公开(公告)号：WO2005081309A3

公开(公告)日：2006-03-09

申请号：PCT/DE2005000299

申请日：2005-02-22

Applicant: INFINEON TECHNOLOGIES AG ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  STRUTZ VOLKER ,  SYRI ERICH

Inventor： GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/36 ,  H01L23/40 ,  H01L23/467

CPC classification number: H01L23/4093 ,  F28F2280/10 ,  H01L23/36 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a cooling system (22) for devices comprising power semi-conductors (1) and methods for cooling said type of device. The cooling system also comprises circuit boards (4) which are arranged on a circuit support (10) in plug in contact strips (7). The cooling system itself comprises a cooling plate (11) which is mounted in a pivotable manner on one of the plug-in contact strips (7) in the region of the power semi-conductor components (1). Said cooling plate (11) can be pivoted about an axis (14) in such a manner that it takes a first position, which is pivoted away from the circuit board (4), and a second position wherein the cooling plate (11) rests on the power semi-conductor component (1).

Abstract translation: 本发明涉及一种冷却系统（22），用于与功率半导体（1）以及用于冷却这样的设备的方法的设备。 为此，在冷却系统中的电路板（4），其被布置在所述插头接触条（7）的电路载体（10）上。 该冷却系统本身具有被枢转地安装在功率半导体元件（1）的区域中的插塞接触条（7）中的一个的冷却板（11）。 冷却板（11）可绕轴线（14），使得其包括第一位置从所述印刷电路板（4），和第二位置，枢转离开，其中功率半导体组件上的冷却板（11）（1） 休息占据。

公开(公告)号：DE102006015241A1

公开(公告)日：2007-06-28

申请号：DE102006015241

申请日：2006-03-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  STRUTZ VOLKER

IPC: H01L23/50 ,  H01L21/60

Abstract: Component has a plastic housing (7) and outer contacts (8), which are embedded in the housing. The contacts are accessible on a lower side of the housing, and are arranged in the lower border angle region. An expansion joint (14) is arranged in the lower side of the plastic housing. The joint is provided between the border angle region and the outer contact surfaces (11) of the outer contact and a central region (12) of the housing. A semiconductor chip is arranged in the central region. An independent claim is also included for: a method for manufacturing a semiconductor component.

公开(公告)号：DE102004019724A1

公开(公告)日：2005-08-04

申请号：DE102004019724

申请日：2004-04-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/065 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14

Abstract: Memory module (1) comprises circuit board (2) with region (R), which experiences highest deformation on circuit board bending, which carries semiconductor components (3). On stressed region is fitted at least one further semiconductor component (4), e.g. logic integrated circuit.Mechanical bracing element is located in stressed region of circuit board, either at front side of circuit board, or at its rear side under further semiconductor component. INDEPENDENT CLAIM is included for computer system incorporating inventing memory module.

公开(公告)号：DE102004059232B4

公开(公告)日：2011-05-05

申请号：DE102004059232

申请日：2004-12-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/34 ,  H01L23/50

公开(公告)号：DE102005014674A1

公开(公告)日：2006-10-19

申请号：DE102005014674

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L23/16 ,  H01L23/34 ,  H01L23/498

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

公开(公告)号：DE102004011202A1

公开(公告)日：2005-07-14

申请号：DE102004011202

申请日：2004-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H05K7/20

Abstract: The device has a fan (7) with an air pressure outlet side (13) connected to connector that directs cooling air from the fan to semiconductor components e.g. dynamic RAM, which are to be cooled. The connector is flexible and is connected to the fan. Curved tubes (11) are firmly connected to the semiconductor components. The connector exhibits multiple discharge openings in which a memory module (4) is present. An independent claim is also included for a computer system having an input device, a processor, a memory and an output device.

公开(公告)号：DE102009044714A1

公开(公告)日：2010-06-24

申请号：DE102009044714

申请日：2009-12-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  STRUTZ VOLKER ,  LUTZ HERMANN JOSEF

IPC: H01L21/58 ,  H01L23/12 ,  H05K3/32

Abstract: Ein Verfahren zum Montieren eines Halbleiter-Bauelements beinhaltet das Bereitstellen eines an einem elastischen Träger angebrachten Chips und das Stützen des elastischen Trägers mit einer Versteifung. Das Verfahren beinhaltet außerdem das Entfernen der Versteifung von dem elastischen Träger nach dem Anbringen des elastischen Trägers an einer Platine.

公开(公告)号：DE102005014674B4

公开(公告)日：2010-02-11

申请号：DE102005014674

申请日：2005-03-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L25/10 ,  H01L23/16 ,  H01L23/34 ,  H01L23/498

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

公开(公告)号：DE102005012216A1

公开(公告)日：2006-09-21

申请号：DE102005012216

申请日：2005-03-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SYRI ERICH ,  GRUENDLER GEROLD ,  HOEGERL JUERGEN ,  KILLER THOMAS ,  STRUTZ VOLKER

IPC: H01L23/36 ,  H05K7/20

Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

公开(公告)号：DE102004009055A1

公开(公告)日：2005-09-08

申请号：DE102004009055

申请日：2004-02-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GRUENDLER GEROLD ,  STRUTZ VOLKER ,  SYRI ERICH

IPC: H01L23/36 ,  H01L23/40 ,  H01L23/467 ,  H05K7/20 ,  G06F1/20 ,  H01L23/34 ,  H01R12/18

Abstract: A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.