公开(公告)号：BR8701658A

公开(公告)日：1988-01-26

申请号：BR8701658

申请日：1987-04-08

Applicant: IBM

Inventor： HODGSON RODNEY TREVOR ,  JONES HARRY J ,  LEDERMANN PETER G ,  REILEY TIMOTHY C ,  MOSKOWITZ PAUL ANDREW

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L21/96 ,  H01L21/98 ,  H01L23/02

公开(公告)号：CA1259425A

公开(公告)日：1989-09-12

申请号：CA532515

申请日：1987-03-19

Applicant: IBM

Inventor： HODGSON RODNEY T ,  JONES HARRY J ,  LEDERMANN PETER G ,  MOSKOWITZ PAUL A ,  REILEY TIMOTHY C

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/28

Abstract: Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.