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1.发明专利
公开(公告)号：GB2560472A
公开(公告)日：2018-09-12
申请号：GB201809689
申请日：2016-09-28
Applicant: IBM
Inventor： JARED BARNEY HERTZBERG , BALEEGH ABDO
Abstract: A technique relates to frequency conversion. A mechanical resonator (104) is configured to oscillate at a mechanical resonance frequency with a displacement in an axis. An optical resonator (108) includes a first mirror (202A) opposite a second mirror (202B) in which an optical cavity is formed between. The first mirror (202A) is fixed to the mechanical resonator (104) such that the first mirror(202A) is moved to change an optical length of the optical cavity according to the displacement of the mechanical resonator (104). Changing the optical length changes an optical resonance frequency of the optical resonator (108). A microwave resonator (120) is positioned to move according to the displacement of the mechanical resonator (104) such that moving the mechanical resonator (104) changes a Josephson inductance of the microwave resonator (120), thereby changing a microwave resonance frequency of the microwave resonator (120).
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公开(公告)号：BR112021020936A2
公开(公告)日：2022-01-25
申请号：BR112021020936
申请日：2020-04-15
Applicant: IBM
Inventor： SHAO DONGBING , SOLGUN FIRAT , JARED BARNEY HERTZBERG , BRINK MARKUS
Abstract: estruturas de sintonia de frequência qubit e métodos de fabricação para dispositivos de computação quântica flip chip. um dispositivo de computação quântica inclui um primeiro chip com um primeiro substrato e um ou mais qubits descartados no primeiro substrato. cada um ou mais qubits tem uma frequência de ressonância associada. o dispositivo de computação quântica inclui ainda um segundo chip com um segundo substrato e pelo menos uma superfície condutora descartada no segundo substrato oposto ao um ou mais qubits. a pelo menos uma superfície condutora tem pelo menos uma dimensão configurada para ajustar a frequência de ressonância associada a pelo menos um ou mais qubits a um determinado valor de ajuste de frequência.
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公开(公告)号：GB2576664B
公开(公告)日：2021-10-06
申请号：GB201917134
申请日：2017-12-06
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
Abstract: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.
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公开(公告)号：GB2581053A
公开(公告)日：2020-08-05
申请号：GB202005185
申请日：2017-12-19
Applicant: IBM
Inventor： SAMI ROSENBLATT , RASIT TOPALOGU , JARED BARNEY HERTZBERG , WERNER A RAUSCH
Abstract: A vertical q-capacitor (202, 302, 700, 1100, 1400, 1800) includes a trench (304, 502, 902, 1202, 1204, 1602) in a substrate (400) through a layer (602, 1302, 1304) of superconducting material (402). A superconductor is deposited in the trench (304, 502, 902, 1202, 1204, 1602) forming a first film on a first surface, a second film on a second surface, and a third film of the superconductor on a third surface of the trench (304, 502, 902, 1202, 1204, 1602). The first and second surfaces are substantially parallel, and the third surface in the trench (304, 502, 902, 1202, 1204, 1602) separates the first and second surfaces. A dielectric is exposed below the third film by etching. A first coupling is formed between the first film and a first contact, and a second coupling is formed between the second film and a second contact in a superconducting quantum logic circuit. The first and second couplings cause the first and second films to operate as the vertical q-capacitor (202, 302, 700, 1100, 1400, 1800) that maintains integrity of data in the superconducting quantum logic circuit within a threshold level.
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公开(公告)号：GB2576664A
公开(公告)日：2020-02-26
申请号：GB201917134
申请日：2017-12-06
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
IPC: H01L39/22
Abstract: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.
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Patent Agency Ranking
公开(公告)号：GB2574552B
公开(公告)日：2022-02-16
申请号：GB201913518
申请日：2017-11-24
Applicant: IBM
Inventor： BALEEGH ABDO , JARED BARNEY HERTZBERG , EASWAR MAGESAN , JAY GAMBETTA
Abstract: A technique relates to providing a superconducting quantum device. A fixed frequency transmon qubit is provided. A tunable frequency transmon qubit is provided. The fixed frequency transmon qubit is coupled to the tunable frequency transmon qubit to form a single qubit.
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公开(公告)号：BR112021025725A2
公开(公告)日：2022-02-08
申请号：BR112021025725
申请日：2020-05-13
Applicant: IBM
Inventor： WEBB BUCKNELL , ERIC PETER LEWANDOWSKI , JARED BARNEY HERTZBERG , SANDBERG MARTIN , JINKA OBLESH
IPC: H01L23/44
Abstract: estrutura de termalização para dispositivos resfriados à temperatura criogênica. uma estrutura de termalização é formada utilizando uma folha e um dispositivo de baixa temperatura (ltd). a folha inclui uma primeira camada de um primeiro material. o ltd inclui uma superfície a partir da qual calor é transferido para longe do ltd. um acoplamento é formado entre a folha e a superfície do ltd, onde o acoplamento inclui uma ligação formada entre a folha e a superfície de modo que a formação da ligação forma um conjunto de cristas na folha, uma crista no conjunto de cristas operando para dissipar o calor.
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公开(公告)号：GB2581053B
公开(公告)日：2021-11-03
申请号：GB202005185
申请日：2017-12-19
Applicant: IBM
Inventor： SAMI ROSENBLATT , RASIT TOPALOGU , JARED BARNEY HERTZBERG , WERNER A RAUSCH
Abstract: A vertical q-capacitor includes a trench in a substrate through a layer of superconducting material. A superconductor is deposited in the trench forming a first film on a first surface, a second film on a second surface, and a third film of the superconductor on a third surface of the trench. The first and second surfaces are substantially parallel, and the third surface in the trench separates the first and second surfaces. A dielectric is exposed below the third film by etching. A first coupling is formed between the first film and a first contact, and a second coupling is formed between the second film and a second contact in a superconducting quantum logic circuit. The first and second couplings cause the first and second films to operate as the vertical q-capacitor that maintains integrity of data in the superconducting quantum logic circuit within a threshold level.
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公开(公告)号：GB2576274B
公开(公告)日：2022-03-09
申请号：GB201915909
申请日：2017-11-28
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
Abstract: A technique relates to a superconducting chip. Resonant units each include a Josephson junction. The resonant units have resonant frequencies whose differences are based on a variation in the Josephson junction. A transmission medium is coupled to the resonant units, and the transmission medium is configured to output a sequence of the resonant frequencies as an identification of the chip.
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公开(公告)号：GB2576274A
公开(公告)日：2020-02-12
申请号：GB201915909
申请日：2017-11-28
Applicant: IBM
Inventor： SAMI ROSENBLATT , JARED BARNEY HERTZBERG , MARKUS BRINK
Abstract: A technique relates to a superconducting chip. Resonant units each include a Josephson junction. The resonant units have resonant frequencies whose differences are based on a variation in the Josephson junction. A transmission medium is coupled to the resonant units, and the transmission medium is configured to output a sequence of the resonant frequencies as an identification of the chip.
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