11.
    发明专利
    未知

    公开(公告)号:DE69738705D1

    公开(公告)日:2008-07-03

    申请号:DE69738705

    申请日:1997-12-19

    Applicant: IBM

    Abstract: A method of fabricating semiconductor structures, particularly contact structures, forms features of differing sizes at different points in the semiconductor process, so as to enhance lithographic resolution.

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