公开(公告)号：US20050211135A1

公开(公告)日：2005-09-29

申请号：US10807605

申请日：2004-03-23

Applicant: Kuo-Chuan Liu ,  Michael Lee ,  Kishio Yokouchi

Inventor： Kuo-Chuan Liu ,  Michael Lee ,  Kishio Yokouchi

IPC: G02B6/12 ,  B32B9/00 ,  C01G53/00 ,  C08H1/00 ,  C23C18/12 ,  G02F1/03 ,  G02F1/055 ,  H01L21/28 ,  H01L21/288

CPC classification number: G02F1/0551 ,  C23C18/1216 ,  C23C18/1225 ,  C23C18/1279 ,  C23C18/1283 ,  G02F1/0316 ,  G02F2201/12

Abstract: Methods of forming lanthanum nickel oxide (LaNiO3) layers with precursor formation solutions are disclosed, along with devices made from such solutions. Also disclosed are methods for making the formation solutions using lanthanum, nickel, and a diol. The present invention enables the manufacture of LaNiO3 layers at low cost, with good resistivity properties, and a surface morphology suitable for interfacing to a ferro-electric material.

Abstract translation: 公开了用前体形成溶液形成氧化镧镍（LaNiO 3/3）层的方法以及由这些溶液制成的器件。 还公开了使用镧，镍和二醇制备地层溶液的方法。 本发明能够以低成本制造具有良好电阻率性质的LaNiO 3层，以及适于与铁电材料接合的表面形态。

公开(公告)号：US06885789B2

公开(公告)日：2005-04-26

申请号：US10165087

申请日：2002-06-07

Applicant: Kuo-Chuan Liu

Inventor： Kuo-Chuan Liu

IPC: G02F1/03 ,  G02F1/313 ,  G02B6/26

CPC classification number: G02F1/313 ,  G02F1/0316 ,  G02F2201/04 ,  G02F2201/302

Abstract: An electro-optical switch is provided, that includes: a single mode optical waveguide having a thin ferroelectric oxide film for propagating a single mode of light; a coupler adjoining the single mode optical waveguide for coupling a part of the single mode of light from an optical fiber to the single mode optical waveguide; an electrically formed lens in the single mode optical waveguide for collimating the single mode of light from the coupler; and a switching module comprising another electrically formed lens in the single mode optical waveguide, for switching the single mode of light.

Abstract translation: 提供一种电光开关，其包括：具有用于传播单模光的薄铁电氧化膜的单模光波导; 邻接单模光波导的耦合器，将来自光纤的单模光的一部分耦合到单模光波导; 在单模光波导中用于校准来自耦合器的单模光的电成像透镜; 以及包括在单模光波导中的另一电形成透镜的开关模块，用于切换单模光。

公开(公告)号：US08736044B2

公开(公告)日：2014-05-27

申请号：US12843680

申请日：2010-07-26

Applicant: Mudasir Ahmad ,  Kuo-Chuan Liu ,  Mohan Nagar ,  Bangalore Shanker

Inventor： Mudasir Ahmad ,  Kuo-Chuan Liu ,  Mohan Nagar ,  Bangalore Shanker

IPC: H01L23/04

CPC classification number: H01L23/3675 ,  H01L21/563 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29393 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1615 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/3511 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09972 ,  H05K2201/10371 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: To minimize the warpage of an organic substrate that supports at least one electrical hardware component (e.g., a system-in-package module), a bottom surface of a lid is attached to a top surface of the electrical hardware component. The lid includes a leg that extends from the bottom surface of the lid towards a top surface of the substrate. A portion of the leg closest to the substrate may move relative to the substrate. As the lid warps, the lid does not also cause distortion of the substrate. The leg may be a flange that extends at least a portion of the width or at least a portion of the length of the lid, may be a post located at the perimeter of the lid, or may be any other portion extending from above the electrical component towards the substrate.

Abstract translation: 为了最小化支持至少一个电气硬件部件（例如，系统级封装模块）的有机基板的翘曲，盖的底表面附接到电气硬件部件的顶表面。 盖子包括从盖的底表面朝向衬底的顶表面延伸的腿部。 最靠近基底的腿的一部分可以相对于基底移动。 当盖子翘曲时，盖子也不会引起基板的变形。 该腿部可以是延伸至该宽度的至少一部分的凸缘或该盖的长度的至少一部分，该凸缘可以是位于盖的周边的柱，或者可以是从上方延伸的任何其它部分 元件朝向基板。

公开(公告)号：US20120113608A1

公开(公告)日：2012-05-10

申请号：US13292630

申请日：2011-11-09

Applicant: Mohan R. Nagar ,  Kuo-Chuan Liu ,  Mudasir Ahmad ,  Bangalore J. Shanker ,  Jie Xue

Inventor： Mohan R. Nagar ,  Kuo-Chuan Liu ,  Mudasir Ahmad ,  Bangalore J. Shanker ,  Jie Xue

IPC: H05K7/06 ,  H05K3/34

CPC classification number: H05K1/0271 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract translation: 一种印刷电路板组件和组装方法，其中将底部填充物放置在芯片和基板之间以支撑芯片。 沟槽形成在印刷电路板的上层中以限制底部填充物的流动，特别是限制底部填充物与相邻部件的接触，使得底部填充物不会干扰印刷电路板组件上的相邻部件。

公开(公告)号：US20120018872A1

公开(公告)日：2012-01-26

申请号：US12843680

申请日：2010-07-26

Applicant: Mudasir Ahmad ,  Kuo-Chuan Liu ,  Mohan Nagar ,  Bangalore Shanker

Inventor： Mudasir Ahmad ,  Kuo-Chuan Liu ,  Mohan Nagar ,  Bangalore Shanker

IPC: H01L23/04 ,  H01L21/50

CPC classification number: H01L23/3675 ,  H01L21/563 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29393 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1615 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/3511 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09972 ,  H05K2201/10371 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: To minimize the warpage of an organic substrate that supports at least one electrical hardware component (e.g., a system-in-package module), a bottom surface of a lid is attached to a top surface of the electrical hardware component. The lid includes a leg that extends from the bottom surface of the lid towards a top surface of the substrate. A portion of the leg closest to the substrate may move relative to the substrate. As the lid warps, the lid does not also cause distortion of the substrate. The leg may be a flange that extends at least a portion of the width or at least a portion of the length of the lid, may be a post located at the perimeter of the lid, or may be any other portion extending from above the electrical component towards the substrate.

Abstract translation: 为了最小化支持至少一个电气硬件部件（例如，系统级封装模块）的有机基板的翘曲，盖的底表面附接到电气硬件部件的顶表面。 盖子包括从盖的底表面朝向衬底的顶表面延伸的腿部。 最靠近基底的腿的一部分可以相对于基底移动。 当盖子翘曲时，盖子也不会引起基板的变形。 该腿部可以是延伸至该宽度的至少一部分的凸缘或该盖的长度的至少一部分，该凸缘可以是位于盖的周边的柱，或者可以是从上方延伸的任何其它部分 元件朝向基板。

公开(公告)号：US20050281943A1

公开(公告)日：2005-12-22

申请号：US10871405

申请日：2004-06-18

Applicant: Kuo-Chuan Liu

Inventor： Kuo-Chuan Liu

IPC: B05D3/02 ,  B05D5/12 ,  B32B9/00 ,  C04B35/491 ,  G02F1/035 ,  G02F1/055

CPC classification number: C04B35/491 ,  C04B2235/3227 ,  C04B2235/44 ,  C04B2235/449 ,  C04B2235/6562 ,  C04B2235/6585 ,  C04B2235/79 ,  G02F1/035 ,  G02F1/055

Abstract: Methods and solutions for forming lanthanum-modified lead zirconium titanate (PLZT) layers are disclosed. The PLZT layers are highly transparent to 1550 nm wavelength light, and have high crystal quality. Loss factors as low as 0.25 dB per mm are achieved. Fast and low-cost methods are disclosed for making the layers. Devices structures using the layers are also disclosed.

Abstract translation: 公开了用于形成镧改性的钛酸铅锆酸铅（PLZT）层的方法和溶液。 PLZT层对1550nm波长的光是高度透明的，并且具有高的晶体质量。 实现了低至0.25 dB / mm的损耗系数。 公开了用于制造层的快速且低成本的方法。 还公开了使用这些层的装置结构。

公开(公告)号：US20120317886A1

公开(公告)日：2012-12-20

申请号：US13458958

申请日：2012-04-27

Applicant: Kuo-Chuan Liu ,  Chin-Lung Fan

Inventor： Kuo-Chuan Liu ,  Chin-Lung Fan

IPC: H05K7/00

CPC classification number: G06F1/1656

Abstract: A cover module is provided, including a main body, a rotary nub, a cam connected to the rotary nub, and at least a slider. The rotary nub and the cam are pivotally disposed on a first side and a second side of the main body, respectively, wherein the second side is opposite to the first side. The slider is movably disposed on the second side of the main body. When the cam is driven by the rotary nub to rotate from a first angle to a second angle, the slider is pushed by the cam from a first position to a second position relative to the main body, such that the slider engages with a housing of an electronic device.

Abstract translation: 提供了一种盖模块，包括主体，旋转凸块，连接到旋转凸块的凸轮，以及至少一个滑块。 旋转凸块和凸轮分别枢转地设置在主体的第一侧和第二侧上，其中第二侧与第一侧相对。 滑块可移动地设置在主体的第二侧上。 当凸轮由旋转凸块驱动以从第一角度旋转到第二角度时，滑块被凸轮从第一位置推动到相对于主体的第二位置，使得滑块与壳体 电子设备。

公开(公告)号：US20080130241A1

公开(公告)日：2008-06-05

申请号：US11606750

申请日：2006-11-30

Applicant: Mohan R. Nagar ,  Kuo-Chuan Liu ,  Mudasir Ahmad ,  Bangalore J. Shanker ,  Jie Xue

Inventor： Mohan R. Nagar ,  Kuo-Chuan Liu ,  Mudasir Ahmad ,  Bangalore J. Shanker ,  Jie Xue

IPC: H05K7/20 ,  H05K3/34

CPC classification number: H05K1/0271 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract translation: 一种印刷电路板组件和组装方法，其中将底部填充物放置在芯片和基板之间以支撑芯片。 沟槽形成在印刷电路板的上层中以限制底部填充物的流动，特别是限制底部填充物与相邻部件的接触，使得底部填充物不会干扰印刷电路板组件上的相邻部件。

公开(公告)号：US20060133718A1

公开(公告)日：2006-06-22

申请号：US11018824

申请日：2004-12-20

Applicant: Kuo-Chuan Liu

Inventor： Kuo-Chuan Liu

IPC: G02B6/12

CPC classification number: G02B6/43 ,  H05K1/0274

Abstract: Disclosed are optical-routing boards for opto-electrical systems having optical waveguides embedded in non-laminated optical substrates that enable optical signals to be routed among opto-electric components mounted on the top surfaces of the optical substrates. Methods for making the optical-routing boards are also disclosed. The waveguides are formed by focused pulse-laser writing, with the focal point of the pulsed-laser beam being moved in a three-dimensional manner through the non-laminated substrate. Bevel surfaces are preferably formed in the substrate to facilitate bending of the waveguides.

Abstract translation: 公开了用于光电系统的光路由板，其具有嵌入在非层叠光学基板中的光波导，其使得光信号能够在安装在光学基板的顶表面上的光电部件之间布线。 还公开了制造光路由板的方法。 波导通过聚焦脉冲激光写入形成，脉冲激光束的焦点以三维方式移动通过非层压基板。 斜面优选形成在衬底中以便于波导的弯曲。