Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a silicon-containing film for a multilayer resist process, which is excellent in storage stability while preventing an increase of foreign substances generated in the composition due to deterioration with age, and which forms a silicon-containing film excellent in adhesion to a resist film and in reproducibility of a resist pattern and having adequate resistance to a developer and to oxygen ashing in resist removal. SOLUTION: The composition for forming a silicon-containing film for a multilayer resist process includes a polysiloxane (A) and an organic solvent (B), wherein the organic solvent (B) includes 1-50 mass% of an alcoholic organic solvent (B1) and 1-30 mass% of an organic solvent (B2) represented by formula (2) (wherein m denotes an integer of 1-3), provided that the total amount of the organic solvent (B) is considered to be 100 mass%. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a silicon-containing film for a multilayer resist process, which forms a silicon-containing film having a small amount of a permeated resist material and stably forms a resist pattern having no trailing, etc., and also to provide a silicon-containing film and a method for forming a pattern. SOLUTION: The composition for forming the silicon-containing film comprises a polymer (A) derived from a compound (a1) represented by general formula (1) (wherein R 1 s are each independently 1-4C alkyl), a compound (a2) represented by general formula (2) (wherein R 2 is a monofunctional organic group), and a compound (a3) represented by general formula (3) (wherein R 3 is a hydrogen atom, a fluorine atom, or a monofunctional organic group; and each R 4 is a monofunctional organic group), and a solvent (B). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for pattern reverse, which can be suitably embedded in resist patterns without mixing with the resist patterns formed on a substrate, shows excellent adhesion property with the patterns, and is excellent durability against oxygen ashing and storage stability; and to provide a method for forming a reversed pattern. SOLUTION: The resin composition for pattern reverse is used for a method for forming a reversed pattern comprising: a step of forming a resist pattern on a substrate to be processed; a step of embedding a resin composition for pattern reverse between the patterns of the resist patterns; and a step of removing the resist patterns to form reversed patterns, and contains polysiloxane containing a constitutional unit having a specific acryloyloxy alkyl group, and an organic solvent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a resist underlayer film, the composition having excellent adhesion to a resist film, improving reproducibility in a resist pattern, having resistance to an alkaline solution used for development or the like and to oxygen ashing at the resist removal, and having excellent storage stability, wherein the resist underlayer film into which the resist material is less likely to soak can be formed. SOLUTION: The composition for the resist underlayer film includes: a polysiloxane containing a constituent unit expressed by the general formula (1); and a solvent, wherein X is an optionally substituted methylene group or an optionally substituted and linear or branched 2-5C alkylene group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming an antireflection film from which a resist pattern having excellent dry etching durability, a high antireflection effect and excellent resolution and accuracy without causing intermixing can be formed, and to provide an antireflection film formed by using the above composition. SOLUTION: The composition for forming an antireflection film contains a polymer obtained from at least one kind of compound expressed by formula (3) or formula (4) and at least one kind of fullerene compound selected from a group (B) consisting of fullerenes and fullerene derivatives. In formulae, R 1 independently represents a hydrogen atom, a fluorine atom or a monovalent group; R 4 represents a halogen atom or a monovalent group; and each of R 5 , R 6 and R 7 independently represents a hydrogen atom, a halogen atom or a monovalent group. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation:解决问题:提供一种抗反射膜的组合物,可以形成具有优异的耐蚀刻耐久性,高抗反射效果和优异的分辨率和精度的抗蚀剂图案,而不会产生混合,并且可以形成抗反射膜 通过使用上述组合物形成。 解决方案:用于形成抗反射膜的组合物含有由式(3)或式(4)表示的至少一种化合物和至少一种选自(B)的富勒烯化合物中的至少一种 的富勒烯和富勒烯衍生物。 在式中,R“1”独立地表示氢原子,氟原子或一价基团; R 4 SP>表示卤素原子或一价基团; R SP 5,R SP 6,R SP 7,R SP 7各自独立地表示氢原子,卤素原子或一价基团。 版权所有(C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming the laser layer film for a multilayered resist process which has excellent durability against RIE and which can be used as a sufficient thin film to form a high definition pattern. SOLUTION: The composition for forming the lower layer film for a multilayered resist process contains polymers having structural units expressed by (1) and a solvent. In formula (1), R is a univalent atom or group, n is an integer 0 to 4 and each of R and R is a univalent atom or group.
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for a resist lower layer film having preferable gas permeability, excellent adhesiveness with a resist film and excellent durability against a developer for the development of the resist film and to provide a method for manufacturing the composition, the resist lower layer film and a method for manufacturing the film. SOLUTION: The composition for a resist lower layer film contains a film forming component consisting of a specified silane compound and a hydrolyzed product and/or condensed product of anther specified silane compound containing heat decomposable organic groups. When the composition is heated, the film forming component is hardened while the heat decomposable organic groups produce gas to form a porous silica film. The decomposition temperature of the heat decomposable organic groups is preferably 200 to 400 deg.C. The density of the resist lower film to be formed is preferably 0.7 to 1.8 g/cm3. The resist lower film is formed by heating the thin film of the above composition at a temperature equal to or higher than the decomposition temperature of the heat decomposable organic groups.
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a silicon-containing film for a multilayer resist process which is excellent in storage stability, can form a silicon-containing film having a high Si content and a small permeation amount of a resist material, and can stably form a resist pattern having a superior bottom profile without causing trailing or the like, and to provide a silicon-containing film and a pattern forming method. SOLUTION: The composition for forming a silicon-containing film contains (A) a polysiloxane having a silanole group, (B) an oxetanyl group-containing compound having two or more oxetanyl groups, and (C) an organic solvent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To enable the forming of film containing silicon superior in storage stability with a large content of Si and small amount of permeation of resist material, and to provide a composition for forming film with silicon contained therein for use in multilayer resist processing which can steadily form resist patterns free from trailed hems and the like, film containing silicon and method of forming patterns. SOLUTION: The composition for forming film with silicon contained therein includes: (A) a structural unit (a1) derived from tetra alkoxysilane provenance and a structural unit (a2) derived from hexa alkoxy disilane provenance while in the case of the content ratio of the structural unit (a1) is made 100 mol%, polysiloxane whose content ratio (a2) of the structural unit (a2) is 10 to 30 mol%, and (B) organic solvent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a silicon-containing film for a multilayer resist process, which is excellent in storage stability and achieves formation of a silicon-containing film excellent in adhesion to a resist film and in reproducibility of a resist pattern, having adequate resistance to a developer used for development, and also having adequate masking property to oxygen ashing in resist removal (etching resistance). SOLUTION: The composition comprises a polysiloxane derived from 30-80 pts.mass of a compound (a1) of formula (1), 5-60 pts.mass of a compound (a2) of formula (2), and 5-50 pts.mass of at least one of a compound (a3) of formula (3) and a compound (a4) of formula (4), provided that the sum total of the compounds (a1) to (a4) is 100 pts.mass; and a solvent. COPYRIGHT: (C)2010,JPO&INPIT