公开(公告)号：JPH04207064A

公开(公告)日：1992-07-29

申请号：JP34046890

申请日：1990-11-30

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/50 ,  H05K3/34

Abstract: PURPOSE:To enhance solder joint strength dramatically by providing a recessed part on the top of a lead section which is soldered with a packaging substrate. CONSTITUTION:A recessed part 5 is formed on the top of a lead section 2 where the lead section 2 is soldered with a packaging substrate 3 on the bottom, the side and the recessed part 5. This construction makes it possible to enhance the solder joint strength dramatically. For example, if a 0.3mm wide lead is adopted, about 600 grams will be available for the solder joint strength in the prior art case. However, in the embodiment case, 1500 grams will be available. More specifically, when the packaging substrate is soldered with the lead section where a recessed part is formed on the top of the lead section to be solder- jointed with the packaging substrate in structure, a solder-bridge is generated on the recessed part installed on the top of the lead section and this solder- bridge acts so that the lead may be fixed from above, which makes it possible to enhance the solder joint strength dramatically.

公开(公告)号：JPH04192448A

公开(公告)日：1992-07-10

申请号：JP32465290

申请日：1990-11-26

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/50

Abstract: PURPOSE:To miniaturize inner leads and to prevent deformation of outer leads in the case of bending the outer leads by forming the inner leads by etching and forming the outer leads by pressing. CONSTITUTION:Inner leads 1 in a dump bar 3 are formed by etching, and external outer leads 2 including the bar 3 are formed by pressing. Thus, the inner leads can be miniaturized, and deformation of the outer leads in the case of bending the outer leads can be prevented.

公开(公告)号：JPH03229449A

公开(公告)日：1991-10-11

申请号：JP2543290

申请日：1990-02-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/50 ,  H05K3/30 ,  H05K3/34

Abstract: PURPOSE:To rapidly and accurately effect positioning work of relating and mounting an outer lead to a mounting board with foot print by providing protrusions protruding downward of the lowermost part of the outer lead on the side surface of a package for a surface mount type semiconductor at least at two positions of the same. CONSTITUTION:A package 6 for semiconductor includes a protrusion 1 protruded at two opposite corners. The protrusion 1 is shaped into square, circular, and triangular ones, etc. Further, the protrusion 1 is formed simultaneously with an outer lead 2 of the semiconductor package 6 as the latter is formed. This is particularly effective for ensuring a relative positional relationship therebetween. The protrusion 1 is protruded below the lowermost end of the outer lead 2. A recessed part 5 is provided in a mounting board 4 at the same position as in the protrusion 1, and the protrusion 1 is inserted into the recessed part 5. Hereby, rapid and accurate positioning is achieved.

公开(公告)号：JPH02154455A

公开(公告)日：1990-06-13

申请号：JP30803588

申请日：1988-12-06

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/28 ,  H01L23/50

Abstract: PURPOSE:To prevent voids in a resin mold by disposing a plurality or recessed grooves for venting air on the surface of a dam bar of a lead frame for a semiconductor device. CONSTITUTION:A plurality of recessed grooves 4 for venting air are formed on a plurality of places of a dam bar 3. The shape of the recessed grooves 4 is not limited to a rectangular shape, but may be elliptic or in the form of the letter V. The width of the recessed grooves 4 can be set to 0.8mm, the depth to about 30mum, and the number of places to about 10. Thus, voids in a resin mold can be prevented.

公开(公告)号：JPH02144950A

公开(公告)日：1990-06-04

申请号：JP29986488

申请日：1988-11-28

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/28 ,  H01L23/50

Abstract: PURPOSE:To prevent a gate runner from being chipped off by a method wherein a hole or a cut-out groove is formed in a resin-molding gate runner formation region of a lead frame. CONSTITUTION:A hole 2 is formed in a resin gate runner formation region 1 at a lead frame. A cut-out groove 5 can be formed instead of the hole 2. Each shape of the hole 2 and the cut-out groove 5 may be square, circular, oval or the like. It is enough that each width of the hole 2 and the cut-out groove 5 is by 0.05 to 0.1mm narrower than a width of a resin gate runner on both sides.

公开(公告)号：JP2507053B2

公开(公告)日：1996-06-12

申请号：JP15186489

申请日：1989-06-14

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/50

公开(公告)号：JPH05326815A

公开(公告)日：1993-12-10

申请号：JP13218592

申请日：1992-05-25

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/28 ,  H01L23/50

Abstract: PURPOSE:To provide the lead frame for a semiconductor device generating no package cracks by sudden heating in a reflow process when the semiconductor is packaged. CONSTITUTION:Notches 4 are formed on the circumference of a die pad 1 formed almost in rectangular shape. As a result, even when stress is concentrated on the circumference of the die pad 1 by the evaporative expansion of the moisture accumulated on the backside of the die pad 1, the stress can be alleviated by the abovementioned notches 4, and the generation of cracks on the package can also be prevented.

公开(公告)号：JPH03218055A

公开(公告)日：1991-09-25

申请号：JP1415390

申请日：1990-01-23

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/28

Abstract: PURPOSE:To perform the taping process effectively by a method wherein one surface of a sealed semiconductor package is mirror-finished capable of performing laser marking process while the other surface is satin-finished. CONSTITUTION:One surface of an SO type resin sealed semiconductor package is subjected to mirror-finish capable of performing laser marking process. On the other hand, the other surface is satin-finished with the surface roughness within the range of 2-25mum, for example. Through these procedures, the conventional defect of the title resin sealed semiconductor package where the package surface is not easily adhered to a tape and falling down can be obviated.

公开(公告)号：JPS63153850A

公开(公告)日：1988-06-27

申请号：JP30099086

申请日：1986-12-17

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： KONISHI SATOSHI

IPC: H01L23/28 ,  H01L23/50

Abstract: PURPOSE:To prevent any deformation of leads due to external force from occurring without enlarging a package compared with conventional ones and without reducing the mounting space, by a method wherein plural recessions are made on the side of a package at specified intervals to insert parts near pulling-out parts of plural leads puled out of the side of package into respective recessions. CONSTITUTION:Plural recessions 2 are made on the side of a package 1 made of resin at specified intervals to insert parts near pulling out parts of plural leads 3 pulled out of the side of package 21 into respective recessions 2 for bending respective leads 3. The gap of around 0.01-0.1mm between the side of leads 3 and the side of recessions 2 is recommended. In such a constitution, even if the ends of leads 3 are subjected to any bending moment, respective stress can be absorbed by both sides 2a of recession 2 to prevent any deformation of leads 3 from occurring.

公开(公告)号：JPH1174440A

公开(公告)日：1999-03-16

申请号：JP7371198

申请日：1998-03-23

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： NANO MASANORI ,  KONISHI SATOSHI ,  MORISHITA YOSHIHIKO ,  YAMADA YUICHIRO ,  ITO FUMITO

IPC: H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To realize high reliability and a thin configuration, by maintaining adhesion between a lead frame and sealing, and making it possible to provide stable connection between a metal fine line and an inner lead part. SOLUTION: When a device is constituted by providing a semiconductor element 12 which is mounted on a support part 11 of a lead frame, a metal fine line 14 which connects the electrode of this semiconductor element 12 and an inner lead part 13 of the lead frame, and sealing resin 15, the above described lead frame is upset and processed so that the support part 11 is located at the upper side from the inner lead part 13. Therefore, the sealing resin 15 having the thickness by the amount of the step difference of the upset is present at the lower side of the supporting part 11, and the adhesion between the above described lead frame and one sealing resin 15 can be improved. Furthermore, since at least one groove part is provided in the surface of the inner lead part 13, the anchor effect with the sealing resin 15, stress applied on a product lead part, and stress to the metal fine line 14 can be alleviated. Lead peeling and the peeling of the metal fine line can be prevented.