公开(公告)号：DE10062011A1

公开(公告)日：2002-06-27

申请号：DE10062011

申请日：2000-12-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  BINDER ALFRED ,  SCHERF WERNER ,  AIGNER KURT ,  KROUPA GERHARD

IPC: H01L21/683 ,  B65G54/02

Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.

公开(公告)号：AT328363T

公开(公告)日：2006-06-15

申请号：AT01128538

申请日：2001-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT ,  BINDER ALFRED ,  KROUPA GERHARD ,  MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  SCHERF WERNER ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN

IPC: H01L21/683 ,  H01L21/00 ,  H01L21/68

Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.

公开(公告)号：DE10056544A1

公开(公告)日：2002-06-06

申请号：DE10056544

申请日：2000-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KERHE MARIAN ,  GOLUBIC RICHARD ,  WOEHLERT STEFAN ,  MATSCHITSCH MARTIN ,  FERTSCHEI ANNEMARIE ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  SCHERF WERNER ,  RUDOLPH CONNY-NORBERT ,  LADINIG MARCELLO ,  KROUPA GERHARD ,  BINDER ALFRED ,  GIOVANNINI ALBERTO ,  AIGNER KURT ,  MANZONI GIULIO

IPC: B65G49/07 ,  H01L21/677 ,  H01L21/687

公开(公告)号：DE50014054D1

公开(公告)日：2007-03-29

申请号：DE50014054

申请日：2000-10-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  SCHERF WERNER ,  RUDOLPH CONNY-NORBERT ,  LADINIG MARCELLO ,  KROUPA GERHARD ,  BINDER ALFRED ,  GIOVANNINI ALBERTO ,  AIGNER KURT ,  MANZONI GIULIO

IPC: H01L21/00 ,  B25B11/00 ,  B65G47/00 ,  B66C1/00 ,  H01L21/683

公开(公告)号：DE10062011B4

公开(公告)日：2005-02-24

申请号：DE10062011

申请日：2000-12-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  BINDER ALFRED ,  SCHERF WERNER ,  AIGNER KURT ,  KROUPA GERHARD

IPC: H01L21/683 ,  B65G54/02

Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.