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    SAMPLE COLLECTION DEVICE AND SAMPLE COLLECTION DEVICE ARRAY
    11.
    发明申请
    SAMPLE COLLECTION DEVICE AND SAMPLE COLLECTION DEVICE ARRAY 有权
    样品收集装置和样品收集装置阵列

    公开(公告)号：US20160377513A1

    公开(公告)日：2016-12-29

    申请号：US15073667

    申请日：2016-03-18

    Applicant: BIO MATERIALS ANALYSIS TECHNOLOGY INC.

    Inventor： Pin Chang ,  Hung-Jen Chen

    IPC: G01N1/28 ,  H01J37/26 ,  H01J37/32 ,  H01J37/20

    CPC classification number: G01N1/2813 ,  H01J37/20 ,  H01J37/26 ,  H01J37/32009

    Abstract: A sample collective device includes two substrates and a spacer. Each substrate has a first surface and a second surface, and the two substrates are arranged with the first surfaces facing each other. The spacer is disposed between the two first surfaces for bonding and fixing the two substrates and forming a sample containing space. In addition, each of the substrates includes a first weakening structure located in the periphery of the sample containing space and exposed on the first surface. A sample collective device array including a plurality of the aforementioned sample collective devices is also provided.

    Abstract translation: 样本集体装置包括两个基板和间隔件。 每个基板具有第一表面和第二表面，并且两个基板被布置成使得第一表面彼此面对。 间隔件设置在两个第一表面之间，用于粘合和固定两个基底并形成样品容纳空间。 此外，每个基板包括位于样品容纳空间的周边并暴露在第一表面上的第一弱化结构。 还提供了包括多个上述样本集合装置的样本集合装置阵列。

    Physical analysis method, sample for physical analysis and preparing method thereof
    13.
    发明授权
    Physical analysis method, sample for physical analysis and preparing method thereof 有权

    公开(公告)号：US11955312B2

    公开(公告)日：2024-04-09

    申请号：US17560460

    申请日：2021-12-23

    Applicant: Materials Analysis Technology Inc.

    Inventor： Chien-Wei Wu ,  Keng-Chieh Chu ,  Yung-Sheng Fang ,  Chun-Wei Wu ,  Hung-Jen Chen

    IPC: H01J37/317 ,  H01J37/20

    CPC classification number: H01J37/3178 ,  H01J37/20

    Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

    CURVE ALIGNMENT METHOD AND CURVE ALIGNMENT APPARATUS
    15.
    发明公开
    CURVE ALIGNMENT METHOD AND CURVE ALIGNMENT APPARATUS 审中-公开

    公开(公告)号：US20230326000A1

    公开(公告)日：2023-10-12

    申请号：US17857172

    申请日：2022-07-05

    Applicant: Materials Analysis Technology Inc.

    Inventor： Hsiang-Yu Tsou ,  Hung-Jen Chen

    IPC: G06T7/00

    CPC classification number: G06T7/0002 ,  G06T2207/10061 ,  G06T2207/20096

    Abstract: A curve alignment method and apparatus are provided. In the method, data obtained by at least one equipment analyzing a test sample is retrieved to generate test curves. In response to an alignment operation of directing a first point around a first curve to a second point around a second curve among the test curves, a correspondence between features corresponding to the first and second points is recorded, and correspondences of alignment operations are collected as feature data. Data obtained by the equipment analyzing a current sample is retrieved to generate current curves, and a third point matching the first feature on a third curve and a fourth point matching the second feature on a fourth curve are searched according to the correspondences. At least one of the third curve and the fourth curve is adjusted to align the third point with the fourth point.

    Sample collection device and manufacturing method thereof
    16.
    发明授权
    Sample collection device and manufacturing method thereof 有权

    公开(公告)号：US10379075B2

    公开(公告)日：2019-08-13

    申请号：US15173731

    申请日：2016-06-06

    Applicant: Materials Analysis Technology Inc.

    Inventor： Pin Chang ,  Hung-Jen Chen

    IPC: G01N27/27 ,  B01L3/00 ,  C25D17/00 ,  G01N27/447 ,  H01J37/20 ,  C25D21/12

    Abstract: A sample collection device includes two substrates and a spacer. The two substrates are disposed oppositely. Each substrate has a first surface, a second surface opposing to the first surface, a first recess and at least one second recess. The two substrates are arranged with the first surfaces facing each other, and the first and second recesses are respectively located on each first surface. The first recesses of the substrates jointly form a first channel, and the second recesses of the substrates jointly form a second channel connected to the outside of the sample collection device. The first channel and the second channel are interconnected. The spacer is disposed between the two first surfaces for bonding and fixing the two substrates. A sample containing space is formed between the two substrates and the spacer. The sample containing space includes the first chancel and the second channel. In addition, a manufacturing method of the sample collection device is also provided.

    Manufacturing method of embedded sample block and sample sheet
    17.
    发明授权
    Manufacturing method of embedded sample block and sample sheet 有权

    公开(公告)号：US09835530B1

    公开(公告)日：2017-12-05

    申请号：US15331917

    申请日：2016-10-24

    Applicant: BIO MATERIALS ANALYSIS TECHNOLOGY INC.

    Inventor： Hung-Jen Chen

    IPC: G01N1/36 ,  H01J37/26

    CPC classification number: G01N1/36 ,  G01N2001/364 ,  G01N2001/366 ,  H01J37/26

    Abstract: A manufacturing method of an embedded sample block includes providing a carrier. The carrier has a sample accommodating area and a marking area. The sample accommodating area has a first groove and the marking area has second grooves. A sample is disposed in the first groove and a molding plate standing around the carrier is formed. The molding plate surrounds the sample accommodating area and the marking area and forms an opening exposing the sample, the first groove and the second grove. A molding material is formed inside the opening, such that the molding material covers the sample and is filled into the first and second grooves. The molding material is solidified and the molding plate is removed to obtain the embedded sample block. In addition, a sample sheet sliced from the embedded sample block is also mentioned.

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