-
公开(公告)号:HK1000745A1
公开(公告)日:1998-04-24
申请号:HK97102303
申请日:1997-12-01
Applicant: MOTOROLA INC
Inventor: DAVIES ROBERT B , JOHNSEN ROBERT J , ROBB FRANCINE Y
IPC: H01L29/78 , H01L21/74 , H01L29/10 , H01L29/417 , H01L
Abstract: A semiconductor device having a low source inductance are fabricated by having a maximum of two sources each in contact with a region which makes contact to a substrate or back side of the device. The back side source contact also allows the device to be mounted directly to a grounded heatsink.
-
公开(公告)号:SG44601A1
公开(公告)日:1997-12-19
申请号:SG1996003547
申请日:1992-09-14
Applicant: MOTOROLA INC
Inventor: BOLAND BERNARD W , DAVIES ROBERT B , SANDERS PAUL W
IPC: H01L21/762 , H01L21/763 , H01L29/78 , H01L27/06
Abstract: A technique for improving the frequency response of a semiconductor device employing silicon as the semiconductor material. Parasitic components inherent in semiconductor devices degrade the performance of these devices at higher frequencies. Typically, a parasitic capacitor includes a dielectric material sandwiched between a conductive interconnect (31A, 31B) and a substrate (10) or a bottom contact (18). Further, in the past, the thickness of this dielectric material has been similar to that of the third dielectric material (17) of the present invention. However, in the present invention the effective thickness of the dielectric material has been increased by including a first and second dielectric material (15, 16) as well as the third dielectric material (17). Increasing the thickness of the dielectric of a parasitic capacitor decreases the value of the parasitic capacitance; and therefore increases the cut-off frequency of the semiconductor device.
-
公开(公告)号:DE69122844D1
公开(公告)日:1996-11-28
申请号:DE69122844
申请日:1991-11-14
Applicant: MOTOROLA INC
Inventor: DAVIES ROBERT B , HAYES LLOYD H , HEMINGER DAVID M , MIETUS DAVID FRANCIS
Abstract: A current source (52) with adjustable temperature compensation in which the level of current supplied to a load (51) is adjusted to compensate for the load's inherent change in performance with changes in temperature. The current source (52) allows selection of the appropriate temperature compensating characteristic and operating current solely by altering internal component values.
-
公开(公告)号:DE69208297T2
公开(公告)日:1996-09-05
申请号:DE69208297
申请日:1992-07-13
Applicant: MOTOROLA INC
Inventor: CAMBOU BERTRAND F , DAVIES ROBERT B
IPC: H01L21/285 , H01L21/338 , H01L29/10 , H01L29/812
Abstract: A semiconductor device having a channel region having a first and a second portion (13a, 13b). The first and second portions of the channel region (13a, 13b) are designed so that only a small portion is substantially depleted during operation. Thus, a semiconductor device having a short gate length is fabricated.
-
公开(公告)号:DE69232199T2
公开(公告)日:2002-06-06
申请号:DE69232199
申请日:1992-09-14
Applicant: MOTOROLA INC
Inventor: BOLAND BERNARD W , DAVIES ROBERT B , SANDERS PAUL W
IPC: H01L21/762 , H01L21/763 , H01L29/78 , H01L21/331 , H01L21/336 , H01L27/06
Abstract: A technique for improving the frequency response of a semiconductor device employing silicon as the semiconductor material. Parasitic components inherent in semiconductor devices degrade the performance of these devices at higher frequencies. Typically, a parasitic capacitor includes a dielectric material sandwiched between a conductive interconnect (31A, 31B) and a substrate (10) or a bottom contact (18). Further, in the past, the thickness of this dielectric material has been similar to that of the third dielectric material (17) of the present invention. However, in the present invention the effective thickness of the dielectric material has been increased by including a first and second dielectric material (15, 16) as well as the third dielectric material (17). Increasing the thickness of the dielectric of a parasitic capacitor decreases the value of the parasitic capacitance; and therefore increases the cut-off frequency of the semiconductor device.
-
公开(公告)号:DE69619177D1
公开(公告)日:2002-03-21
申请号:DE69619177
申请日:1996-08-22
Applicant: MOTOROLA INC
Inventor: DOW DIANN M , DAVIES ROBERT B , WILD ANDREAS A , ILDEREM VIDA
IPC: H01L21/336 , H01L21/8234 , H01L29/10 , H01L29/78
Abstract: A method for forming a graded-channel field effect transistor includes providing a substrate (10) with an overlying gate electrode (14, 16). A spacer (23) is formed on only the drain side of the electrode. A graded-channel region (36) is formed aligned to the source side of the electrode while the spacer protects the drain side of the channel region. Source/drain regions (38) are formed, the spacer is removed, and then a drain extension region (40) is formed aligned to the drain side of the electrode.
-
17.
公开(公告)号:AU4074599A
公开(公告)日:2000-07-12
申请号:AU4074599
申请日:1999-05-11
Applicant: MOTOROLA INC
Inventor: DAVIES ROBERT B , WILD ANDREAS A
IPC: H01L21/331 , H01L21/336 , H01L21/8222 , H01L21/8238 , H01L21/8248 , H01L21/8249 , H01L27/06 , H01L27/092 , H01L29/732 , H01L29/78
Abstract: A semiconductor component includes an asymmetric transistor having two lightly doped drain regions (1300, 1701), a channel region (1702), a source region (1916) located within the channel region (1702), a drain region located outside the channel region (1702), a dielectric structure (1404) located over at least one of the two lightly doped drain regions (1300, 1701), two gate electrodes (1902, 1903) located at opposite sides of the dielectric structure (1404), a drain electrode (1901) overlying the drain region (1915), and a source electrode (1904) overlying the source region (1916). The semiconductor component also includes another transistor having an emitter electrode (122) located between a base electrode (121) and a collector electrode (123) where the base electrode (121) is formed over a dielectric structure (1405).
-
18.
公开(公告)号:SG67359A1
公开(公告)日:1999-09-21
申请号:SG1996010444
申请日:1996-08-13
Applicant: MOTOROLA INC
Inventor: DOW DIANN M , DAVIES ROBERT B , WILD ANDREAS A , ILDEREM VIDA
IPC: H01L21/336 , H01L21/8234 , H01L29/10 , H01L29/78 , H01L21/265
Abstract: A method for forming a unilateral, graded-channel field effect transistor and a transistor stock 200 that includes providing a substrate (10) with an overlying gate electrode (14, 16). A spacer (23) is formed on only the drain side of the electrode. A graded-channel region (36) is formed aligned to the source side of the electrode while the spacer protects the drain side of the channel region. Source/drain regions (38) are formed, the spacer is removed, and then a drain extension region (40) is formed aligned to the drain side of the electrode.
-
公开(公告)号:DE69122844T2
公开(公告)日:1997-04-30
申请号:DE69122844
申请日:1991-11-14
Applicant: MOTOROLA INC
Inventor: DAVIES ROBERT B , HAYES LLOYD H , HEMINGER DAVID M , MIETUS DAVID FRANCIS
Abstract: A current source (52) with adjustable temperature compensation in which the level of current supplied to a load (51) is adjusted to compensate for the load's inherent change in performance with changes in temperature. The current source (52) allows selection of the appropriate temperature compensating characteristic and operating current solely by altering internal component values.
-
公开(公告)号:FR2522433A1
公开(公告)日:1983-09-02
申请号:FR8300702
申请日:1983-01-18
Applicant: MOTOROLA INC
Inventor: DAVIES ROBERT B , DOTSON ROBERT N , MILLER IRA
Abstract: A sense amplifier which is fully integrated has an on-chip voltage regulator to provide essentially error free operation. The sense amplifier provides peak-to-peak signal detection for comparison to a threshold voltage by a comparator. The output of the comparator is coupled to an RS flip-flop. The output of the RS flip-flop is coupled to a D flip-flop. The use of an RS flip-flop as well as a D flip-flop eliminates clocking problems caused by skewing and keeps a stored detected signal from changing prematurely.
-
-
-
-
-
-
-
-
-