公开(公告)号：US3602192A

公开(公告)日：1971-08-31

申请号：US3602192D

申请日：1969-05-19

Applicant: IBM

Inventor： GROCHOWSKI EDWARD G ,  LYONS VINCENT J

IPC: C30B25/02 ,  B01J19/00 ,  B01J19/28 ,  C23C16/54 ,  H01L21/205 ,  H01L21/22 ,  H01L21/302 ,  H01L21/31 ,  H01L21/677 ,  C23C11/00

CPC classification number: C23C16/54

Abstract: The continuous processing of semiconductor wafers transported through a reactor system having a series of reaction zones permitting separate process functions, with zone isolation achieved through the use of dynamically sealed vapor-purged isolation chambers. An in-line, verticaL arrangement of gas inlets and outlets and planar work supports effect a laminar flow of gaseous materials.

公开(公告)号：US3523046A

公开(公告)日：1970-08-04

申请号：US3523046D

申请日：1964-09-14

Applicant: IBM

Inventor： GROCHOWSKI EDWARD G ,  LYONS VINCENT J

IPC: C30B25/02 ,  H01L21/00 ,  H01L7/36

CPC classification number: C30B29/06 ,  C30B25/02 ,  H01L21/00 ,  Y10S148/007 ,  Y10S438/925

公开(公告)号：US3070466A

公开(公告)日：1962-12-25

申请号：US80997759

申请日：1959-04-30

Applicant: IBM

Inventor： LYONS VINCENT J

IPC: H01L21/225

CPC classification number: H01L21/2255 ,  Y10S148/043 ,  Y10S148/151

公开(公告)号：US2898248A

公开(公告)日：1959-08-04

申请号：US65939157

申请日：1957-05-15

Applicant: IBM

Inventor： SILVEY GENE A ,  LYONS VINCENT J

IPC: H01L21/205

CPC classification number: H01L21/02381 ,  H01L21/02532 ,  H01L21/02576 ,  H01L21/0262

公开(公告)号：CA893389A

公开(公告)日：1972-02-15

申请号：CA893389D

Applicant: IBM

Inventor： LYONS VINCENT J ,  SANDHU JAGTAR S

IPC: C30B31/16 ,  H01L21/22

公开(公告)号：CA1106611A

公开(公告)日：1981-08-11

申请号：CA331675

申请日：1979-07-12

Applicant: IBM

Inventor： BASI JAGTAR S ,  LYONS VINCENT J ,  MENDEL ERIC

IPC: B24B37/00 ,  B24D13/14 ,  B24B29/00

Abstract: PROCESS AND APPARATUS FOR FREE POLISHING Opposite faces of a workpiece, such as a semiconductor wafer, are simultaneously free polished by contacting the faces with a pair of rotating polishing pads to which are fed a polishing slurry of an abrasive material. A pattern of perforations is provided in the surface of at least one of the pads such that the area of pad in contact with the opposite faces of the workpiece is different. FI 9-78-031

公开(公告)号：CA789513A

公开(公告)日：1968-07-09

申请号：CA789513D

Applicant: IBM

Inventor： GROCHOWSKI EDWARD G ,  LYONS VINCENT J

公开(公告)号：CA832681A

公开(公告)日：1970-01-20

申请号：CA832681D

Applicant: IBM

Inventor： SILVESTRI VICTOR J ,  LYONS VINCENT J ,  MARINACE JOHN C

公开(公告)号：CA770084A

公开(公告)日：1967-10-24

申请号：CA770084D

Applicant: IBM

Inventor： LYONS VINCENT J ,  HULL EDWARD M

公开(公告)号：CA967856A

公开(公告)日：1975-05-20

申请号：CA102479

申请日：1971-01-12

Applicant: IBM

Inventor： LYONS VINCENT J

IPC: H01L21/223 ,  C30B31/16 ,  H01L21/00 ,  H01L21/22