公开(公告)号：DE10062011A1

公开(公告)日：2002-06-27

申请号：DE10062011

申请日：2000-12-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  BINDER ALFRED ,  SCHERF WERNER ,  AIGNER KURT ,  KROUPA GERHARD

IPC: H01L21/683 ,  B65G54/02

Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.

公开(公告)号：AT546832T

公开(公告)日：2012-03-15

申请号：AT02019577

申请日：2002-09-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT ,  BINDER ALFRED ,  KROUPA GERHARD ,  MATSCHITSCH MARTIN ,  MICHENTHALER NORBERT ,  PUCHER GERHARD

IPC: H01L21/683

公开(公告)号：DE50014054D1

公开(公告)日：2007-03-29

申请号：DE50014054

申请日：2000-10-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  SCHERF WERNER ,  RUDOLPH CONNY-NORBERT ,  LADINIG MARCELLO ,  KROUPA GERHARD ,  BINDER ALFRED ,  GIOVANNINI ALBERTO ,  AIGNER KURT ,  MANZONI GIULIO

IPC: H01L21/00 ,  B25B11/00 ,  B65G47/00 ,  B66C1/00 ,  H01L21/683

公开(公告)号：DE10062011B4

公开(公告)日：2005-02-24

申请号：DE10062011

申请日：2000-12-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  BINDER ALFRED ,  SCHERF WERNER ,  AIGNER KURT ,  KROUPA GERHARD

IPC: H01L21/683 ,  B65G54/02

Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.

公开(公告)号：DE10303459A1

公开(公告)日：2004-08-19

申请号：DE10303459

申请日：2003-01-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BINDER ALFRED ,  KROUPA GERHARD ,  KOBLINSKI CARSTEN VON ,  MATSCHITSCH MARTIN

IPC: H01L21/00 ,  H01L21/68 ,  H01L21/687 ,  G01N21/95

公开(公告)号：DE10304425B3

公开(公告)日：2004-08-05

申请号：DE10304425

申请日：2003-02-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT ,  BINDER ALFRED ,  KROUPA GERHARD ,  MATSCHITSCH MARTIN ,  MICHENTHALER NORBERT ,  PUCHER GERHARD

IPC: H01L21/683 ,  B25J15/06 ,  H01L21/68

Abstract: The handling device (1) has a pneumatically operated holder providing hydrodynamic retention forces for a semiconductor disc, a centre (3), having jet bores (5) around the outside of a suction pad (6) with suction bores (6a), provided by a reception device (4) supported by the handling device for rotation about its central axis, via an associated drive.