公开(公告)号：BR8701658A

公开(公告)日：1988-01-26

申请号：BR8701658

申请日：1987-04-08

Applicant: IBM

Inventor： HODGSON RODNEY TREVOR ,  JONES HARRY J ,  LEDERMANN PETER G ,  REILEY TIMOTHY C ,  MOSKOWITZ PAUL ANDREW

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L21/96 ,  H01L21/98 ,  H01L23/02

公开(公告)号：CA2024012A1

公开(公告)日：1991-02-26

申请号：CA2024012

申请日：1990-08-24

Applicant: IBM

Inventor： KANG SUNG K ,  PALMER MICHAEL J ,  REILEY TIMOTHY C ,  TOPA ROBERT D

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：CA1259425A

公开(公告)日：1989-09-12

申请号：CA532515

申请日：1987-03-19

Applicant: IBM

Inventor： HODGSON RODNEY T ,  JONES HARRY J ,  LEDERMANN PETER G ,  MOSKOWITZ PAUL A ,  REILEY TIMOTHY C

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/28

Abstract: Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.