公开(公告)号：AU4722097A

公开(公告)日：1998-09-09

申请号：AU4722097

申请日：1997-10-22

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： YOSHIDA HITOSHI ,  TOMONARI SHIGEAKI ,  OKA NAOMASA ,  NAKAMURA TAKURO ,  ISHIDA TAKURO ,  KAMAKURA MASANAO ,  KASANO FUMIHIRO

IPC: G01P15/08 ,  G01P15/12 ,  G01P15/125 ,  G01P15/18 ,  H01L29/84

Abstract: A flexure transducer element which is used in an acceleration sensor for sensing an acceleration applied thereto comprises (1) a frame having an upper surface and a lower surface, (2) a sheet member which has a plurality of flexible parts and a center part, each flexible part extending between at least a portion of an inner edge of the frame and the center part and being integrally connected to them, (3) a weight which has a neck part integrally connected to the center part of the sheet member and which is hung from the sheet member through the neck part, and (4) a support member which supports the lower surface of the frame and of which inward side surface faces to a side surface of the weight through a first space therebetween, a second space which is continuous with the first space is defined between each flexible part of the sheet member and the weight, a third space is defined between the frame and the sheet member and/or through the sheet member, the frame and the sheet member are connected to each other and the sheet member and the weight are connected to each other in such a manner that, when the acceleration is applied to the element, at least two flexible parts are elastically deformed so that the weight is displaced relatively to the frame, the weight and the support member are formed of a semiconductor substrate, the second space is formed by removing a sacrificial layer which is provided in the semiconductor substrate, and the frame and the sheet member comprises an epitaxial layer provided on the semiconductor substrate.

公开(公告)号：EP0899574A4

公开(公告)日：1999-06-16

申请号：EP97909576

申请日：1997-10-22

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： YOSHIDA HITOSHI ,  TOMONARI SHIGEAKI ,  OKA NAOMASA ,  NAKAMURA TAKURO ,  ISHIDA TAKURO ,  KAMAKURA MASANAO ,  KASANO FUMIHIRO

IPC: G01P15/08 ,  G01P15/12 ,  G01P15/125 ,  G01P15/18 ,  H01L29/84

CPC classification number: G01P15/123 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0842

Abstract: A flexure transducer which is used for the detection of an applied acceleration comprising (1) a frame having an upper surface and a lower surface, (2) a sheet member which has a plurality of flexible parts and a center part and whose flexible parts are extended between at least a part of the inner edge of the frame and the center part and are integrally continuous with them, (3) a weight which has a neck part integrally connected to the center part of the sheet member and is hung from the sheet member through the neck part and (4) a support member which supports the lower surface of the frame and whose inner surface faces the side surface of the weight with a first gap therebetween, a second gap being continuous with the first gap, and defined between the flexible parts of the sheet member and the weight, a third gap being defined between the frame and the sheet member and/or inside the sheet member, the frame and the sheet member being joined to each other and the sheet member and the weight being joined to each other in such a manner that, when an acceleration is applied to the transducer, at least two flexible parts are elastically deformed and, as a result, the weight is displaced relatively to the frame, the weight and the support member being formed of a semiconductor substrate, the 2nd gap being formed by removing a sacrifice layer which is provided in the semiconductor substrate and the frame and the sheet member comprising epitaxial layers provided on the semiconductor substrate.

公开(公告)号：EP1026721A4

公开(公告)日：2006-12-06

申请号：EP99940499

申请日：1999-08-26

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： HATAI TAKASHI ,  KOMODA TAKUYA ,  HONDA YOSHIAKI ,  AIZAWA KOICHI ,  WATABE YOSHIFUMI ,  ICHIHARA TSUTOMU ,  KONDO YUKIHIRO ,  OKA NAOMASA ,  KOSHIDA NOBUYOSHI

IPC: H01J1/312 ,  H01J9/02 ,  H01J31/12

CPC classification number: B82Y10/00 ,  H01J1/312 ,  H01J9/022 ,  H01J31/127 ,  H01J2201/3125

Abstract: A field emission source (10) comprises a p-type silicon substrate (1), an n-type region (8) formed into stripes in a major surface of the substrate (1), strong-field drift layers (6) which are formed on the n-type region (8) in which electrons injected from the n-type region (8) drift, and which are made of oxidized porous polysilicon, a polysilicon layer (3) formed between the strong field drift layers (6), surface electrodes (7) formed into stripes in a direction perpendicular to the stripes of the n-type region (8). A voltage is selectively applied to either the n-type region (8) or the surface electrodes (7) so as to emit electrons from predetermined areas of the surface electrodes (7).

公开(公告)号：JP2006156850A

公开(公告)日：2006-06-15

申请号：JP2004347794

申请日：2004-11-30

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： USHIYAMA NAOKI ,  OGIWARA ATSUSHI ,  HARADA HIROSHI ,  OKA NAOMASA ,  YOSHIHARA TAKAAKI ,  KONO KIYOHIKO

IPC: H01L21/3065

Abstract: PROBLEM TO BE SOLVED: To provide an etching method which facilitates confirmation of end of etching without making a preliminary test, and suppresses or prevents the microloading effect and deformation caused by side etching.
SOLUTION: In the etching method for etching a semiconductor substrate 1 to form a pattern, a pseudo pattern 3 is provided on the region of the semiconductor substrate 1 other than a region on which a desired pattern is formed, the end point of etching of the pseudo pattern 3 is monitored simultaneously with the etching, and the etching is terminated when the end point reaches a predetermined depth D.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种在不进行初步试验的情况下便于确认蚀刻结束的蚀刻方法，并且抑制或防止由侧面蚀刻引起的微加载效应和变形。 解决方案：在用于蚀刻半导体衬底1以形成图案的蚀刻方法中，在除了形成期望图案的区域之外的半导体衬底1的区域上设置伪图案3， 蚀刻同时监视伪图案3的蚀刻，并且当端点达到预定深度D时，蚀刻终止。（C）2006，JPO和NCIPI

公开(公告)号：JP2005238346A

公开(公告)日：2005-09-08

申请号：JP2004048082

申请日：2004-02-24

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： HARADA HIROSHI ,  OKA NAOMASA ,  SUZUKI YUJI ,  FUKUSHIMA HIROSHI ,  NOGE HIROSHI ,  OGIWARA ATSUSHI ,  KONO KIYOHIKO ,  USHIYAMA NAOKI ,  JOMI HIROTAKA ,  YOSHIHARA TAKAAKI

IPC: G02B26/08 ,  B81B3/00

Abstract: PROBLEM TO BE SOLVED: To provide an actuator and an optical device for accurately determining a position of a movable plate in a state of applying no stress to the movable plate by a plate driving part. SOLUTION: This actuator has the movable plate 2 displaceable by deflecting a flexible plate support part 1 having one end connected to a fixing part 10, the plate driving part 3 for driving the movable plate 2, a movable latch part 5 displaceable by deflecting a flexible latch support part 4 having one end connected to the fixing part 10, and a latch driving part 6 for driving a movable latch part 5. When the plate driving part 3 does not apply stress to the movable plate 2, and when the latch driving part 6 does not apply stress to the movable latch part 5, the movable latch part 5 holds a position of the movable plate by contacting with the movable plate, and when the plate driving part 3 displaces the movable plate 2, the latch driving part 6 displaces the movable latch part 5 in the direction for separating from the movable plate 2. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种致动器和光学装置，用于通过板驱动部件在不施加应力的状态下精确地确定可动板的位置。 解决方案：该致动器具有可移动板2，通过使具有连接到固定部10的一端的柔性板支撑部1，用于驱动可动板2的板驱动部3，可移动的闩锁部5， 使具有一端连接到固定部分10的柔性闩锁支撑部分4偏转，以及用于驱动可动闩锁部分5的闩锁驱动部分6.当板驱动部分3不向可动板2施加应力时， 闩锁驱动部6不向可动闩锁部5施加应力，可动闩锁部5通过与可动板接触而保持可动板的位置，当板驱动部3移动可动板2时，闩锁驱动 第6部分将可移动的闩锁部分5移动到与可动板2分离的方向上。版权所有：（C）2005，JPO＆NCIPI

公开(公告)号：JP2005177974A

公开(公告)日：2005-07-07

申请号：JP2004275987

申请日：2004-09-22

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： YOSHIHARA TAKAAKI ,  OKA NAOMASA ,  OGIWARA ATSUSHI ,  SUZUKI YUJI ,  HARADA HIROSHI ,  NOGE HIROSHI ,  FUKUSHIMA HIROSHI ,  KONO KIYOHIKO ,  USHIYAMA NAOKI ,  SUZUMURA MASAHIKO

IPC: G02B26/08 ,  B81C1/00

CPC classification number: B81C1/00182 ,  B81B2203/0136 ,  B81C2201/0109 ,  B81C2201/019

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a three-dimensional structure for suppressing occurrence of operation failure, having a high degree of freedom of structural and process design in design and working of the structure. SOLUTION: The method for manufacturing semiconductor structure comprises a first patterning process for forming a projecting part by selectively removing a first substrate from a first main surface of the first substrate, a substrate joining process for joining the first main surface to the main surface of a second substrate, and a back face etching process for leaving only the projecting part by uniformly removing the first substrate from the second main surface opposed to the first main surface. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种制造用于抑制操作失败发生的三维结构的方法，在结构的设计和加工中具有结构和工艺设计的高自由度。 解决方案：半导体结构的制造方法包括：通过从第一基板的第一主表面选择性地去除第一基板来形成突出部分的第一图案化工艺;将第一主表面连接到主体的基板接合工艺 以及通过从与第一主表面相对的第二主表面均匀地除去第一衬底而仅留下突出部分的背面蚀刻工艺。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005096010A

公开(公告)日：2005-04-14

申请号：JP2003331140

申请日：2003-09-24

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： JOMI HIROTAKA ,  OKA NAOMASA ,  SUZUKI YUJI ,  YOSHIHARA TAKAAKI ,  NOGE HIROSHI ,  OGIWARA ATSUSHI ,  USHIYAMA NAOKI ,  HARADA HIROSHI ,  KONO KIYOHIKO

IPC: G02B26/08 ,  B81B1/00 ,  B81B7/04 ,  B81C1/00 ,  H01L21/306

Abstract: PROBLEM TO BE SOLVED: To easily and accurately position the angle of a plate-like structure pattern used as a mask, to a (111) face of a semiconductor substrate wafer. SOLUTION: In this method of manufacturing a semiconductor structure, the semiconductor substrate wafer is wet-etched to form the plate-like structure with the side faces formed as the (111) faces almost perpendicular to the main surface of the semiconductor substrate wafer. The orientation flat faces of the semiconductor substrate wafer are formed as the (111) faces, and a wet etching mask is formed aligned to be parallel with the orientation flat faces as a basis to form the plate-like structure. Or (111) face detecting patterns are provided at least at two parts on the semiconductor substrate wafer, and after detecting the (111) faces, the (111) face detecting patterns coinciding with the (111) faces are set as an alignment reference. The formed plate-like structure is used as a mirror in an optical switching device. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了容易且精确地将用作掩模的板状结构图案的角度定位到半导体衬底晶片的（111）面。 解决方案：在这种制造半导体结构的方法中，半导体衬底晶片被湿蚀刻以形成板状结构，其侧面形成为（111）面几乎垂直于半导体衬底的主表面 晶圆。 半导体衬底晶片的取向平面形成为（111）面，形成与取向平面平行的湿式蚀刻掩模，作为形成板状结构的基础。 或至少在半导体衬底晶片上的两个部分设置（111）面检测图案，并且在检测（111）面之后，将与（111）面重合的（111）面检测图案设置为对准基准。 所形成的板状结构用作光开关装置中的反射镜。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005096008A

公开(公告)日：2005-04-14

申请号：JP2003331128

申请日：2003-09-24

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： JOMI HIROTAKA ,  OKA NAOMASA ,  FUKUSHIMA HIROSHI ,  YOSHIHARA TAKAAKI ,  SUZUKI YUJI ,  NOGE HIROSHI ,  HARADA HIROSHI ,  USHIYAMA NAOKI

IPC: G02B26/08 ,  B81C1/00

Abstract: PROBLEM TO BE SOLVED: To prevent side etching at both longitudinal ends of a plate-like structure. SOLUTION: In this manufacturing method for a semiconductor structure, a semiconductor substrate is etched to form the plate-like structure with side faces formed as (111) faces almost perpendicular to the main surface of the substrate. A mask pattern is formed having a pair of slits corresponding to the side faces, and after wet etching is performed to form the side faces formed of the (111) faces, a part other than the plate-like structure is eliminated by dry etching. With the formation of the (111) faces by wet etching and the dissolution of side etching by dry etching, the plate-like structure is accurately formed with a required minimum produced area. The formed plate-like structure is used as a mirror in an optical switching device. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了防止板状结构的两个纵向端部的侧面蚀刻。 解决方案：在这种半导体结构的制造方法中，蚀刻半导体衬底以形成板状结构，其侧面形成为（111）面几乎垂直于衬底的主表面。 形成具有对应于侧面的一对狭缝的掩模图案，并且在进行湿蚀刻以形成由（111）面形成的侧面之后，通过干蚀刻来消除除了板状结构之外的部分。 通过湿蚀刻形成（111）面，通过干蚀刻溶解侧蚀刻，可以精确地形成具有所需最小生产面积的板状结构。 所形成的板状结构用作光开关装置中的反射镜。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003344788A

公开(公告)日：2003-12-03

申请号：JP2002154812

申请日：2002-05-28

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： MURAI AKIHIKO ,  OKA NAOMASA ,  MIYAJIMA HISAKAZU ,  OGIWARA ATSUSHI

IPC: G02B26/08 ,  B81B5/00 ,  B81B7/04 ,  B81C1/00 ,  H04B10/00 ,  H04B10/27 ,  H04Q3/52 ,  H04B10/02

Abstract: PROBLEM TO BE SOLVED: To provide an optical switch of which the optical axis is easily adjusted and which is easily manufactured. SOLUTION: The optical switch is composed of a plurality of optical waveguides 4 of which the both ends are formed as a light incident part 1 and a light emitting part 2 and the outer circumference of a translucent material is surrounded by a light reflection film, a mirror 5 which is provided between adjacent optical waveguides 4 which are arranged in a way that the light emitting part 2 and the light incident part 1 are opposite to each other and movable between a position at which the light emitted from the light emitting part 2 is reflected and a position at which the light is not reflected, and an end part waveguide 6, of which the circumference of the light-transmissive material is surrounded by a light reflection film, and which waveguide is arranged in a manner that the light emitting part 2 or the light incident part 1 is opposite to the light incident part 1 or the light emitting part 2 of the optical waveguide 4 which is located at the end part among the plurality of optical waveguides 4 via the movable mirror 5. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供光轴易于调节且易于制造的光开关。 解决方案：光开关由多个光波导4组成，其两端形成为光入射部分1和发光部分2，半透明材料的外圆周被光反射 膜，反射镜5，其设置在相邻的光波导4之间，其布置成使得发光部分2和光入射部分1彼此相对，并且可在从发光的光发射的光的位置 部分2被反射并且光不被反射的位置以及透光材料的圆周被光反射膜包围的端部波导6，并且该波导以如下方式布置： 发光部2或光入射部1与位于多个光学部件的端部的光波导4的光入射部1或发光部2相反侧 通过可移动反射镜5的波导4。版权所有（C）2004，JPO

公开(公告)号：JP2003315698A

公开(公告)日：2003-11-06

申请号：JP2002121434

申请日：2002-04-23

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： OKUTO TAKASHI ,  OKA NAOMASA ,  MIYAJIMA HISAKAZU ,  OGIWARA ATSUSHI ,  HIRATA KATSUHIRO

IPC: G02B26/08 ,  B81B3/00

Abstract: PROBLEM TO BE SOLVED: To provide an optical switch which can control the passage or blocking of even a signal having a relatively large luminous flux.
SOLUTION: The optical switch comprises a swing body 1 and a base substrate 2. The swing body 1 has a movable electrode 13 at one end of at least a moving element 12 and a switch plate 11 blocking light at the other end and is equipped with connectors 14 and 14 projecting from the moving element 12 and having elasticity in a twisting direction and an anchor 15 formed integrally therewith. The base substrate 2 has a support part 21 supporting the swing body 1 by abutting against the part of the moving element 12 where the connectors 14 and 14 are provided and has a fixed electrode 23 opposite the movable electrode 13; and the connectors 14 and 14 are provided at positions displaced from the center position of the moving element 12 toward the movable electrode 13 to increase the quantity of displacement of the switch plate 11.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种可以控制甚至具有相对较大光通量的信号的通过或阻塞的光开关。 解决方案：光开关包括摆动体1和基底2.摆动体1在至少一个移动元件12的一端具有一个可移动电极13，另一端具有阻挡光的开关板11;以及 配备有从移动元件12突出并具有扭转方向的弹性的连接器14和14以及与其一体形成的锚固件15。 基底基板2具有支撑部21，该支撑部21通过抵靠设置有连接器14和14的移动元件12的一部分而支撑摆动体1，并具有与可动电极13相对的固定电极23。 并且连接器14和14设置在从移动元件12的中心位置朝向可移动电极13移动的位置，以增加开关板11的位移量。（C）2004，JPO