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公开(公告)号：GB2433515A
公开(公告)日：2007-06-27
申请号：GB0625233
申请日：2006-12-18
Applicant: KAO CORP
Inventor： FUJII SHIGEO , SUENAGA KENICHI
Abstract: A polishing composition for a hard disk substrate, contains aluminum oxide particles and water, wherein secondary particles of the aluminum oxide particles have a volume-median particle size of from 0.1 to 0.7 m, and particles having particle sizes of 1 m or more of the aluminum oxide particles are contained in an amount of 0.2% by weight or less of the polishing composition. By using the polishing composition in the manufacturing of the substrate a hard disk substrate suitable for high recording density can be provided in high productivity.
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公开(公告)号：GB2421244A
公开(公告)日：2006-06-21
申请号：GB0523438
申请日：2005-11-17
Applicant: KAO CORP
Inventor： FUJII SHIGEO , SUENAGA KENICHI
IPC: C09G1/02 , B24B37/00 , B24B37/005 , B24B57/02 , C09K3/14 , H01L21/304
Abstract: A polishing composition comprises an organic polybasic acid (e.g. citric acid, tartaric acid, or malic acid), an abrasive (such as alumina), water, and an organic nitrogen-containing compound having at least two amino groups, at least two imino groups, or at least one amino group and at least one imino group. The nitrogen compound may have a molecular weight of 150-100000 and is preferably present in an amount of 0.001-0.5 wt.% within the composition. The ratio of the nitrogen compound to the polybasic acid may be 1:10000 to 1:1. The composition may have a pH of 1-7 and may further comprise an oxidising agent. Methods of manufacturing a substrate and reducing surface stains on a substrate are also disclosed, the methods comprising the steps of feeding the composition to the substrate at a flow rate of 0.01-0.5 mL/minute per 1 cm of substrate and polishing the substrate with a polishing pad.
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公开(公告)号：GB2393447B
公开(公告)日：2006-04-19
申请号：GB0317224
申请日：2003-07-23
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO , OSHIMA YOSHIAKI , HAGIHARA TOSHIYA
IPC: C09G1/02
Abstract: A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa.s at a shearing rate of 1500 s -1 and 25° C.; a roll-off reducing agent comprising a Brönsted acid or a salt thereof, having an action of lowering viscosity so that the amount of viscosity lowered is 0.01 mPa.s or more, wherein the amount of viscosity lowered is expressed by the following equation: (Amount of Viscosity Lowered)=(Viscosity of Standard Polishing Composition)-(Viscosity of Roll-Off Reducing Agent-Containing Polishing Composition), wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al 2 O 3 purity of 98.0% by weight or more composed of alpha-type co-random crystal, 1 part by weight of citric acid, and 79 parts by weight of water; the roll-off reducing agent-containing polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al 2 O 3 purity of 98.0% by weight or more composed of alpha-type co-random crystal, 1 part by weight of citric acid, 78.9 parts by weight of water and 0.1 parts by weight of a roll-off reducing agent; and the viscosity is a viscosity at a shearing rate of 1500 s -1 and 25° C. The polishing composition can be favorably used in polishing the substrate for precision parts.
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公开(公告)号：GB2397580A
公开(公告)日：2004-07-28
申请号：GB0329441
申请日：2003-12-19
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO
Abstract: A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; also shown is a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.
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公开(公告)号：GB2435263A9
公开(公告)日：2007-09-12
申请号：GB0705021
申请日：2004-07-23
Applicant: KAO CORP
Inventor： FUJII SHIGEO , KITAYAMA HIROAKI
Abstract: A substrate for a magnetic disk of high recording density having a long-wavelength waviness of 0.05 nm or more and 0.3 um or less, and an AFM surface roughness of 0.03 nm or more and 0.2 nm or less is made by the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 žm, and an oxidizing agent, and (b) polishing the substrate with a polishing composition B containing silica particles having an average particle size of from 0.005 to 0.1 žm.
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Patent Agency Ranking
公开(公告)号：GB2397580B
公开(公告)日：2006-11-08
申请号：GB0329441
申请日：2003-12-19
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO
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公开(公告)号：GB2393186B
公开(公告)日：2006-02-22
申请号：GB0317225
申请日：2003-07-23
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO , HAGIHARA TOSHIYA
Abstract: A polishing composition comprising 0.03 to 0.5% by weight of an organic acid or a salt thereof, an abrasive and water, wherein the abrasive has a surface potential of from -140 to 200 mV; a roll-off reducing agent comprising an inorganic compound having a property of controlling a surface potential of an abrasive in a polishing composition, wherein a surface potential of the abrasive in a standard polishing composition is controlled to -110 to 250 mV by the presence of the inorganic compound, wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, the abrasive being high-purity alumina having Al 2 O 3 purity of 98.0% by weight or more composed of alpha-type corundum crystal, 1 part by weight of citric acid, 78 parts by weight of water and 1 part by weight of an inorganic compound. The polishing composition or the roll-off reducing agent composition can be favorably used in polishing the substrate for precision parts.
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公开(公告)号：MY118582A
公开(公告)日：2004-12-31
申请号：MYPI20012102
申请日：2001-05-04
Applicant: KAO CORP
Inventor： NAITO KOICHI , FUJII SHIGEO
IPC: B24B37/04 , C09G1/02 , C09K3/14 , H01L21/321
Abstract: A POLISHING COMPOSITION AN ABRASIVE AND WATER , WHEREIN THE ABRASIVE HAS A PARTICLE SIZE DISTRIBUTION SUCH THAT (1) A RATIO OF D90 TO D50 (D90/D50) IS FROM 1.3 TO 3.0 , AND (2) D50 IS FROM 10 TO 600 NM , WHEREIN D90 IS DEFINED AS A PARTICLE SIZE AT 90OUNTED FROM A SMALLER SIZE ON A NUMBER BASE IN A CUMULATIVE PARTICLE SIZE DISTRIBUTION , AND WHEREIN D50 IS DEFINED AS A PARTICLE SIZE AT 50OUNTED FROM A SMALLER SIZE SIDE ON A NUMBER BASE IN A CUMULATIVE PARTICLE SIZE DISTRIBUTION .
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公开(公告)号：MY117521A
公开(公告)日：2004-07-31
申请号：MYPI20010473
申请日：2001-02-02
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , NAITO KOICHI , FUJII SHIGEO
Abstract: A POLISHING COMPOSITION COMPRISING SILICA PARTICLES,WATER,AND FE SALT AND/OR AL SALT OF A POLYAMINOCARBOXYLIC ACID, A POLISHING PROCESS COMPRISING APPLYING THE POLISHING COMPOSITION; A PROCESS FOR MANUFACTURING A MAGNETIC DISK SUBSTRATE, COMPRISING THE STEP OF POLISHING A SUBSTRATE WITH THE POLISHING COMPOSITION, A MAGNETIC DISK SUBSTRATE MANUFACTURED BY APPLYING THE POLISHING COMPOSITION.
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公开(公告)号：MY144587A
公开(公告)日：2011-10-14
申请号：MYPI20022313
申请日：2002-06-20
Applicant: KAO CORP
Inventor： FUJII SHIGEO , YOSHIDA HIROYUKI , HAGIHARA TOSHIYA , KITAYAMA HIROAKI
Abstract: A POLISHING COMPOSITION COMPRISING AN ABRASIVE AND WATER, WHEREIN THE POLISHING COMPOSITIONS HAS AN INDEX OF DEGREE OF SEDIMENTATION OF 80 OR MORE AND 100 OR LESS; A PROCESS FOR PRODUCING A SUBSTRATE COMPRISING POLISHING A SUBSTRATE TO BE POLISHED USING THE ABOVE-MENTIONED COMPOSITION; A PROCESS FOR PREVENTING CLOGGING OF A POLISHING PAD COMPRISING APPLYING THE ABOVE-MENTIONED COMPOSITION; A PROCESS FOR PREVENTING CLOGGING OF A POLISHING PAD COMPRISING APPLYING THE ABOVE-MENTIONED COMPOSITION TO POLISHING WITH A POLISHING PAD FOR A NICKEL-CONTAINING OBJECT TO BE POLISHED; AND A PROCESS FOR PREVENTING CLOGGING OF A POLISHING PAD COMPRISING APPLYING A COMPOSITION COMPRISING A HYDROPHILIC POLYMER HAVING TWO OR MORE HYDROPHILIC GROUPS IN ITS MOLECULE AND A MOLECULAR WEIGHT OF 300 OR MORE , OR A COMPOUND CAPABLE OF DISSOLVING NICKEL HYDROXIDE AT A pH OF 0.8, AND WATER TO POLISHING WITH A POLISHING PAD FOR A NICKEL-CONTAINING OBJECT TO BE POLISHED.
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