公开(公告)号：JP2002304565A

公开(公告)日：2002-10-18

申请号：JP2002031370

申请日：2002-02-07

Applicant: IBM

Inventor： BOIES STEPHEN J ,  DINKIN SAMUEL ,  MOSKOWITZ PAUL A ,  YU PHILIP SHI-LUNG ,  GREENE DAVID P

IPC: G06Q30/02 ,  G06Q30/06 ,  G06F17/60

Abstract: PROBLEM TO BE SOLVED: To provide a method and system for providing a consumer aggregation service in a network service provider. SOLUTION: At first, when a user registers himself or herself in a consumer collecting service 110, the consumer collecting service 110 replaces the identification information of the registered user 134 with its own identification information when the registered user 134 reads a world wide web(WWW) site. Moreover, the consumer collecting server 110 intercepts an electronic merchandise order made by the registered user 134 with a retailer 124 though a network 100, and charges the registered user 134 with the order, and carries out the order with the retailer 124 on behalf of the registered user 134, and makes the retail agent 124 charge the consumer aggregation service itself with the order. Moreover, the consumer collecting server 110 collects coupons or bonuses from the retailers 124 based on shopping performed by the registered users 134, and stores them in a data base, and distributes the collected coupons or bonuses to the registered users 134 in a prescribed method.

公开(公告)号：JP2001339517A

公开(公告)日：2001-12-07

申请号：JP2001080630

申请日：2001-03-21

Applicant: IBM

Inventor： MOSKOWITZ PAUL A ,  PHILIP SHIIRAN YU ,  DINKIN SAM ,  BOIES STEPHEN J

IPC: G06F17/28 ,  G06F15/00 ,  G10L13/00 ,  G10L13/04 ,  G10L15/00 ,  H04M3/42 ,  H04M3/493 ,  H04W88/18 ,  H04Q7/38

Abstract: PROBLEM TO BE SOLVED: To provide a system and method for information conversion that facilitates exchange of many digital information data between wireless communication units in order to aid communication between users understanding different languages. SOLUTION: This invention provides a system and a method for information conversion employing wireless communication units. The communication unit allows a user to enter data in its mother language. The communication unit converts an entry request into a markup language. The communication unit transmits a markup language expressing a property of a request and a mother language of the user of the communication unit to a 2nd communication unit via a wireless link. The 2nd communication unit receives the request and returns a reply in a mother language instructed by the user of the 1st communication unit or in the markup language. The personal communication unit receives the reply and displays the reply in the mother language of the original user.

公开(公告)号：JP2000153842A

公开(公告)日：2000-06-06

申请号：JP26971999

申请日：1999-09-24

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  FEGER CLAUDIUS ,  MARTENS MARCO ,  MOSKOWITZ PAUL A ,  SCHROTT ALEJANDRO GABRIEL ,  TRESSER CHARLES P ,  GUTFELD ROBERT JACOB VON

IPC: B65D23/00 ,  B44F1/12 ,  G06K19/06 ,  G09F3/00

Abstract: PROBLEM TO BE SOLVED: To prevent illegal resale by forming at least one of coat and code on an item and determining whether the item has been resold from an authorized merchant to an unauthorized merchant by checking the coat or code. SOLUTION: This identifier is extremely difficult if not impossible to remove. The identifier has its allocation and encoded code known only to a manufacturer. When the manufacturer suspects that parallel commercial transaction is occurring, he easily identifies an unauthorized reseller and can take appropriate countermeasures to prevent unauthorized activity. The system 50 includes a processor 51, a special coat/ruled code to be attached onto an item of interest and a detector 53 for determining information contents of the special coat/ scribing code. Although the detector 53 is shown separately from the processor 51, the detector can incorporate the processor therein.

公开(公告)号：WO2008063710A3

公开(公告)日：2008-11-27

申请号：PCT/US2007071621

申请日：2007-06-20

Applicant: IBM ,  CHEN HAN ,  FRIEDMAN DANIEL J ,  MOSKOWITZ PAUL A

Inventor： CHEN HAN ,  FRIEDMAN DANIEL J ,  MOSKOWITZ PAUL A

IPC: H04Q5/22

CPC classification number: G06K19/0723 ,  G06K19/0701 ,  G08B13/2417

Abstract: A system and method are provided for modifying the effective reading range of an radio frequency identification tag. The tag, a chip-based tag, includes an antenna and a chip in communication with the antenna. The chip includes circuitry including field effect transistors that can modify the effective reading range of the tag by modifying characteristics of the tag including the modulation depth of the backscatter signal, the impedance characteristics of the tag front end electronics, the power consumption characteristics and the threshold power-on voltage of the tag. These characteristics are change either temporarily or permanently in response to commands communicated to the tag from a radio frequency identification reader.

Abstract translation: 提供了一种用于修改射频识别标签的有效读取范围的系统和方法。 标签是基于芯片的标签，包括与天线通信的天线和芯片。 芯片包括电路，其包括场效应晶体管，其可以通过修改标签的特性来修改标签的有效读取范围，包括反向散射信号的调制深度，标签前端电子器件的阻抗特性，功耗特性和阈值 标签的上电电压。 响应于从射频识别读取器传送给标签的命令，这些特征暂时或永久地改变。

公开(公告)号：CA2153441A1

公开(公告)日：1996-03-10

申请号：CA2153441

申请日：1995-07-07

Applicant: IBM

Inventor： MOSKOWITZ PAUL A ,  BRADY MICHAEL J ,  COTEUS PAUL W

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

公开(公告)号：CA1259425A

公开(公告)日：1989-09-12

申请号：CA532515

申请日：1987-03-19

Applicant: IBM

Inventor： HODGSON RODNEY T ,  JONES HARRY J ,  LEDERMANN PETER G ,  MOSKOWITZ PAUL A ,  REILEY TIMOTHY C

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/28

Abstract: Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.

公开(公告)号：DE68918380T2

公开(公告)日：1995-03-30

申请号：DE68918380

申请日：1989-07-12

Applicant: IBM

Inventor： ARLDT BRIAN D ,  BRUHN PETER H ,  BULLER LAWRENCE M ,  LEDERMANN PETER G ,  LINAM STEPHEN D ,  MCNELIS BARBARA J ,  MOK LAWRENCE S ,  MOSKOWITZ PAUL A

IPC: H01L23/36 ,  H01L23/40

Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.

公开(公告)号：CA1194610A

公开(公告)日：1985-10-01

申请号：CA435248

申请日：1983-08-24

Applicant: IBM

Inventor： FARIS SADEG M ,  MOSKOWITZ PAUL A ,  DAVIDSON ARTHUR ,  SAI-HALASZ GEORGE A

IPC: H01L39/24 ,  F17C13/00 ,  G01R13/34 ,  G01R31/28 ,  G01R31/26

Abstract: ROOM TEMPERATURE CRYOGENIC TEST INTERFACE This interface permits the testing of high speed semiconductor devices (room-temperature chips) by a Josephson junction sampling device (cryogenic chip) without intolerable loss of resolution. The interface comprises a quartz pass-through plug which includes a planar transmission line interconnecting a first chip station, where the cryogenic chip is mounted, and a second chip station, where the semiconductor chip to be tested is temporarily mounted. The pass-through plug has a cemented long half-cylindrical portion and short half-cylindrical portion. The long portion carries the planar transmission line, the ends of which form the first and second chip mounting stations. The short portion completes the cylinder with the long portion for part of its length, where a seal can be achieved, but does not extend over the chip mounting stations. Sealing is by epoxy cement. The pass-through plug is sealed in place in a flange mounted to the chamber wall. The first chip station, with the cryogenic chip attached, extends into the liquid helium reservoir. The second chip station is in the room temperature environment required for semiconductor operation. Proper semiconductor operating temperature is achieved by a heater wire and control thermocouple in the vicinity of each other and the second chip mounting station. Thermal isolation is maintained by vacuum and seals. Connections for power and control, for test result signals, for temperature control and heating, and for vacuum complete the test apparatus.

公开(公告)号：CA2089791C

公开(公告)日：1998-11-24

申请号：CA2089791

申请日：1993-02-18

Applicant: IBM

Inventor： BRADY MICHAEL J ,  MARINO JEFFREY R ,  FARRELL CURTIS E ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  MIKALSEN DONALD J ,  MOSKOWITZ PAUL A ,  O'SULLIVAN EUGENE J ,  O'TOOLE TERRENCE R ,  RIELEY SHELDON C ,  WALKER GEORGE F

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: Silicon and germanium containing materials are used as a surface of conductors i n electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these s urfaces. These materials are used as a surface coating for lead frames for packaging inte grated circuit chips. These materials can be decal transferred onto conductor surfaces or elect rolessly or electrolytically disposed thereon.

公开(公告)号：CA2153440A1

公开(公告)日：1996-03-10

申请号：CA2153440

申请日：1995-07-07

Applicant: IBM

Inventor： BRADY MICHAEL J ,  COFINO THOMAS A ,  HEINRICH HARLEY K ,  JOHNSON GLEN W ,  MOSKOWITZ PAUL A ,  WALKER GEORGE F

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59

Abstract: The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.