing the component toward the operative, mounted position; an intermediate positioning structure (39,46) functions within the tolerance of the coarse positioning means to substantially align the component including the electrical connectors and a fine positioning means (44) aligns the electrical connectors for the final positioning as the component is latched into the operating position and electrical connections are completed. The three positioning functions are initiated serially.

    19.
    发明专利
    未知

    公开(公告)号:DE69010655D1

    公开(公告)日:1994-08-18

    申请号:DE69010655

    申请日:1990-11-27

    Applicant: IBM

    Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.

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