公开(公告)号：US12063759B2

公开(公告)日：2024-08-13

申请号：US16927701

申请日：2020-07-13

Applicant: Intel Corporation

Inventor： Berhanu Wondimu ,  David Shia ,  Xudong Tang

IPC: H05K7/20 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20

CPC classification number: H05K7/20781 ,  B23P15/26 ,  G05B19/042 ,  G06F1/20 ,  G05B2219/25252 ,  G05B2219/25258 ,  G06F2200/201

Abstract: Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20240094476A1

公开(公告)日：2024-03-21

申请号：US17949417

申请日：2022-09-21

Applicant: Intel Corporation

Inventor： Wesley B. Morgan ,  David Shia ,  Mohanraj Prabhugoud ,  Eric J. M. Moret ,  Pooya Tadayon

IPC: G02B6/38

CPC classification number: G02B6/3871 ,  G02B6/3873 ,  G02B6/3887

Abstract: Technologies for pluggable optical connectors are disclosed. In the illustrative embodiment, an optical plug includes a ferrule with one or more optical fibers. The optical plug also includes a ferrule holder that holds the ferrule and a housing that encloses the ferrule and ferrule holder. The ferrule holder can move relative to the house, and the ferrule can move relative to the ferrule holder and the housing. As the optical plug is plugged into a socket, alignment features in the housing coarsely align the ferrule. Intermediate alignment features in the ferrule holder then engage, aligning the ferrule more precisely. As the optical plug is fully plugged in, fine alignment features in the ferrule engage, precisely aligning the ferrule and the optical fibers with the optical socket.

公开(公告)号：US20230170327A1

公开(公告)日：2023-06-01

申请号：US17538603

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Jin Yang ,  David Shia ,  Adel A. Elsherbini ,  Christopher M. Pelto ,  Kimin Jun ,  Bradley A. Jackson ,  Robert J. Munoz ,  Shawna M. Liff ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L25/0652 ,  H01L2225/06517 ,  H01L24/08

Abstract: A microelectronic assembly is provided, comprising: a first IC die coupled to a surface with first interconnects having a first pitch; and a second IC die coupled to the surface with second interconnects having a second pitch. The second pitch is greater than the first pitch, and the first pitch is less than 10 micrometers. In another embodiment, a microelectronic assembly is provided, comprising: a first stack coupled to a surface, the first stack comprising a first number of IC dies; and a second stack coupled to the surface, the second stack comprising a second number of IC dies, in which: the first stack and the second stack are laterally surrounded by a dielectric, the first stack and the second stack have a same thickness, and the first number is less than the second number.

公开(公告)号：US20230022058A1

公开(公告)日：2023-01-26

申请号：US17956540

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Phil Geng ,  Ralph Miele ,  David Shia

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00

Abstract: Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methods are disclosed. An example back plate includes a ceramic substrate having a first surface and a second surface opposite the first surface. The example back plate further includes metal coupled to the ceramic substrate. At least a portion of the metal is disposed between planes defined by the first and second surfaces of the ceramic substrate.

公开(公告)号：US10677845B2

公开(公告)日：2020-06-09

申请号：US15447095

申请日：2017-03-01

Applicant: Intel Corporation

Inventor： Abram M. Detofsky ,  Evan M. Fledell ,  Mustapha A. Abdulai ,  John M. Peterson ,  Dinia P. Kitendaugh ,  Pooya Tadayon ,  Jin Pan ,  David Shia

IPC: G01R31/319 ,  G01R31/28

Abstract: A testing system and process comprises a converged test platform for structural testing and system testing of an integrated circuit device. The testing system comprises a converged test platform supported by a baseboard of an automated test assembly. The converged test platform comprises a DUT socket for testing an integrated circuit device, at least one testing electronic component selectively electrically coupled to the DUT socket by at least one switch operable to electrically switch at least some testing signals between the automated testing assembly and the DUT socket to the at least one testing electronic component for both structural testing and system testing of the integrated circuit device within the same test flow. The switch(es) and testing electronic component(s) (e.g., an FPGA) can be reprogrammable for testing flexibility and faster through put. Associated processes and methods are provided for both class and system testing using the converged test platform for back-end and front-end testing.

公开(公告)号：US09366482B2

公开(公告)日：2016-06-14

申请号：US13631957

申请日：2012-09-29

Applicant: INTEL CORPORATION

Inventor： Jin Yang ,  David Shia

IPC: F28D15/02 ,  H01L23/433 ,  H01L23/40 ,  H01L23/427 ,  H01L23/00 ,  F28F13/00

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/02 ,  F28D15/0241 ,  F28F2013/005 ,  F28F2280/08 ,  H01L23/427 ,  H01L23/4338 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.

Abstract translation: 描述装配和方法。 一个组件包括第一板和第二板。 组件还包括位于第一板和第二板之间的可调热管，可调热管与第一板和第二板热接触。 在另一方面，多个弹簧可以位于第一板和第二板之间。 描述和要求保护其他实施例。

公开(公告)号：US20250071924A1

公开(公告)日：2025-02-27

申请号：US18940819

申请日：2024-11-07

Applicant: Intel Corporation

Inventor： Phil Geng ,  David Shia ,  Xiang Li ,  George Vergis ,  Ralph Miele ,  Sanjoy Saha ,  Jeffory Smalley

IPC: H05K7/14

Abstract: Methods and apparatus relating to tall Dual Inline Memory Module (DIMM) structural retention are described. In one embodiment, a Dual In-Line Memory Module (DIMM) retention frame is coupled to a top portion of a tall (e.g., “two unit” or taller) DIMM. A plurality of fasteners physically attach the DIMM retention frame to a Printed Circuit Board (PCB). The DIMM retention frame reduces movement of the tall DIMM. Other embodiments are also claimed and disclosed.

公开(公告)号：US12133357B2

公开(公告)日：2024-10-29

申请号：US17123760

申请日：2020-12-16

Applicant: Intel Corporation

Inventor： Jin Yang ,  David Shia ,  Mohanraj Prabhugoud ,  Olaotan Elenitoba-Johnson ,  Craig Jahne ,  Phil Geng

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20418 ,  H05K7/20509

Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US20240222288A1

公开(公告)日：2024-07-04

申请号：US18090140

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： David Shia ,  Timothy Gosselin ,  Aravindha Antoniswamy ,  Sergio Antonio Chan Arguedas ,  Elah Bozorg-Grayeli ,  Johnny Cook, JR. ,  Steven Klein ,  Rick Canham

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/427 ,  H01L23/49

CPC classification number: H01L23/544 ,  H01L23/427 ,  H01L23/49 ,  H01L24/08 ,  H01L24/48 ,  H01L2224/08113 ,  H01L2224/48229 ,  H01L2924/15165 ,  H01L2924/1711 ,  H01L2924/173 ,  H01L2924/17724 ,  H01L2924/1776

Abstract: Integrated circuit (IC) device substrates and structures for mating and aligning with sockets. An IC device may include a frame on and around a substrate, which may include glass or silicon. The frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. A heat spreader may be coupled to an IC die and extend beyond the substrate or be coupled to the frame. The heat spreader may include a heat pipe. The IC device may be part of an IC system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.