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    12.
    发明专利
    未知

    公开(公告)号：NO773128A

    公开(公告)日：1978-03-17

    申请号：NO773128

    申请日：1977-09-09

    Applicant: IBM

    Inventor： CUOMO JEROME JOHN ,  DISTEFANO THOMAS HERMAN ,  WOODALL JERRY MACPHERSON

    IPC: C02F1/14 ,  F24J2/48 ,  F24J

    CPC classification number: F24S70/25 ,  Y02E10/40

    Abstract: Luminous energy is very efficiently converted into heat by a substrate coated with an antireflective layer, whose surface is structured. In this arrangement, the refractive index and the thickness of the layer and the surface quality are such that as little energy as possible is reradiated. The structure of the layer surface results in multiple reflections of the light falling on the radiation collector. The substrate preferably consists of tungsten and is provided with a layer of tungsten oxide. The surface structure of the layer is a micro-hill structure or a dendritic structure.

    13.
    发明专利
    未知

    公开(公告)号：DE2609087A1

    公开(公告)日：1976-12-30

    申请号：DE2609087

    申请日：1976-03-05

    Applicant: IBM

    Inventor： BAGLIN JOHN EDWARD ,  DISTEFANO THOMAS HERMAN ,  TU KING-NING

    IPC: H01L21/265 ,  C03C23/00 ,  H01L21/28 ,  H01L21/3115 ,  H01L21/316 ,  H01L29/51 ,  C03C21/00

    Abstract: 1519695 Densifying glass INTERNATIONAL BUSINESS MACHINES CORP 5 March 1976 [11 June 1975] 08844/76 Heading C1M [Also in Division H1] The dielectric breakdown strength of a vitreous insulating layer less than 105000 Š thick of an electronic device is increased by irradiating the layer, during or after its formation, with ions of H, He, Ne, Ar, Kr or Xe at a dosage and energy so as to increase the density of the layer by at least 1% without the ions penetrating completely the layer, and then annealing the layer. The vitreous layer may be fused SiO 2 on a substrate of, e.g., silicon. The device 30-1 comprising the vitreous layer may be mounted on plate 30-2 in mounts 30-3. Ions from source 12 are passed through accelerator 14, then through a momentum analyzing magnet 16 and beam scanner plates 18-1, 18-2, 20-1, 20-2, and directed on to the vitreous layer (e.g. at a dosage of 10 13 -10 17 ions/cm 2 .). The annealing, which may be concurrent with the irradiation may be at 200-800‹ C.

    18.
    发明专利
    未知

    公开(公告)号：DE2515028A1

    公开(公告)日：1975-12-04

    申请号：DE2515028

    申请日：1975-04-07

    Applicant: IBM

    Inventor： DISTEFANO THOMAS HERMAN

    IPC: G11C27/04 ,  H01L21/339 ,  H01L27/148 ,  H01L29/423 ,  H01L29/762 ,  H01L29/768 ,  H01L29/66 ,  H01L27/14 ,  H01L21/08

    Abstract: A slow wave stripline is disposed on the surface of a semiconductor, sandwiched between insulating layers, and covered by a ground plane, to thus form a waveguide structure. The electric field created by a r.f., electromagnetic wave propagated along the stripline establishes potential inversion wells in the surface of the semiconductor which propagate smoothly along with the wave. Minority carriers may be injected into selected wells to propagate therewith, where the presence or absence of such minority carriers represents 1 or 0 in binary notation. Practical applications include recirculating shift registers, logic arrangements, delay line memories, and optical image sensing or generating devices. In the latter two applications a matrix is developed by intersecting a meandering stripline with heavily doped strips in the semiconductor surface to maintain potential well separation between the matrix rows.

    19.
    发明专利
    未知

    公开(公告)号：DE69024704D1

    公开(公告)日：1996-02-22

    申请号：DE69024704

    申请日：1990-04-27

    Applicant: IBM

    Inventor： DISTEFANO THOMAS HERMAN ,  EHRENBERG SCOTT GUSTAVE

    IPC: H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

    Abstract: A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors (16) on polyimide film layers (14), involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate (20) and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.

    20.
    发明专利
    未知

    公开(公告)号：DE3684288D1

    公开(公告)日：1992-04-16

    申请号：DE3684288

    申请日：1986-12-02

    Applicant: IBM

    Inventor： WANG SHERMAN SHEAU-MING ,  DISTEFANO THOMAS HERMAN ,  HOLLIS JR ,  JOHNSON MARK

    IPC: G11B23/30 ,  G11B5/58 ,  G11B5/596 ,  G11B5/74 ,  G11B5/82 ,  G11B5/84 ,  G11B23/36

    Abstract: A method and apparatus for format patterning magnetic recording media with servo-control patterns is disclosed herein. The method comprises the steps of applying the control pattern using a resist in liquid form onto the media material by conventional applying techniques. A layer of a thin metallic film is then deposited over the resist and uncovered substrate areas. The resist and its overlayered metal is then removed using a liftoff technique by dissolving the resist in its particular solvent. A control pattern of deposited metallic film remains in those non-resist areas. In the alternative, the process can also use an etching bath to create the servo control pattern.

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