公开(公告)号：DE102004019724A1

公开(公告)日：2005-08-04

申请号：DE102004019724

申请日：2004-04-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/065 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14

Abstract: Memory module (1) comprises circuit board (2) with region (R), which experiences highest deformation on circuit board bending, which carries semiconductor components (3). On stressed region is fitted at least one further semiconductor component (4), e.g. logic integrated circuit.Mechanical bracing element is located in stressed region of circuit board, either at front side of circuit board, or at its rear side under further semiconductor component. INDEPENDENT CLAIM is included for computer system incorporating inventing memory module.

公开(公告)号：DE10216823A1

公开(公告)日：2003-11-06

申请号：DE10216823

申请日：2002-04-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  SYRI ERICH

IPC: H01L25/065 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K1/18 ,  G11C5/06 ,  H01L27/10

Abstract: A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.

公开(公告)号：DE102004059232B4

公开(公告)日：2011-05-05

申请号：DE102004059232

申请日：2004-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/34 ,  H01L23/50

公开(公告)号：DE102005014674A1

公开(公告)日：2006-10-19

申请号：DE102005014674

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L23/16 ,  H01L23/34 ,  H01L23/498

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

公开(公告)号：DE102004011202A1

公开(公告)日：2005-07-14

申请号：DE102004011202

申请日：2004-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H05K7/20

Abstract: The device has a fan (7) with an air pressure outlet side (13) connected to connector that directs cooling air from the fan to semiconductor components e.g. dynamic RAM, which are to be cooled. The connector is flexible and is connected to the fan. Curved tubes (11) are firmly connected to the semiconductor components. The connector exhibits multiple discharge openings in which a memory module (4) is present. An independent claim is also included for a computer system having an input device, a processor, a memory and an output device.

公开(公告)号：DE102009044714B4

公开(公告)日：2017-09-21

申请号：DE102009044714

申请日：2009-12-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  SYRI ERICH ,  GRÜNDLER GEROLD ,  HÖGERL JÜRGEN ,  STRUTZ VOLKER ,  LUTZ HERMANN JOSEF

IPC: H01L21/58 ,  H01L23/12 ,  H05K3/32

Abstract: Verfahren zum Montieren eines Halbleiter-Bauelements, umfassend: Bereitstellen eines an einem elastischen Träger (36) angebrachten Chips (38); Stützen des elastischen Trägers (36) mit einer Versteifung (52, 62, 92); und Entfernen der Versteifung (52, 62, 92) von dem elastischen Träger (36) nach dem Anbringen des elastischen Trägers (36) an einer Platine (32), wobei der elastische Träger (36) an der Platine (32) angebracht bleibt und wobei der elastische Träger (36) ein Elastizitätsmodul zwischen 2 und 12 kN/mm2 aufweist.

公开(公告)号：DE102005012216B4

公开(公告)日：2008-11-13

申请号：DE102005012216

申请日：2005-03-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/36 ,  H01L23/40 ,  H05K7/20

Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

公开(公告)号：DE102006022748A1

公开(公告)日：2007-11-15

申请号：DE102006022748

申请日：2006-05-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L21/50 ,  H01L23/31 ,  H01L25/00 ,  H05K1/18 ,  H05K3/30 ,  H05K7/06

公开(公告)号：DE102004059232A1

公开(公告)日：2006-06-14

申请号：DE102004059232

申请日：2004-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/28 ,  H01L23/34 ,  H01L23/50

Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

公开(公告)号：DE10361106A1

公开(公告)日：2005-05-04

申请号：DE10361106

申请日：2003-12-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L25/10 ,  H01L23/50

Abstract: Semiconductor component contains semiconductor chip (1) and rigid wiring board (2) with outer contacts (3), with chip carried by wiring board whose area is larger than area of semiconductor chip. Resilient bending element structures (4) are included in wiring board for its bending deformation. Preferably chip comprises flipchip contacts (5) coupled to contact terminal pads on top side (6) of wiring board. They are linked to board underside (9) via conductive tracks on top side and through contacts. Independent claims are included for manufacture of wafer with semiconductor chips and wiring boards.