公开(公告)号：DE502004007964D1

公开(公告)日：2008-10-16

申请号：DE502004007964

申请日：2004-01-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT DR ,  BINDER ALFRED ,  MATSCHITSCH MARTIN ,  MICHENTHALER NORBERT ,  KROUPA GERHARD ,  PUCHER GERHARD

IPC: H01L21/68 ,  H01L21/683

公开(公告)号：DE10145049A1

公开(公告)日：2003-04-10

申请号：DE10145049

申请日：2001-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  BINDER ALFRED ,  MICHENTHALER NORBERT ,  PUCHER GERHARD ,  KROUPA GERHARD ,  AIGNER KURT

IPC: H01L21/683 ,  B25J15/06

公开(公告)号：DE10161902B4

公开(公告)日：2005-06-23

申请号：DE10161902

申请日：2001-12-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  BINDER ALFRED ,  PUCHER GERHARD ,  KROUPA GERHARD ,  HIEBLER GUNTER

IPC: H01L21/00 ,  H01L21/68 ,  H01L21/683 ,  B65G47/91 ,  B25J15/00 ,  B81C3/00

公开(公告)号：DE10056544A1

公开(公告)日：2002-06-06

申请号：DE10056544

申请日：2000-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KERHE MARIAN ,  GOLUBIC RICHARD ,  WOEHLERT STEFAN ,  MATSCHITSCH MARTIN ,  FERTSCHEI ANNEMARIE ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN ,  SCHERF WERNER ,  RUDOLPH CONNY-NORBERT ,  LADINIG MARCELLO ,  KROUPA GERHARD ,  BINDER ALFRED ,  GIOVANNINI ALBERTO ,  AIGNER KURT ,  MANZONI GIULIO

IPC: B65G49/07 ,  H01L21/677 ,  H01L21/687

公开(公告)号：AT328363T

公开(公告)日：2006-06-15

申请号：AT01128538

申请日：2001-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT ,  BINDER ALFRED ,  KROUPA GERHARD ,  MATSCHITSCH MARTIN ,  PUCHER GERHARD ,  SCHERF WERNER ,  UNTERWEGER JOSEF ,  ZERLAUTH STEFAN

IPC: H01L21/683 ,  H01L21/00 ,  H01L21/68

Abstract: There is a first device (5), such as a nozzle opening into surface (25) facing the wafer, generating tensile forces towards the gripper (100), due to Bernouli's principle, by compressed gas. There is at least one second device (2,3) for holding the disc-shaped wafer on the gripper, due to electromagnetic field generated forces. The second device is designed to generate an electrostatic field and/or Coulomb's forces. The nozzle may be at a sharp angle, or parallel, to the surface, facing the wafer.

公开(公告)号：DE10144409B4

公开(公告)日：2004-11-18

申请号：DE10144409

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  BINDER ALFRED ,  UNTERWEGER JOSEF ,  KROUPA GERHARD

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/687 ,  B25J15/06 ,  H01L21/68

公开(公告)号：DE10145049C2

公开(公告)日：2003-10-16

申请号：DE10145049

申请日：2001-09-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  BINDER ALFRED ,  MICHENTHALER NORBERT ,  PUCHER GERHARD ,  KROUPA GERHARD ,  AIGNER KURT

IPC: H01L21/683 ,  B25J15/06

公开(公告)号：DE502004006284D1

公开(公告)日：2008-04-10

申请号：DE502004006284

申请日：2004-01-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BINDER ALFRED ,  KROUPA GERHARD ,  VON KOBLINSKI CARSTEN DR ,  MATSCHITSCH MARTIN

IPC: H01L21/00 ,  H01L21/68 ,  H01L21/687

公开(公告)号：DE10161902A1

公开(公告)日：2003-07-10

申请号：DE10161902

申请日：2001-12-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  BINDER ALFRED ,  PUCHER GERHARD ,  KROUPA GERHARD ,  HIEBLER GUNTER

IPC: H01L21/00 ,  H01L21/68 ,  H01L21/683 ,  B65G47/91 ,  B25J15/00 ,  B81C3/00

公开(公告)号：DE10144409A1

公开(公告)日：2003-03-27

申请号：DE10144409

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  BINDER ALFRED ,  UNTERWEGER JOSEF ,  KROUPA GERHARD

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/687 ,  B25J15/06 ,  H01L21/68