公开(公告)号：DE102004059232B4

公开(公告)日：2011-05-05

申请号：DE102004059232

申请日：2004-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/34 ,  H01L23/50

公开(公告)号：DE102006007381A1

公开(公告)日：2007-08-23

申请号：DE102006007381

申请日：2006-02-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  KILLER THOMAS

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/50

Abstract: The component comprises a semiconductor component (1), an ultra-wide-band semiconductor chip (8) and a multilevel circuit substrate (9) with a lower metal layer (M1) and an upper metal layer (M4). The semiconductor component is surface-mounted on a circuit plate. The component has an antenna (12), which stands in connection with the ultra-wide-band semiconductor chip over the circuit of the circuit substrate, and is arranged above semiconductor chip and circuit substrate. The semiconductor component of the ultra-wide-band circuit has a screen. An independent claim is also included for the method for production of ultra-wide-semiconductor band.

公开(公告)号：DE102005014674A1

公开(公告)日：2006-10-19

申请号：DE102005014674

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L23/16 ,  H01L23/34 ,  H01L23/498

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

公开(公告)号：DE10322757A1

公开(公告)日：2004-12-30

申请号：DE10322757

申请日：2003-05-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  ALTHAUS HANS LUDWIG ,  WITTL JOSEF ,  HARTL ALFRED ,  WEBERPALS FRANK

IPC: G02B6/42 ,  H01L31/0203

Abstract: The arrangement has a surface mount optoelectronic component (1), a holding arrangement (3) for accommodating and aligning an optical fiber (4) for coupling to the component and a circuit board (2) with electrical leads on which the component can be surface mounted. The optical axis (5) of the component is perpendicular to the plane of the board and the holding arrangement connects to the side of the component facing away from the circuit board.

公开(公告)号：DE102009044714A1

公开(公告)日：2010-06-24

申请号：DE102009044714

申请日：2009-12-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  STRUTZ VOLKER ,  LUTZ HERMANN JOSEF

IPC: H01L21/58 ,  H01L23/12 ,  H05K3/32

Abstract: Ein Verfahren zum Montieren eines Halbleiter-Bauelements beinhaltet das Bereitstellen eines an einem elastischen Träger angebrachten Chips und das Stützen des elastischen Trägers mit einer Versteifung. Das Verfahren beinhaltet außerdem das Entfernen der Versteifung von dem elastischen Träger nach dem Anbringen des elastischen Trägers an einer Platine.

公开(公告)号：DE102005014674B4

公开(公告)日：2010-02-11

申请号：DE102005014674

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L23/16 ,  H01L23/34 ,  H01L23/498

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

公开(公告)号：DE102005012216A1

公开(公告)日：2006-09-21

申请号：DE102005012216

申请日：2005-03-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/36 ,  H05K7/20

Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

公开(公告)号：DE10321257B4

公开(公告)日：2006-04-27

申请号：DE10321257

申请日：2003-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS

IPC: H01L23/04 ,  B81B7/02 ,  H01L23/495 ,  H01L33/62

Abstract: A lead frame (1) for receiving and contacting electrical and/or optoelectronic components comprises at least two regions (10,11) of different thicknesses (d1,d2). Preferably at least one of the regions has a reduced thickness and can hold an optical, electrical or optoelectronic component. An independent claim is also included for a component mounted as above.

公开(公告)号：DE10329988B3

公开(公告)日：2005-01-13

申请号：DE10329988

申请日：2003-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ALTHAUS HANS-LUDWIG ,  PLICKERT VOLKER ,  MELCHIOR LUTZ ,  KILLER THOMAS

IPC: G02B6/42

Abstract: The invention relates to an optoelectronic transmission and/or reception arrangement. The arrangement includes a transmission and/or reception module containing an optoelectronic transmission and/or reception component, and a plug interface for the coupling of an optical fiber thereto. An optical waveguide section is arranged in the plug interface, and at one of its ends is optically coupled to the transmission and/or reception component. At its other end, the optical waveguide section is configured to be coupled to an optical fiber. The arrangement may further include a lens for optical coupling of the light between the optical waveguide section and the transmission and/or reception component. The lens and the optical waveguide section, in one example, are formed as a prefabricated subassembly, in which the lens is fixedly arranged at a defined distance from one end face of the optical waveguide section.

公开(公告)号：DE102018114071A1

公开(公告)日：2019-05-29

申请号：DE102018114071

申请日：2018-06-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS

IPC: H01L21/673 ,  B65D85/86 ,  H01L21/683 ,  H01L23/544 ,  H05K13/02

Abstract: Gemäß einer Ausführungsform wird eine Chip-Blister-Anordnung beschrieben, aufweisend einen Chip-Blister mit einer ersten Seite und einer zweiten Seite und Kavitäten für Halbleiter-Chips, wobei jede Kavität zu der ersten Seite hin eine erste Öffnung und zu der zweiten Seite hin eine zweite Öffnung aufweist, eine erste Abdeckungsschicht auf der ersten Seite des Chip-Blisters, die die Kavitäten auf der ersten Seite des Chip-Blisters verschließt und eine zweite Abdeckungsschicht auf der zweiten Seite des Chip-Blisters, die die Kavitäten auf der zweiten Seite des Chip-Blisters verschließt.