公开(公告)号：DE69123216T2

公开(公告)日：1997-04-30

申请号：DE69123216

申请日：1991-09-10

Applicant: IBM

Inventor： HODGSON RODNEY T ,  STANLAND JACKSON E ,  WELLS OLIVER C

IPC: H01L21/027 ,  B41M5/20 ,  G01Q10/00 ,  G01Q30/20 ,  G01Q80/00 ,  G03F7/00 ,  G11B9/00 ,  H01J37/317 ,  H01L21/203 ,  H01L21/205 ,  H01L21/30 ,  H01L21/302 ,  G03F7/20 ,  H01J37/305

公开(公告)号：CA1259425A

公开(公告)日：1989-09-12

申请号：CA532515

申请日：1987-03-19

Applicant: IBM

Inventor： HODGSON RODNEY T ,  JONES HARRY J ,  LEDERMANN PETER G ,  MOSKOWITZ PAUL A ,  REILEY TIMOTHY C

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/28

Abstract: Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.

公开(公告)号：CA1016639A

公开(公告)日：1977-08-30

申请号：CA187405

申请日：1973-12-05

Applicant: IBM

Inventor： HODGSON RODNEY T ,  LANKARD JOHN R ,  SOROKIN PETER P ,  WYNNE JAMES J

IPC: H01S3/108 ,  G02F1/35 ,  G02F1/355 ,  G02F1/39 ,  H01S3/10 ,  H01S3/30

Abstract: An infrared source producing a coherent output having a spectrally narrow and continuously tunable frequency is described. Such a source uses a four wave mixing process in an alkali metal vapor, wherein the initial input beams to the alkali metal vapor come from two dye lasers. In an alternative mode of operation, tunable ultraviolet output is obtained.