公开(公告)号：GB2547121A

公开(公告)日：2017-08-09

申请号：GB201704200

申请日：2016-02-08

Applicant: IBM

Inventor： JOY CHENG ,  MELIA TJIO ,  GURPREET SINGH ,  ALEXANDER FRIZ ,  HSINYU TSAI ,  MARKUS BRINK ,  MICHAEL GUILLORN ,  CHI-CHUN LIU ,  GREGORY DOERK ,  DANIEL PAUL SANDERS

IPC: C08J7/04 ,  H01L21/02 ,  H01L21/311 ,  H01L29/06 ,  H05K3/00

Abstract: Hybrid pre-patterns were prepared for directed self-assembly of a given block copolymer capable of forming a lamellar domain pattern. The hybrid pre-patterns have top surfaces comprising independent elevated surfaces interspersed with adjacent recessed surfaces. The elevated surfaces are neutral wetting to the domains formed by self-assembly. Material below the elevated surfaces has greater etch-resistance than material below the recessed surfaces in a given etch process. Following other dimensional constraints of the hybrid pre-pattern described herein, a layer of the given block copolymer was formed on the hybrid pre-pattern. Self- assembly of the layer produced a lamellar domain pattern comprising self-aligned, unidirectional, perpendicularly oriented lamellae over the elevated surfaces, and parallel and/or perpendicularly oriented lamellae over recessed surfaces. The domain patterns displayed long range order along the major axis of the pre-pattern. The lamellar domain patterns are useful in forming transfer patterns comprising two-dimensional customized features.

公开(公告)号：GB2576664B

公开(公告)日：2021-10-06

申请号：GB201917134

申请日：2017-12-06

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  JARED BARNEY HERTZBERG ,  MARKUS BRINK

IPC: G11C11/44 ,  G11C17/16 ,  G11C17/18 ,  H01L27/18 ,  H01L39/22

Abstract: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.

公开(公告)号：GB2582527A

公开(公告)日：2020-09-23

申请号：GB202009577

申请日：2017-12-20

Applicant: IBM

Inventor： JAY GAMBETTA ,  ANTONIO CORCOLES-GONZALEZ ,  FIRAT SOLGUN ,  SAMI ROSENBLATT ,  MARKUS BRINK

IPC: G06N10/00 ,  H01L27/18 ,  H01L39/22 ,  H01L39/24 ,  H01P1/203 ,  H01P7/08

Abstract: A technique relates to a structure. A first surface includes an inductive element of a resonator. A second surface includes a first portion of a capacitive element of the resonator and at least one qubit. A second portion of the capacitive element of the resonator is on the first surface.

公开(公告)号：GB2581311B

公开(公告)日：2021-02-17

申请号：GB202009117

申请日：2018-11-09

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  JASON SCOTT ORCUTT ,  MARTIN SANDBERG ,  MARKUS BRINK ,  VIVEKANANDA ADIGA ,  NICHOLAS TORLEIV BRONN

IPC: H01L25/065 ,  G06N10/00 ,  H01L27/18 ,  H01L39/02 ,  H01L39/24

Abstract: A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded. The optically transmissive path may provide optical access to the qubit on the first chip.

公开(公告)号：GB2582527B

公开(公告)日：2021-01-20

申请号：GB202009577

申请日：2017-12-20

Applicant: IBM

Inventor： JAY GAMBETTA ,  ANTONIO CORCOLES-GONZALEZ ,  FIRAT SOLGUN ,  SAMI ROSENBLATT ,  MARKUS BRINK

IPC: G06N10/00 ,  H01L27/18 ,  H01L39/22 ,  H01L39/24 ,  H01P1/203 ,  H01P7/08

Abstract: A technique relates to a structure. A first surface includes an inductive element of a resonator. A second surface includes a first portion of a capacitive element of the resonator and at least one qubit. A second portion of the capacitive element of the resonator is on the first surface.

公开(公告)号：IL295564B2

公开(公告)日：2025-04-01

申请号：IL29556422

申请日：2022-08-11

Applicant: IBM ,  DONGBING SHAO ,  ERIC PETER LEWANDOWSKI ,  NICHOLAS TORLEIV BRONN ,  MARKUS BRINK

Inventor： DONGBING SHAO ,  ERIC PETER LEWANDOWSKI ,  NICHOLAS TORLEIV BRONN ,  MARKUS BRINK

IPC: G06N10/00 ,  H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.

公开(公告)号：GB2576664A

公开(公告)日：2020-02-26

申请号：GB201917134

申请日：2017-12-06

Applicant: IBM

Inventor： SAMI ROSENBLATT ,  JARED BARNEY HERTZBERG ,  MARKUS BRINK

IPC: H01L39/22

Abstract: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.

公开(公告)号：GB2547121B

公开(公告)日：2019-09-18

申请号：GB201704200

申请日：2016-02-08

Applicant: IBM

Inventor： JOY CHENG ,  MELIA TJIO ,  GURPREET SINGH ,  ALEXANDER FRIZ ,  HSINYU TSAI ,  MARKUS BRINK ,  MICHAEL GUILLORN ,  CHI-CHUN LIU ,  GREGORY DOERK ,  DANIEL PAUL SANDERS

IPC: C08J7/04 ,  B05D1/18 ,  G03F7/00 ,  H01L21/02 ,  H01L21/033 ,  H01L21/311 ,  H01L29/06 ,  H05K3/00

Abstract: Hybrid pre-patterns were prepared for directed self-assembly of a given block copolymer capable of forming a lamellar domain pattern. The hybrid pre-patterns have top surfaces comprising independent elevated surfaces interspersed with adjacent recessed surfaces. The elevated surfaces are neutral wetting to the domains formed by self-assembly. Material below the elevated surfaces has greater etch-resistance than material below the recessed surfaces in a given etch process. Following other dimensional constraints of the hybrid pre-pattern described herein, a layer of the given block copolymer was formed on the hybrid pre-pattern. Self-assembly of the layer produced a lamellar domain pattern comprising self-aligned, unidirectional, perpendicularly oriented lamellae over the elevated surfaces, and parallel and/or perpendicularly oriented lamellae over recessed surfaces. The domain patterns displayed long range order along the major axis of the pre-pattern. The lamellar domain patterns are useful in forming transfer patterns comprising two-dimensional customized features.

公开(公告)号：IL295564B1

公开(公告)日：2024-12-01

申请号：IL29556422

申请日：2022-08-11

Applicant: IBM ,  DONGBING SHAO ,  ERIC PETER LEWANDOWSKI ,  NICHOLAS TORLEIV BRONN ,  MARKUS BRINK

Inventor： DONGBING SHAO ,  ERIC PETER LEWANDOWSKI ,  NICHOLAS TORLEIV BRONN ,  MARKUS BRINK

IPC: G06N10/00 ,  H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L29/66

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.

公开(公告)号：IL295564A

公开(公告)日：2022-10-01

申请号：IL29556422

申请日：2022-08-11

Applicant: IBM ,  DONGBING SHAO ,  ERIC PETER LEWANDOWSKI ,  NICHOLAS TORLEIV BRONN ,  MARKUS BRINK

Inventor： DONGBING SHAO ,  ERIC PETER LEWANDOWSKI ,  NICHOLAS TORLEIV BRONN ,  MARKUS BRINK

IPC: G06N10/00 ,  H01L23/00 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L29/66

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.