公开(公告)号：DE60200154T2

公开(公告)日：2004-11-25

申请号：DE60200154

申请日：2002-04-10

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH ANTHONY ,  FAN CHONGLUN ,  XU CHEN ,  ZHANG YUN

IPC: C25D7/00 ,  C23C28/00 ,  C25D3/56 ,  C25D5/10 ,  C25D5/12 ,  C25D5/26 ,  H01L23/50 ,  H01R13/03

Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.

公开(公告)号：DE69900057T2

公开(公告)日：2001-08-16

申请号：DE69900057

申请日：1999-11-23

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CHIU SEE HONG ,  ZHANG YUN

IPC: C25D3/32 ,  C25D3/60

Abstract: An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.