公开(公告)号：JPS5496025A

公开(公告)日：1979-07-30

申请号：JP11247178

申请日：1978-09-14

Applicant: IBM

Inventor： JIEEMUZU ARUBAATO KIYAROSAASU ,  JIEEMUZU EKONOMII ,  OOGASUTASU SENIZA OOANO

IPC: H01L21/30 ,  G03C1/72 ,  G03F7/022 ,  G03F7/30 ,  G03F7/32 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H05K3/06

公开(公告)号：JPS6062461A

公开(公告)日：1985-04-10

申请号：JP15943084

申请日：1984-07-31

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  ANAGUNOSUTEISU EFUSUTASHIOSU Z

IPC: H01L23/12 ,  B24B39/00 ,  B24B39/06 ,  C22F1/00 ,  C22F1/04

公开(公告)号：JPS5842041A

公开(公告)日：1983-03-11

申请号：JP10148182

申请日：1982-06-15

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  ROI JIYON GURITSUTAA ,  HIROYUKI HIRAOKA

IPC: G03C1/72 ,  C08G8/00 ,  G03F7/039

Abstract: A positive working electron beam resist comprising a resinous condensation product of formaldehyde with a phenol or a cresol having a chloro substituent ortho to the hydroxyl group on its aromatic ring is imagewise exposed to electron beam irradiation and then the exposed portion of the resist is dissolved away to leave a petterned mask.

公开(公告)号：JPS5686966A

公开(公告)日：1981-07-15

申请号：JP14583580

申请日：1980-10-20

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  MEARII AN FURANDERA ,  CHIEN II RIU

IPC: C08F38/00 ,  B05D3/10 ,  C09D4/00 ,  C09D123/26 ,  C09D137/00

公开(公告)号：JPH02235081A

公开(公告)日：1990-09-18

申请号：JP1513490

申请日：1990-01-26

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  JIEEMUZU RAPUTON HEDORITSUKU J ,  JIEFURII UIRIAMU RABADEII

IPC: C08G65/48 ,  C08L71/00 ,  C08L71/10 ,  G03G15/20

Abstract: PURPOSE: To improve thermal stability by incorporating elastomer having a specified glass transition temp. and a specified structure as a matrix. CONSTITUTION: Elastomer having 80-180 deg.C glass transition temp. and a structure represented by formula I is incorporated as a matrix to obtain the objective hot roll fuser contg. elastomer for a fuser roll having high thermula stability. In the formula, Ar is an arom. cyclic structure, Y is O, S, C=O, SO2 , C(CH3 )2 , C(CF3 )2 , CH2 or (CF2 )n and X is a structure represented by formula II or III.

公开(公告)号：JPS60154249A

公开(公告)日：1985-08-13

申请号：JP25066184

申请日：1984-11-29

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  DENISU RICHIYAADO MATSUKIIN ,  ROBAATO DENISU MIRAA ,  KAARUTON GURANTO UIRUSON

IPC: G03C1/72 ,  C08L61/00 ,  C08L61/04 ,  C08L61/06 ,  G03F7/022 ,  H01L21/027

公开(公告)号：JPS59179667A

公开(公告)日：1984-10-12

申请号：JP22456483

申请日：1983-11-30

Applicant: Ibm

Inventor： JIEEMUZU EKONOMII ,  BUIRI FUORUKUSEN ,  DOU YUNGU YOON

IPC: C09D177/00 ,  B05D3/02 ,  B05D5/00 ,  B05D7/24 ,  C08G73/10 ,  C09D179/08

CPC classification number: B05D3/0209 ,  C08G73/1071 ,  Y10T428/31721

公开(公告)号：JPS55132041A

公开(公告)日：1980-10-14

申请号：JP370480

申请日：1980-01-18

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  JIEEMUZU RICHIYAADO RIARA ,  RESUTAA AARIN PEDAASUN

IPC: H01L21/302 ,  H01L21/027 ,  H01L21/30 ,  H01L21/3065

公开(公告)号：JPS5560506A

公开(公告)日：1980-05-07

申请号：JP10417779

申请日：1979-08-17

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  MEARII AN FURANDERA

IPC: C07C43/205 ,  C07C1/00 ,  C07C2/00 ,  C07C2/04 ,  C07C15/44 ,  C07C15/50 ,  C07C41/00 ,  C07C43/257 ,  C07C67/00 ,  C07C313/00 ,  C07C317/00 ,  C07C317/14 ,  C07C321/28 ,  C07C321/30 ,  C07F7/08 ,  C07F7/18 ,  C08F4/00 ,  C08F4/06 ,  C08F38/00

公开(公告)号：JPS61102742A

公开(公告)日：1986-05-21

申请号：JP15529285

申请日：1985-07-16

Applicant: Ibm

Inventor： INGU INGU CHIENGU ,  DANIERU JIYOSEFU DAUSON ,  JIEEMUZU EKONOMII ,  SARII AN SUWANSON ,  ROBAATO JIEEMUZU TSUUIIGU

IPC: H01L21/76 ,  H01L21/312 ,  H01L21/762

CPC classification number: H01L21/76224 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/312

Abstract: Deep dielectric isolation trenches in semiconductor devices filled by a process using a filtered solution of a polyaromatic oligomer with reactive ethynyl groups, said solution having a viscosity of between 2 x 10 and 2 x 10 m /s.