公开(公告)号：GB2577432B

公开(公告)日：2020-09-16

申请号：GB201918083

申请日：2017-12-19

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  MARKUS BRINK

IPC: H01L39/22 ,  H01L39/24

Abstract: A technique relates to forming a sidewall tunnel junction. A first conducting layer is formed using a first shadow mask evaporation. A second conducting layer is formed on a portion of the first conducting layer, where the second conducting layer is formed using a second shadow mask evaporation. An oxide layer is formed on the first conducting layer and the second conducting layer. A third conducting layer is formed on part of the oxide layer, such that the sidewall tunnel junction is positioned between the first conducting layer and the third conducting layer.

公开(公告)号：GB2581311A

公开(公告)日：2020-08-12

申请号：GB202009117

申请日：2018-11-09

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  JASON SCOTT ORCUTT ,  MARTIN SANDBERG ,  MARKUS BRINK ,  VIVEKANANDA ADIGA ,  NICHOLAS TORLEIV BRONN

IPC: H01L25/065 ,  G06N10/00 ,  H01L27/18 ,  H01L39/02 ,  H01L39/24

Abstract: A quantum bit (qubit) flip chip assembly is formed when a qubit is formed on a first chip and an optically transmissive path is formed on a second chip. The two chips are bonded using solder bumps. The optically transmissive path provides optical access to the qubit on the first chip.

公开(公告)号：GB2577432A

公开(公告)日：2020-03-25

申请号：GB201918083

申请日：2017-12-19

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  MARKUS BRINK

IPC: H01L39/22 ,  H01L39/24

Abstract: A technique relates to forming a sidewall tunnel junction. A first conducting layer is formed using a first shadow mask evaporation. A second conducting layer is formed on a portion of the first conducting layer, where the second conducting layer is formed using a second shadow mask evaporation. An oxide layer is formed on the first conducting layer and the second conducting layer. A third conducting layer is formed on part of the oxide layer, such that the sidewall tunnel junction is positioned between the first conducting layer and the third conducting layer.

公开(公告)号：GB2576274A

公开(公告)日：2020-02-12

申请号：GB201915909

申请日：2017-11-28

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  JARED BARNEY HERTZBERG ,  MARKUS BRINK

IPC: G11C11/44 ,  H04L9/00

Abstract: A technique relates to a superconducting chip. Resonant units each include a Josephson junction. The resonant units have resonant frequencies whose differences are based on a variation in the Josephson junction. A transmission medium is coupled to the resonant units, and the transmission medium is configured to output a sequence of the resonant frequencies as an identification of the chip.