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公开(公告)号：AU7742681A
公开(公告)日：1982-06-03
申请号：AU7742681
申请日：1981-11-12
Applicant: IBM
Inventor： GRANDIA JOHANNES , KANE DANIEL FRANCIS O , SANTINI HUGO ALBERTO EMILIO
Abstract: This invention relates to an apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate (20) having nozzles (22) of increasing size and uniformly spaced radially therethrough, or the same sized nozzles with varying radial spacing therethrough so as to provide a differential flow distribution of the plating solution that impinges on a wafer (32) disposed on a cathode (34). The spacing and size of the nozzles (22) are critical to obtaining a uniform thickness. The electrical currents to the wafer and to the thieving ring (42) are controlled by variable resistors so as to keep the electrical current to the cathode (34) constant throughout the plating process. In a preferred embodiment the flow-through jet plate (20) has an anode (26) associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition. This method can simultaneously deposit with a uniform thickness and composition elements having a minimum gap or part size of 1 micrometer or less.
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公开(公告)号：CA955507A
公开(公告)日：1974-10-01
申请号：CA120465
申请日：1971-08-11
Applicant: IBM
Inventor： GRANDIA JOHANNES , POTEMSKI ROBERT M , WOODALL JERRY M
IPC: C30B19/06 , H01L21/208
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Patent Agency Ranking
公开(公告)号：DE3168641D1
公开(公告)日：1985-03-14
申请号：DE3168641
申请日：1981-08-28
Applicant: IBM
Inventor： GRANDIA JOHANNES , O'KANE DANIEL FRANCIS , SANTINI HUGO ALBERTO EMILIO
Abstract: This invention relates to an apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate (20) having nozzles (22) of increasing size and uniformly spaced radially therethrough, or the same sized nozzles with varying radial spacing therethrough so as to provide a differential flow distribution of the plating solution that impinges on a wafer (32) disposed on a cathode (34). The spacing and size of the nozzles (22) are critical to obtaining a uniform thickness. The electrical currents to the wafer and to the thieving ring (42) are controlled by variable resistors so as to keep the electrical current to the cathode (34) constant throughout the plating process. In a preferred embodiment the flow-through jet plate (20) has an anode (26) associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition. This method can simultaneously deposit with a uniform thickness and composition elements having a minimum gap or part size of 1 micrometer or less.
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公开(公告)号：AU3483178A
公开(公告)日：1979-10-11
申请号：AU3483178
申请日：1978-04-06
Applicant: IBM
Inventor： GRANDIA JOHANNES , HILL JOHN CHARLES
IPC: B24B27/06 , B28D1/00 , B28D5/00 , B28D5/02 , C30B33/00 , H01L21/302 , H01L21/461 , H01L21/68
Abstract: A process for slicing boules of a single crystal material such as gadolinium gallium garnet (GGG) into wafers is described. The boule is prepared, by grinding preferably, so that the longitudinal boule axis corresponds to the crystallographic orientation axis of the boule. The boule is then mounted in a fixture and aligned so that the common longitudinal axis and crystallographic orientation axis is perpendicular to the saw blade. The boule is then rotated while maintaining the orientation of the combined common axis and engaged against an inner diameter rotating saw blade for a time sufficient for the blade to slice through the boule and form a wafer. The wafers obtained by this slicing process may be directly polished without the conventional lapping step to form a wafer having a surface that is substantially flat, parallel and defect free.
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公开(公告)号：DE2819420A1
公开(公告)日：1978-12-14
申请号：DE2819420
申请日：1978-05-03
Applicant: IBM
Inventor： GRANDIA JOHANNES , HILL JOHN CHARLES
Abstract: A process for slicing boules of a single crystal material such as gadolinium gallium garnet (GGG) into wafers is described. The boule is prepared, by grinding preferably, so that the longitudinal boule axis corresponds to the crystallographic orientation axis of the boule. The boule is then mounted in a fixture and aligned so that the common longitudinal axis and crystallographic orientation axis is perpendicular to the saw blade. The boule is then rotated while maintaining the orientation of the combined common axis and engaged against an inner diameter rotating saw blade for a time sufficient for the blade to slice through the boule and form a wafer. The wafers obtained by this slicing process may be directly polished without the conventional lapping step to form a wafer having a surface that is substantially flat, parallel and defect free.
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公开(公告)号：CA953210A
公开(公告)日：1974-08-20
申请号：CA100732
申请日：1970-12-16
Applicant: IBM
Inventor： GRANDIA JOHANNES , ROHR ROBERT L
IPC: B26D1/553 , B26D1/547 , B28D5/04 , H01L21/301
Abstract: A precision cutting apparatus including a cutting tool which consists of at least a single flexible cutting element and means coacting with said cutting element for holding it in a rigid, unstressed condition is disclosed. The flexible cutting element is ordinary spring steel while the means for holding the cutting element in a rigid, unstressed condition is a block of dimensionally-stable pyrolytic graphite containing a groove in which the spring steel cutting element is receivable. Also disclosed, is translation means for applying rectilinear motion to the cutting tool, and a means for aligning the work piece relative to the cutting tool. The grooved graphite block, in addition to providing a dimensionally stable holder, also provides a porous material into which an adhesive may be introduced to retain the cutting element within the grooves. Heating the graphite block liquefies an appropriate adhesive and permits the removal of an old cutting element and its replacement with a new cutting element. A method of operating the cutting apparatus is also shown including an alignment step which permits extremely precise cutting. The apparatus and method taught have particular utility in the semiconductor area where the ability to dice with great precision, for example, greatly enhances the yield of usable semiconductor chips.
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公开(公告)号：DE2061135A1
公开(公告)日：1971-07-15
申请号：DE2061135
申请日：1970-12-11
Applicant: IBM
Inventor： GRANDIA JOHANNES , LEWIS ROHR ROBERT
IPC: B26D1/553 , B26D1/547 , B28D5/04 , H01L21/301 , B28D
Abstract: A precision cutting apparatus including a cutting tool which consists of at least a single flexible cutting element and means coacting with said cutting element for holding it in a rigid, unstressed condition is disclosed. The flexible cutting element is ordinary spring steel while the means for holding the cutting element in a rigid, unstressed condition is a block of dimensionally-stable pyrolytic graphite containing a groove in which the spring steel cutting element is receivable. Also disclosed, is translation means for applying rectilinear motion to the cutting tool, and a means for aligning the work piece relative to the cutting tool. The grooved graphite block, in addition to providing a dimensionally stable holder, also provides a porous material into which an adhesive may be introduced to retain the cutting element within the grooves. Heating the graphite block liquefies an appropriate adhesive and permits the removal of an old cutting element and its replacement with a new cutting element. A method of operating the cutting apparatus is also shown including an alignment step which permits extremely precise cutting. The apparatus and method taught have particular utility in the semiconductor area where the ability to dice with great precision, for example, greatly enhances the yield of usable semiconductor chips.
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