公开(公告)号：JPS61226995A

公开(公告)日：1986-10-08

申请号：JP6665685

申请日：1985-04-01

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  SHIBUYA TAKEFUMI ,  SUZUKI SHOZO ,  YAMAGUCHI TERUHIRO ,  OOTA MASAHIRO

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03

公开(公告)号：JPS5887175A

公开(公告)日：1983-05-24

申请号：JP18553281

申请日：1981-11-20

Applicant: MITSUI TOATSU CHEMICALS

Inventor： FUSEYA YOSHIROU ,  ITOU ISAO ,  MORITA MORIJI

IPC: B32B5/18 ,  B32B7/12 ,  C09J163/00

Abstract: PURPOSE:To provide the titled adhesive which has excellent resistance to water and heat and does not cause environmental pollution, containing a specified vinyl polymer emulsion, an alkali metal compd. and a compd. contg. at least two epoxy groups. CONSTITUTION:An adhesive for urethane foam contains 100pts.wt. (on a solid basis) vinyl polymer emulsion (A) contg. 1-20wt% unsaturated acid monomer unit such as (meth)acrylic acid, e.g. a methyl methacrylate/butyl methacrylate copolymer emulsion, 0.4-10pts.wt. alkali metal compd. (B) such as Na2CO3, and 2-40pts.wt. compd. (C) contg. at least two epoxy groups per molecule, such as sorbitol polyglycidyl ether. There is no fear of causing environmental pollution or any troubles on labor hygiene due to solvents. This adhesive has excellent bonding performance such as resistance to heat and water without deteriorating hand or cushioning properties of adherends, and hence it is useful as an adhesive for furnishings, building materials and interior automotive trim which require good quality.

公开(公告)号：JPH07235626A

公开(公告)日：1995-09-05

申请号：JP32290594

申请日：1994-12-26

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KUDO SHOEI ,  MORITA MORIJI ,  KOBA SHIGEO

IPC: C09J7/02 ,  C09J179/08 ,  H01L23/50

Abstract: PURPOSE:To prevent adhesive agent which is used for bonding the inner lead of a lead frame to a heat dissipating plate from contaminating an adherend by a method wherein an auxiliary layer of polyimide resin high in elastic modulus is formed on the surface of the heat dissipating plate which is bonded to the inner lead frame, and a hot-melt adhesive layer of specific polyimide resin is formed thereon. CONSTITUTION:A lead frame provided with a heat dissipating plate is formed through such a manner that an inner lead frame is bonded to a metal heat dissipating plate 11 through the intermediary of an adhesive layer 12. The adhesive layer 12 is a composite layer composed of an auxiliary layer 121 provided to the surface of the heat dissipating plate 11 which is bonded to the inner lead frame and a hot-melt adhesive layer 122 laminated on the auxiliary layer 121. The auxiliary layer 121 is formed of polyimide resin high in elastic modulus, and the adhesive layer 122 is formed of thermoplastic polyimide resin which is lower in elastic modulus than that used in the layer 121 by 1X10 dyne/ cm .

公开(公告)号：JPH0422954B2

公开(公告)日：1992-04-20

申请号：JP12608283

申请日：1983-07-13

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KITAMURA TADASHI ,  WATANABE KATSUSHI ,  MORITA MORIJI ,  KOBAYASHI HIROTAKA

IPC: C08G59/00 ,  C08G59/40 ,  C08L63/00 ,  C08L67/00 ,  C09J163/00 ,  C09J167/00 ,  C09J167/02

公开(公告)号：JPH0336047B2

公开(公告)日：1991-05-30

申请号：JP20188184

申请日：1984-09-28

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KOIKE HIROYUKI ,  MORITA MORIJI ,  YAMAGUCHI TERUHIRO

IPC: D06M11/00 ,  C08G59/00 ,  C08G59/20 ,  C08G59/50 ,  C08K3/22 ,  C08L21/00 ,  C08L63/00 ,  C09D163/00 ,  C09J163/00 ,  D06M11/47 ,  D06M13/02 ,  D06M13/322 ,  D06M13/325 ,  D06M13/335 ,  D06M15/55 ,  D06M15/693 ,  D21H19/24 ,  D21H27/30

公开(公告)号：JPH02131934A

公开(公告)日：1990-05-21

申请号：JP28571788

申请日：1988-11-14

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  YOSHIDA SHUNJI ,  TANABE KENJI

IPC: B32B15/08 ,  H05K1/03 ,  H05K3/38

Abstract: PURPOSE:To extremely reduce wrinkles, uneven part, etc., by forming a heat resistant polymer film layer and a circuit of a copper foil on at least one side surface of the film layer, and setting the difference of the thermal expansion coefficients between the film layer and a cover material when the material is formed to a specific value or less. CONSTITUTION:A heat resistant polymer film to become a base on a copper foil for forming a circuit is formed of heat resistant polymer having an imide bond and/or heat resistant polymer having heterocycle except the imide bond. The polymer having the imide bond includes, for example, polyimide, polyamideimide, polyhydantoin, polyparabanic acid, polyoxazinedion, etc., and the polymer having the heterocycle includes, for example, polybenzoimidazole, polyimidazopyrrolon, triazine derivatives, etc. The foil is processed by a method such as etching, etc., to form a circuit, and a cover film layer made of heat resistant polymer having 1.5X10 deg.C or less of the difference of thermal expansion coefficients between a base and the polymer at temperatures from ambient temperature to 150 deg.C is formed. The polymer of the base and heat resistant polymer having satisfactory adhesive are employed as the cover materials. In case of molding, a heating step is always employed.

公开(公告)号：JPH02131933A

公开(公告)日：1990-05-21

申请号：JP28571888

申请日：1988-11-14

Applicant: MITSUI TOATSU CHEMICALS

Inventor： MORITA MORIJI ,  YOSHIDA SHUNJI ,  TANABE KENJI

IPC: B32B15/08 ,  B32B15/088 ,  H05K1/03

Abstract: PURPOSE:To extremely reduce wrinkles, shrinkage, uneven part, etc., generated after solder dipping in a flexible metal foil laminated board having a heat resistant polymer film layer and a metal foil layer on at least one side surface of the film layer by setting the thermal shrinkage factor of the film layer to a specific value or less. CONSTITUTION:A heat resistant polymer film layer is formed of heat resistant polymer having an imide bond and/or heat resistant polymer having heterocycle except the imide bond. The polymer having the imide bond includes, for example, polyimide, polyamideimide, polyhydantion, polyparabanic acid, polyoxaszinedion, etc., and the polymer having the heterocycle includes, for example, polybenzoimidazole, polyimidazopyrrolon, triazine derivatives, etc. The thermal shrinkage factor of the film layer at 260 deg.C of a solder bath is 0.1% or less. The polymer is formed on the metal foil, the foil is coated with the polymer in a state dissolved in solvent or in a state that the precursor of the polymer is dissolved in solvent.

公开(公告)号：JPH01320134A

公开(公告)日：1989-12-26

申请号：JP15358288

申请日：1988-06-23

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YOSHIDA SHUNJI ,  MORITA MORIJI ,  SATO TAKUSHI ,  NAITO MITSUSACHI

IPC: B29C53/16 ,  B29C53/18 ,  B29L9/00 ,  B32B27/00

Abstract: PURPOSE:To facilitate the handling of a laminate by a method wherein the radius of curvature of curling is made to be larger than the specified value by causing shrink plastic deformation on a part of a curled polymeric laminate produced by laminating two layers or more of polymer. CONSTITUTION:The correction concerned is to make the radius of curvature or curling more than and equal to 10cm by causing shrink plastic deformation on a part of a curled polymeric laminate. The curled polymeric laminate 45 is subject to either or both of a process, which consists of the longitudinal sliding of the laminate under tension over the curved surface of a bar 42, which is provided at an angle of 0-80 degrees to the width direction of the laminate and the radius of curvature of which is not less than 0.001mm and less than 25mm under the condition that the curled outside of the laminate faces the inside of the curved surface, and a process, which consists of the longitudinal sliding of the laminate under tension over the curved surface of a bar 43, which is provided at an angle of 0-80 degrees to the width direction of the laminate and the radius of curvature of which is not less than 0.001mm and less than 25mm under the condition that the curled outside of the laminate faces the inside of the curved surface, once or more. The turning-up angle of the laminate 45 is 20-179 degrees and the tension applied to the laminate 45 is not less than 20g/cm . The correction is done under the condition that the temperature of the laminate is kept at a temperature not higher than the glass transition temperature of the polymer.

公开(公告)号：JPS6482940A

公开(公告)日：1989-03-28

申请号：JP23886787

申请日：1987-09-25

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMANAKA HIDESUKE ,  SATO TAKUSHI ,  MORITA MORIJI ,  NAITO MITSUSACHI ,  YOSHIDA SHUNJI

IPC: H05K3/22 ,  B32B15/08 ,  B32B43/00

Abstract: PURPOSE:To permit uniform and easy correction without producing any wrinkle, by a method wherein rotary guide rollers are provided near a blade edge in parallel to the same when the interlaminar difference in dimension or the curl of a flexible laminated sheet of metal and plastic (FMCL) is corrected. CONSTITUTION:The title device is provided with a means for advancing and passing a FMCL under a tension, and a blade 3, intersecting at an angle between +80 deg. and -80 deg. with respect to the widthwise direction of the FMCL and in contact with a layer having a larger size or a curled outside layer. A difference in dimension or a curl is corrected by passing the layer, having a difference in dimension between a metallic foil layer and a plastic layer, the layer of curled FMCL, which is provided with a larger size, or the curled outside layer through the edge 4 of the blade 3 under a tension while bringing it in contact with the edge 4. In this case, the FMCL, before and/or after passing through the blade 3, is pushed by rotary guide rollers 2, 5, provided near the blade edge 4 is parallel to the same, from the side of the layer, having a smaller size, or the curled inside layer.

公开(公告)号：JPS6482939A

公开(公告)日：1989-03-28

申请号：JP23886587

申请日：1987-09-25

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMANAKA HIDESUKE ,  SATO TAKUSHI ,  MORITA MORIJI ,  NAITO MITSUSACHI ,  SHISHIDO SHIGEYUKI

IPC: H05K3/22 ,  B32B15/08 ,  B32B43/00

Abstract: PURPOSE:To permit uniform and easy correction without producing any wrinkle, by a method wherein a guide is provided near a blade edge in parallel to the same when the interlaminar difference in dimension or the curl of a flexible laminated sheet of metal and plastic (FMCL) is corrected. CONSTITUTION:An interlaminar difference in dimension or a curl is corrected by passing a layer having a larger size, which is provided with the difference in dimension between a metallic foil layer and a plastic layer or intersecting with an angle between +80 deg. and -80 deg. with respect to the widthwise direction of a FMCL 1, or a curled outside layer through the edge 4 of a blade 3 under a tension while bringing it in contact with the edge 4. In this case, the FMCL before and/or after passing through the blade 3, is pushed by guides 2, 5, provided near the blade edge 4 in parallel to the same, from the side of the layer having a smaller size or the curled inside layer.