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公开(公告)号:JPS60101725A
公开(公告)日:1985-06-05
申请号:JP17166784
申请日:1984-08-20
Applicant: IBM
Inventor: JIEEMUZU EKONOMII , ANAGUNOSUTEISU EFUSATASHIOSU Z
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公开(公告)号:JPS6044521A
公开(公告)日:1985-03-09
申请号:JP9578484
申请日:1984-05-15
Applicant: IBM
Inventor: JIEEMUZU EKONOMII , JIYON AARU SASUKO , UIRII FUORUKUSEN , ROBIN EI UIITAA
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公开(公告)号:JPS58206005A
公开(公告)日:1983-12-01
申请号:JP5171483
申请日:1983-03-29
Applicant: Ibm
Inventor: ROJIYAA JIEI KURAAKU , JIEEMUZU EKONOMII , MEARI AN FURANDERA , JIYON RICHIYAADO SASUKO , ROBIN AN UIITAA
IPC: H01B3/30 , C08F38/00 , G03F7/025 , H01L21/312 , H01L23/14 , H01L23/498
CPC classification number: G03F7/025 , H01L21/312 , H01L23/145 , H01L23/49894 , H01L2924/0002 , H01L2924/00
Abstract: An electronic circuit having an electrically conductive pattern formed on a substrate (1) and having on at least one surface of the substrate a film (5) obtained from a soluble polymerizable oligomer of the formula: wherein M is -C IDENTICAL C-, -C IDENTICAL C-C IDENTICAL C-, -O-, wherein R is an alkyl or aromatic group; wherein A is an aromatic group; wherein x is the number of appendant acetylenic groups and is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.
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公开(公告)号:JPS57121064A
公开(公告)日:1982-07-28
申请号:JP19639481
申请日:1981-12-08
Applicant: Ibm
Inventor: JIEEMUZU EKONOMII , MIARI AN FURANDERA
IPC: C09D5/23 , B05D5/00 , B05D7/14 , B05D7/24 , C09D4/00 , C09D161/04 , C09D163/00 , C09D179/08 , G11B5/84
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公开(公告)号:JPS5650939A
公开(公告)日:1981-05-08
申请号:JP7844480
申请日:1980-06-12
Applicant: IBM
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