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公开(公告)号:AT328363T
公开(公告)日:2006-06-15
申请号:AT01128538
申请日:2001-11-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: AIGNER KURT , BINDER ALFRED , KROUPA GERHARD , MATSCHITSCH MARTIN , PUCHER GERHARD , SCHERF WERNER , UNTERWEGER JOSEF , ZERLAUTH STEFAN
IPC: H01L21/683 , H01L21/00 , H01L21/68
Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.
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公开(公告)号:DE10144409B4
公开(公告)日:2004-11-18
申请号:DE10144409
申请日:2001-09-10
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MATSCHITSCH MARTIN , BINDER ALFRED , UNTERWEGER JOSEF , KROUPA GERHARD
IPC: H01L21/00 , H01L21/683 , H01L21/687 , B25J15/06 , H01L21/68
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公开(公告)号:DE10303460A1
公开(公告)日:2004-08-19
申请号:DE10303460
申请日:2003-01-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: AIGNER KURT , BINDER ALFRED , MATSCHITSCH MARTIN , KALIN THOMAS , MAUNZ INGOMAR
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公开(公告)号:DE10145049C2
公开(公告)日:2003-10-16
申请号:DE10145049
申请日:2001-09-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MATSCHITSCH MARTIN , BINDER ALFRED , MICHENTHALER NORBERT , PUCHER GERHARD , KROUPA GERHARD , AIGNER KURT
IPC: H01L21/683 , B25J15/06
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公开(公告)号:DE502004007964D1
公开(公告)日:2008-10-16
申请号:DE502004007964
申请日:2004-01-26
Applicant: INFINEON TECHNOLOGIES AG
Inventor: AIGNER KURT DR , BINDER ALFRED , MATSCHITSCH MARTIN , MICHENTHALER NORBERT , KROUPA GERHARD , PUCHER GERHARD
IPC: H01L21/68 , H01L21/683
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公开(公告)号:DE10145049A1
公开(公告)日:2003-04-10
申请号:DE10145049
申请日:2001-09-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MATSCHITSCH MARTIN , BINDER ALFRED , MICHENTHALER NORBERT , PUCHER GERHARD , KROUPA GERHARD , AIGNER KURT
IPC: H01L21/683 , B25J15/06
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公开(公告)号:AT546832T
公开(公告)日:2012-03-15
申请号:AT02019577
申请日:2002-09-02
Applicant: INFINEON TECHNOLOGIES AG
Inventor: AIGNER KURT , BINDER ALFRED , KROUPA GERHARD , MATSCHITSCH MARTIN , MICHENTHALER NORBERT , PUCHER GERHARD
IPC: H01L21/683
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公开(公告)号:DE50014054D1
公开(公告)日:2007-03-29
申请号:DE50014054
申请日:2000-10-06
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MATSCHITSCH MARTIN , PUCHER GERHARD , UNTERWEGER JOSEF , ZERLAUTH STEFAN , SCHERF WERNER , RUDOLPH CONNY-NORBERT , LADINIG MARCELLO , KROUPA GERHARD , BINDER ALFRED , GIOVANNINI ALBERTO , AIGNER KURT , MANZONI GIULIO
IPC: H01L21/00 , B25B11/00 , B65G47/00 , B66C1/00 , H01L21/683
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公开(公告)号:DE10062011B4
公开(公告)日:2005-02-24
申请号:DE10062011
申请日:2000-12-13
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MATSCHITSCH MARTIN , PUCHER GERHARD , UNTERWEGER JOSEF , ZERLAUTH STEFAN , BINDER ALFRED , SCHERF WERNER , AIGNER KURT , KROUPA GERHARD
IPC: H01L21/683 , B65G54/02
Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.
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公开(公告)号:DE10303459A1
公开(公告)日:2004-08-19
申请号:DE10303459
申请日:2003-01-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BINDER ALFRED , KROUPA GERHARD , KOBLINSKI CARSTEN VON , MATSCHITSCH MARTIN
IPC: H01L21/00 , H01L21/68 , H01L21/687 , G01N21/95
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