公开(公告)号：JPH104173A

公开(公告)日：1998-01-06

申请号：JP17327496

申请日：1996-07-03

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI ,  YAMADA YUICHIRO

IPC: H01L21/304 ,  H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a lead frame, which ensures adhesiveness with sealing resin even when the rear face of the semiconductor element is exposed and eliminates an area not filled with the resin in resin sealing, and provide a semiconductor device using it and the manufacture of the lead frame. SOLUTION: A lead frame composed of four small die pad parts, which are bonding parts 19a, 19b, 19c and 19d, and a die pad part 16 which is smaller than a semiconductor element to be mounted is used. Thus, stress due to sealing resin is modified, a quantity of adhesive applied on the die pad part 16 for bonding the semiconductor element with the die pad part 16 is reduced at the time of mounting the semiconductor element, a quantity of water absorption is reduced, and package cracks, etc., are prevented in the reflow process. Prior to die bonding, the rear face of the semiconductor element is cleaned by ultraviolet and the pressure sensitive adhesive of a pressure sensitive adhesive sheet used in dicing is removed. Therefore, the rear face of the element is not contaminated, and adhesiveness with the sealing resin is ensured.

公开(公告)号：JPH1116930A

公开(公告)日：1999-01-22

申请号：JP17139697

申请日：1997-06-27

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OIDA SHIGEJI ,  YAMAGUCHI YUKIO ,  SUEMATSU NOBUHIRO ,  MORIKAWA TAKESHI ,  YAMADA YUICHIRO

IPC: B29C33/18 ,  B29C45/02 ,  B29C70/72 ,  B29L31/34 ,  H01L21/56 ,  H01L21/68 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent the occurrence of the crease of a sealing sheet due to thermal shrinkage and to control the depth of a groove formed on the side of the inner lead part of a resin-sealed semiconductor device, namely, the quantity of the sealing sheet inserted into the side of the inner lead part by thermal shrinkage, at the time of resin sealing. SOLUTION: A lead frame to which a semiconductor element 2 is bonded is installed on the lower metallic mold 12b of a sealing metallic mold 12. When the face of a sealing sheet 6 on the base side of the inner lead part 1 is depressed on the sealing metallic mold face, and a resin sealing is executed by sealing resin, a vacuum-sucking device 13 formed in the lower metallic mold 12b maintains a state, where the sealing sheet 6 is vacuum-sucked and it is uniformly smoothed. Thus, the occurrence of the cease in the sealing sheet 6, owing to thermal shrinkage at the time of resin sealing can be prevented. Thus, the resin part at the back of the semiconductor device which is resin- formed is made flat.