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公开(公告)号:FR2817629A1
公开(公告)日:2002-06-07
申请号:FR0015625
申请日:2000-12-01
Applicant: MEMSCAP
Inventor: HELIN PHILIPPE , BOUROUINA TARIK , REYNE GILBERT , HOULET LIONEL , FUJITA HIROYUKI
Abstract: The invention concerns a method for making an optical switch (1) comprising: an alignment structure (2) comprising several grooves (3, 4) produced on the surface (10) of a silicon-on-insulator substrate (9), each groove (3, 4) being designed to receive an optical fibre adapted to emit a light beam; a reflecting structure (6) adapted to move between two positions, namely: a reflecting position, wherein the reflecting structure (6) is designed to redirect the optical beam derived from a first optical fibre (45) towards a second optical fibre (46); a transmitting position, wherein the reflecting structure (6) is designed to enable the beam (45) of the first optical fibre (45) to continue its propagation in its initial direction. The invention is characterised in that it comprises two successive etching steps, namely: a step which consists in dry anisotropic etching of the substrate to define the general shape (17) of the reflecting structure (6); a subsequent wet etching step which enables both to define the final shape of the reflecting structure (6) and to define an alignment structure (2); an etching step carried out on the surface of the substrate opposite the reflecting structure, enabling to define the shape of deformable zones connecting the reflecting structure to the rest of the substrate; a final step which consists in eliminating the silicon dioxide layer enabling to release the reflecting structure.
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公开(公告)号:AU2003246799A1
公开(公告)日:2003-10-20
申请号:AU2003246799
申请日:2003-04-09
Applicant: MEMSCAP
Inventor: HELIN PHILIPPE , DELPOUX ARNAUD
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公开(公告)号:FR2838526A1
公开(公告)日:2003-10-17
申请号:FR0204512
申请日:2002-04-11
Applicant: MEMSCAP
Inventor: KHALIL DIAA , MADKOUR KAREEM , SAADANY BASSAM , BADRELDIN TAREK , HELIN PHILIPPE
Abstract: A set of mirrors (5,13) is arranged on a bottom substrate wafer (2) which is covered with a top substrate wafer (20). Several channels (38) are formed between protruding zones (34) present under the wafer (20). The protruding zones comprise housings (33) inside which the mirrors are movable. An Independent claim is also included for optical switching matrix fabrication method.
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公开(公告)号:FR2859035A1
公开(公告)日:2005-02-25
申请号:FR0350449
申请日:2003-08-22
Applicant: MEMSCAP
Inventor: HELIN PHILIPPE , RANSCH PASCAL
Abstract: The device (1) has multiple patterns (2-4, 12-14) engraved on an upper face (5) of a substrate in semiconductor material e.g. silicon. The patterns have a square shape and are arranged in matrix to represent information. The patterns have variable depths that have distinct values to represent additional information. The patterns are formed by folding frustums of a pyramid. Independent claims are also included for the following: (a) an article integrating a marking device (b) a marking detection device for analyzing a marking device.
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公开(公告)号:FR2838527A1
公开(公告)日:2003-10-17
申请号:FR0204514
申请日:2002-04-11
Applicant: MEMSCAP
Inventor: SAAD ELDIN TAMER , SAADANY BASSAM , KHALIL DIAA , HELIN PHILIPPE
Abstract: The matrix comprises a set of cells each having a reflecting structure (12,14) so that it can reflect a beam issued from one side (20) of the matrix in the direction of an adjacent side. The reflecting structures have different orientations within the matrix, and each reflecting structure is orientated in parallel to the bisector (11) of a corner (16) of the matrix nearer the relevant mirror. The matrix is designed to accommodate a set of input fibres and a set of output fibres, for functioning as an optical mixer, that is an optical cross connect (OXC). The matrix is designed so to accommodate two sets of input fibres and two sets of output fibres, for functioning as an extraction/insertion multiplexer, that is an odd-drop multiplexer (ADM). The matrix comprises four rows and four columns, and 16 differently orientated mirrors in groups. The four mirrors situated near the corner (16) are parallel to the bisector (11), and the orientations of other mirrors are determined with respect to the bisectors of other corners, that is the common bisector (11) of corners (16,17) and the common bisector (12) of corners (18,19). Two input fibres (E1, E2) are placed on the side (20) and the other two input fibres (E3, E4) are placed on the opposite side (21). Two output fibres (S1, S2) are placed on the side (22), and the other two output fibres (S3, S4) are placed on the opposite side. The matrix has a symmetry with respect to the midpoint (25). In the case of a beam (28) the optical path is substantially equal to 3 times the step (p) of each cell, and for a beam (29) it is substantially equal to 5 times the step (p). The difference between the maximum and the minimum optical paths is 2 times the step, compared to the value of 6 for the prior art matrix.
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公开(公告)号:CA2394108A1
公开(公告)日:2003-01-31
申请号:CA2394108
申请日:2002-07-18
Applicant: MEMSCAP
Inventor: HELIN PHILIPPE
Abstract: Procédé de fabrication d'un composant optique microélectromécanique (1), réalisé à partir d'un de substrat de silicium, comprenant : .cndot. des guides de propagation optique (2-5); .cndot. une paroi mobile (6) par rapport aux guides de propagation (2-5); .cndot. un actionneur électrostatique (10) associé à des moyens de rappel formés par au moins une poutre (15, 16), apte à provoquer le déplacement de la paro i mobile (6) par rapport au reste du substrat Conformément à l'invention, .cndot. le substrat utilisé est en silicium monocristallin dont les plans cristallographiques (111) sont parallèles au plan du substrat ; .cndot..cndot. le procédé comporte une première série d'étapes de gravure ionique réactive profonde pendant lesquelles, sont définies, avec des valeurs différentes, le s hauteurs de la paroi mobile (6), des électrodes de l'actionneur (11, 12), et des poutres ( 15, 16) des moyens de rappel de l'actionneur; .cndot. le procédé comporte une seconde étape de gravure humide, permettant de libérer la paroi mobile (6), les électrodes (11, 12) et les poutres (15, 16) du reste du substrat.
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公开(公告)号:AU2207702A
公开(公告)日:2002-06-11
申请号:AU2207702
申请日:2001-11-29
Applicant: MEMSCAP
Inventor: HELIN PHILIPPE , BOUROUINA TARIK , REYNE GILBERT , HOULET LIONEL , FUJITA HIROYUKI
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