公开(公告)号：US12262478B2

公开(公告)日：2025-03-25

申请号：US17473915

申请日：2021-09-13

Applicant: Intel Corporation

Inventor： Jin Yang ,  David Shia

IPC: H05K3/28 ,  H05K7/20

Abstract: An apparatus is described. The electronic circuit board having electronic components thereon. A protective material coated on an exposed material of the electronic circuit board and the electronic components. The protective material being chemically inert with the exposed material. The protective material being chemically inert with an immersion bath cooling liquid that the electronic circuit board and the electronic components are to be immersed within. A thermal cooling structure of one of the electronic components that is designed to transfer heat into the immersion bath cooling liquid is not coated with the protective material.

公开(公告)号：US12248344B2

公开(公告)日：2025-03-11

申请号：US17214230

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Kristin L. Weldon ,  David Rodriguez ,  Jin Yang ,  David Shia ,  Jimmy Chuang ,  Mohanraj Prabhugoud ,  Mark Edmund Sprenger

IPC: G06F1/20 ,  H05K7/20

Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

Applicant: Intel Corporation

Inventor： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.

公开(公告)号：US20230170327A1

公开(公告)日：2023-06-01

申请号：US17538603

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Jin Yang ,  David Shia ,  Adel A. Elsherbini ,  Christopher M. Pelto ,  Kimin Jun ,  Bradley A. Jackson ,  Robert J. Munoz ,  Shawna M. Liff ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L25/0652 ,  H01L2225/06517 ,  H01L24/08

Abstract: A microelectronic assembly is provided, comprising: a first IC die coupled to a surface with first interconnects having a first pitch; and a second IC die coupled to the surface with second interconnects having a second pitch. The second pitch is greater than the first pitch, and the first pitch is less than 10 micrometers. In another embodiment, a microelectronic assembly is provided, comprising: a first stack coupled to a surface, the first stack comprising a first number of IC dies; and a second stack coupled to the surface, the second stack comprising a second number of IC dies, in which: the first stack and the second stack are laterally surrounded by a dielectric, the first stack and the second stack have a same thickness, and the first number is less than the second number.

公开(公告)号：US20180113794A1

公开(公告)日：2018-04-26

申请号：US15569331

申请日：2015-06-10

Applicant: Intel Corporation

Inventor： Jin Yang ,  Junchao Han ,  Zidong Jiang ,  Yongnian Le

IPC: G06F11/36 ,  G06F9/54

CPC classification number: G06F11/3668 ,  G06F8/447 ,  G06F9/54 ,  G06T11/00

Abstract: Various systems and methods for analyzing WebGL applications are described herein. A system comprises a recorder service module to intercept a plurality of graphics application programming interface (API) function calls, each of the plurality of graphics API functions calls having an associated execution context; a command translator module to translate the plurality of graphics API functions calls to a set of generic API invocations; a code generator module to generate executable code from the set of generic API invocations; and a replayer service module to test the executable code.

公开(公告)号：US09366482B2

公开(公告)日：2016-06-14

申请号：US13631957

申请日：2012-09-29

Applicant: INTEL CORPORATION

Inventor： Jin Yang ,  David Shia

IPC: F28D15/02 ,  H01L23/433 ,  H01L23/40 ,  H01L23/427 ,  H01L23/00 ,  F28F13/00

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/02 ,  F28D15/0241 ,  F28F2013/005 ,  F28F2280/08 ,  H01L23/427 ,  H01L23/4338 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.

Abstract translation: 描述装配和方法。 一个组件包括第一板和第二板。 组件还包括位于第一板和第二板之间的可调热管，可调热管与第一板和第二板热接触。 在另一方面，多个弹簧可以位于第一板和第二板之间。 描述和要求保护其他实施例。

公开(公告)号：US08926196B2

公开(公告)日：2015-01-06

申请号：US13631619

申请日：2012-09-28

Applicant: Intel Corporation

Inventor： Abram M. Detofsky ,  Chukwunenye S. Nnebe ,  Jin Yang ,  Tak M. Mak ,  Sasha N. Oster

IPC: G02B6/36

CPC classification number: G02B6/423 ,  G02B6/4204

Abstract: Provided are a method and a system, in which a first device aligns a chip to a socket along a first axis. A second device aligns the chip to the socket along a second axis, and a third device aligns the chip to the socket along a plane formed by the first axis and a third axis. Also provided is a system comprising a first optical element, and a second optical element, where a first elastic element is coupled to the first optical element, and a second elastic element is coupled to the second optical element, and where the first elastic element is aligned to the second elastic element via elastic coupling.

Abstract translation: 提供了一种方法和系统，其中第一设备沿着第一轴将芯片对准插座。 第二装置沿着第二轴将芯片对准插座，并且第三装置沿着由第一轴线和第三轴线形成的平面将芯片对准插座。 还提供了一种包括第一光学元件和第二光学元件的系统，其中第一弹性元件联接到第一光学元件，并且第二弹性元件联接到第二光学元件，并且其中第一弹性元件是 通过弹性联轴器对准第二弹性元件。

公开(公告)号：US12293956B2

公开(公告)日：2025-05-06

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin Yang ,  Jimmy Chuang ,  Xicai Jing ,  Yuan-Liang Li ,  Yuyang Xia ,  David Shia ,  Mohanraj Prabhugoud ,  Maria de la Luz Belmont ,  Oscar Farias Moguel ,  Andres Ramirez Macias ,  Javier Avalos Garcia ,  Jessica Gullbrand ,  Shaorong Zhou ,  Chia-Pin Chiu ,  Xiaojin Gu

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20210345519A1

公开(公告)日：2021-11-04

申请号：US17359405

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Wenbin Tian ,  Yingqiong Bu ,  Yanbing Sun ,  Yang Yao ,  Yuehong Fan ,  Ming Zhang ,  Casey Robert Winkel ,  Jin Yang ,  David Shia ,  Mohanraj Prabhugoud

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L23/40

Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.