公开(公告)号：JP2000036556A

公开(公告)日：2000-02-02

申请号：JP20239698

申请日：1998-07-17

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI ,  SAKAGUCHI SHIGEKI

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide the manufacture of a semiconductor device capable of reducing the diepad shift in resin molding step also avoiding the exposure of a chip, a wire and a diepad, etc., or the disconnection of the wire. SOLUTION: A chip 2 is packaged on a diepad 1 supported by hanging leads 7, 8, 9, 10 on lead frames 4 and the chip 2 and the lead frames 4 after being wire-bonded are resin-molded and then the needless parts of the leadframes 4 are cut off before packaging a semiconductor. In such a constitution, a sealing resin 6 is injected in the whole body in the abutting state of the recessions 7a, 8a, 9a, 10a provided on the hanging leads 7-10 against a resin sealing metallic mold so as to reduce the diepad shift in the resin molding step.

公开(公告)号：JPH04247640A

公开(公告)日：1992-09-03

申请号：JP1332291

申请日：1991-02-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MATSUSHIMA HIROSHI ,  SUIZU SATOSHI ,  MORIKAWA TAKESHI

IPC: H01L21/301 ,  H01L21/00 ,  H01L21/58 ,  H01L21/68

Abstract: PURPOSE:To bond semiconductor chips uniformly and accurately, in the manufacture of the semiconductor device, which has a process of bonding semiconductor chips on to the die-pads of lead frames with an adhesive. CONSTITUTION:Prior to the division of a semiconductor wafer into semiconductor chips by dicing, a sheet-shaped adhesive 2 is stuck all over the rear of the semiconductor wafer 1, and then the semiconductor wafer and the sheet- shaped adhesive are divided at the same time by dicing so as to get semiconductor chips 5. By bonding these semiconductor chips directly to the die-pads, those can be bonded accurately and uniformly.

公开(公告)号：JPH11186485A

公开(公告)日：1999-07-09

申请号：JP35042097

申请日：1997-12-19

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI ,  KAMETAKA MAKOTO

IPC: H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent exposure of its chip, die pad, etc., disconnection of the wires, and formation of voids in a resin resulting from shifting of the die pad. SOLUTION: A semiconductor device is provided with a die pad 1, a chip 2 mounted on the die pad 1, and leads 4. The device is also provided with wires 5 which electrically connect pads 3 of the chip 2 to the leads 4, hanging leads 7, 8, 9, and 10 which are protruded outward from the four corners of the die pad 1, and a sealing resin 6 covering the die pad 1, the chip 2, the wires 5, and the leads 7, 8, 9, and 10 in a state where the leads 4 are protruded outward. The paired hanging leads 7 and 8 respectively have upward projecting sections 7a and 8a which are brought into contact with the top sealing mold to control the upward movement of the die pad 1, and the other paired hanging leads 9 and 10 respectively have downward projecting sections 9a and 10a which are brought into contact with the bottom sealing mold to control the downward movement of the die pad 1.

公开(公告)号：JPH10189830A

公开(公告)日：1998-07-21

申请号：JP2233797

申请日：1997-02-05

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OKUMURA ICHIRO ,  NANO MASANORI ,  KOUTOU NORIO ,  MORIKAWA TAKESHI ,  FUKUDA TOSHIYUKI ,  ITO FUMITO

IPC: H01L23/28 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device and its manufacturing method having high reliability, while realizing the thinning process not only the conventional type one with its both sides simply resin-sealed. SOLUTION: Another sealing resin 15a is provided beneath a die pad 11 due to stepped parts 17 formed by upsetting process of hanging leads 10 of a lead frame 9, so that a thin-type but substantially both side sealing-type semiconductor device may be provided with both side sealing structure for securing the reliability thereof. Furthermore, outer lead parts 16 to be outer terminals are substantially on the same surface of the sides of the sealing resins 15 not to be protruded from the conventional sealing resins, thereby enabling the deformation, etc., of the outer leads 16 to be avoided for realizing the surface packaged type semiconductor device.

公开(公告)号：JPH03241765A

公开(公告)日：1991-10-28

申请号：JP3730090

申请日：1990-02-20

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI

IPC: H01L23/28

Abstract: PURPOSE:To reduce the thickness and weight of a package and obtain the flatness of a lead part and facilitate outer lead bonding by a method wherein the package is formed by single-sided resin molding. CONSTITUTION:A copper foil bonded to an insulator 1 composed of a polyimide tape is patterned to form a die-pad 7, inner leads 5 and outer leads 6 and a flexible board is composed. The Al pads of a semiconductor chip 2 bonded to me die-pad 7 with Ag paste are connected to the inner leads 5 with Au wires 4. A resin-molded package 3 is provided only on the surface on which the semiconductor chip 2 is mounted. Windows are formed in the insulator 1 around the package 3 and the copper foil is depressed into the windows to draw out electrodes from the lower surface of the flexible board. With this constitution, the thickness of the package can be reduced while a wire loop height and the thickness of the chip are maintained as it is and, further, the leads are flat and outer lead bonding is easy to perform.

公开(公告)号：JPH05121618A

公开(公告)日：1993-05-18

申请号：JP28105991

申请日：1991-10-28

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI

IPC: H01L23/50

Abstract: PURPOSE:To eliminate the tie bar cutting step without changing the sealing step for avoiding the development of defective lead skew and coplanarity by a method wherein the tie bar is eliminated from the title lead frame to be substituted with a printed solder resist. CONSTITUTION:A tie bar is substituted with a solder resist 4 printed on the position of the tie bar. At this time, the solder resist 4 is printed outside the position of the molded sealing resin on outer leads 5 to be connected with one another. The solder resist 4 is to be structured for fixing the resin during the resin sealing step. The tie bar cutting step can be naturally eliminated when the tie bar is eliminated. Through these procedures, the shock produced by the tie bar cutting step can be avoided thereby enabling the development of defective lead skew and coplanarity to be avoided for enhancing the reliability upon the title lead frame.

公开(公告)号：JPH03209748A

公开(公告)日：1991-09-12

申请号：JP527290

申请日：1990-01-11

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI

IPC: H01L23/28

Abstract: PURPOSE:To realize a thin and light weight semiconductor element by resin- molding the surface on which the semiconductor element is mounted, and not resing-molding the surface on which the semiconductor element is not mounted. CONSTITUTION:Each electrode of a semiconductor element 2 and an inner lead 5 are connected by using a metal wire 4. Since the inner lead 5 and an outer lead 6 have electric conduction, each electrode of the semiconductor element 2 is electrically connected with an external electric circuit board, by connecting the outer leads 6 with the external electric circuit board. A metal mold for molding an electric connection body of resin is so arranged that the lower surface side of a flexible printed board protrudes and the upper surface side becomes flat. After that epoxy resin or the like is injected in the inside of the frame body and cured. By removing the metal mold, resin mold exists only on the surface on which the semiconductor element is mounted.

公开(公告)号：JPH03151216A

公开(公告)日：1991-06-27

申请号：JP29164989

申请日：1989-11-09

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI

IPC: H01L21/56 ,  B29C45/02 ,  B29L31/34

Abstract: PURPOSE:To prevent generation of a void within a resin package, by a method wherein a gas vent hole communicating with the inside of a pot is provided into the upper part of a raw material resin feed pot. CONSTITUTION:A gas vent hole 11 communicating with the inside of a pot 5 is provided in the upper part of a raw material resin feed pot 5. A position of a gas vent hole 11 is good if it is located at an upper position of such an extent that molten resin does not come into contact with that and it is provided a little upper than, for example, a height of the pellet 4. Therefore, various gas such as air possessed by or brought in by the resin pellet 4 or insert gas such as nitrogen gas to be used as purge gas or cracked gas generated at a melting time of resin is vented. With this construction, generation of a void within a resin package is prevented.

公开(公告)号：JPH0351111A

公开(公告)日：1991-03-05

申请号：JP18650389

申请日：1989-07-19

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： MORIKAWA TAKESHI

IPC: H01L21/56 ,  B29C45/02

Abstract: PURPOSE:To prevent the occurrence of voids in the inner part of a resin package by providing a resin reservoir communicating with a cavity on a lower mold. CONSTITUTION:A resin reservoir 11 is provided on a lower mold 2 communicating with the cavity of a resin sealing apparatus by a method of transfer mold type multiplunger. Thus, the voids generated in the side of an air vent 8 of the cavity can be released to the outside of a package via the resin reservoir 11. Whereby the occurrence of voids in the inner part of the resin package molded in the inner part of the cavity 3 can be prevented, therefore, the occurrence of corrosion or package cracks on the chip surface can be prevented as well.

公开(公告)号：JPH1116930A

公开(公告)日：1999-01-22

申请号：JP17139697

申请日：1997-06-27

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： OIDA SHIGEJI ,  YAMAGUCHI YUKIO ,  SUEMATSU NOBUHIRO ,  MORIKAWA TAKESHI ,  YAMADA YUICHIRO

IPC: B29C33/18 ,  B29C45/02 ,  B29C70/72 ,  B29L31/34 ,  H01L21/56 ,  H01L21/68 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent the occurrence of the crease of a sealing sheet due to thermal shrinkage and to control the depth of a groove formed on the side of the inner lead part of a resin-sealed semiconductor device, namely, the quantity of the sealing sheet inserted into the side of the inner lead part by thermal shrinkage, at the time of resin sealing. SOLUTION: A lead frame to which a semiconductor element 2 is bonded is installed on the lower metallic mold 12b of a sealing metallic mold 12. When the face of a sealing sheet 6 on the base side of the inner lead part 1 is depressed on the sealing metallic mold face, and a resin sealing is executed by sealing resin, a vacuum-sucking device 13 formed in the lower metallic mold 12b maintains a state, where the sealing sheet 6 is vacuum-sucked and it is uniformly smoothed. Thus, the occurrence of the cease in the sealing sheet 6, owing to thermal shrinkage at the time of resin sealing can be prevented. Thus, the resin part at the back of the semiconductor device which is resin- formed is made flat.