-
Patent Agency Ranking
公开(公告)号：JP2001144393A
公开(公告)日：2001-05-25
申请号：JP2000287891
申请日：2000-09-22
Applicant: LUCENT TECHNOLOGIES INC
Inventor： XU CHEN , JOSEPH ANTHONY , FAN CHONGLUN , SMITH BRIAN THOMAS , STACY BRUCE F
IPC: H05K1/09 , C25D5/12 , C25D7/00 , H05K3/06 , H05K3/10 , H05K3/22 , H05K3/24 , H05K3/28 , H05K3/38
Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof. SOLUTION: In this printed circuit board, comprising a board with a conductive trace thereon and a multipurpose final finished layer containing palladium alloy, the palladium forms an alloy with cobalt or platinum group metal, and the palladium alloy is formed at least in a part of the conductive trace, and forms both a noncontact final finished layer and a contact final finished layer of a printed circuit board.
-
公开(公告)号：JP2002339097A
公开(公告)日：2002-11-27
申请号：JP2002135188
申请日：2002-05-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH A , FAN CHONGLUN , XU CHEN , ZHANG YUN
IPC: C25D5/50 , C23C26/00 , C23C28/00 , C23C28/02 , C25D7/00 , H01L23/495 , H01L23/50 , H01R13/03 , C25D7/12
Abstract: PROBLEM TO BE SOLVED: To prevent production of whiskers on tin coated metallic products. SOLUTION: A metallic substrate is coated with a tin or tin alloy layer subjected to surface doping in order to suppress the growth of tin whiskers. A metallic ground surface layer is arbitrarily selectively arranged between the substrate and the tin. In an exemplary embodiment, the metallic substrate contains the nickel surface layer and the copper alloy formed by coating gold or palladium with the tin layer subjected to surface doping. The doping suppresses the growth of the whiskers and eventually the structure is particularly effective as an electrical connector or a lead frame.
-
公开(公告)号：DE60200154T2
公开(公告)日：2004-11-25
申请号：DE60200154
申请日：2002-04-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH ANTHONY , FAN CHONGLUN , XU CHEN , ZHANG YUN
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.
-
公开(公告)号：DE60200154D1
公开(公告)日：2004-02-05
申请号：DE60200154
申请日：2002-04-10
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH ANTHONY , FAN CHONGLUN , XU CHEN , ZHANG YUN
Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.
-
公开(公告)号：DE60042514D1
公开(公告)日：2009-08-20
申请号：DE60042514
申请日：2000-09-11
Applicant: LUCENT TECHNOLOGIES INC
Inventor： ABYS JOSEPH A , FAN CHONGLUN , SMITH BRIAN T , STACY BRUCE F , XU CHEN
IPC: H05K1/09 , H05K3/24 , C25D5/12 , C25D7/00 , H05K3/06 , H05K3/10 , H05K3/22 , H05K3/28 , H05K3/38
Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.
-
-
-
-
Search Results
5
records
(took 0.02 seconds)
